Toshiba Memory America, Inc. announced the launch of a new family of SLC NAND flash memory products for embedded applications. Compatible with the widely used Serial Peripheral Interface (SPI), Toshiba Memory’s second-generation Serial Interface NAND can be used in a wide range of consumer and industrial applications that require high-speed data transfers, including flat screen TVs, […]
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Bluetooth 5.0-compliant ICs address long-range communications applications
Toshiba America Electronic Components, Inc. (TAEC) announced that it has added two new devices to its lineup of ICs that are compliant with the Bluetooth low energy standard. The new TC35680FSG (featuring built-in flash memory) and TC35681FSG are well-suited to applications requiring long-range communication, including beacon tags, IoT devices and industrial equipment. Sample shipments will begin later […]
ESD protection diodes target mobile device interfaces
Toshiba America Electronic Components, Inc. (TAEC) has introduced a new bidirectional electrostatic discharge (ESD) protection diode for semiconductor devices used in mobile device interfaces. The DF2B7ASL utilizes snapback characteristics, providing low dynamic resistance and superior protective performance to safeguard against static electricity and noise. Housed in an ultra-compact package (0.32×0.62mm), the DF2B7ASL is designed for applications […]
3D flash memory boosts die capacity
Toshiba America Electronic Components, Inc. (TAEC) announced the latest generation of its BiCS FLASHTM three-dimensional (3D) flash memory1. The newest BiCS FLASH device features 4-bit-per-cell, quadruple-level cell (QLC) technology and is the first2 3D flash memory device to do so. Toshiba’s QLC technology enables larger (768 gigabit) die capacity than the company’s third-generation 512Gb 3-bit-per-cell, triple-level cell (TLC), and […]
e-MMC, UFS embedded memories integrate NAND flash and controller chip in one package
Toshiba America Electronic Components, Inc.(TAEC) has enhanced its lineup of managed NAND devices with the addition of new Embedded Multimedia Card (e–MMC) and Universal Flash Storage (UFS) embedded memory solutions. Featuring enhanced integrated controller technologies, the new ‘Supreme+’ e–MMC (JEDEC ver. 5.1) and UFS (JEDEC ver. 2.1) offerings deliver significant read and write speed improvements to […]