Osram Opto Semiconductors announced a new multi-junction Vertical Cavity Surface Emitting Laser (VCSEL) to debut at Photonics West. The 550 aperture PowerBoost VCSEL improves power conversion efficiency up to 60 percent and enhances optical power. Osram’s PowerBoost VCSEL technology offers faster and more efficient rise and fall times, enabling short pulse lengths, something critical in Time-of-Flight […]
COM express compact computer-on-module employs AMD Ryzen embedded V2000 processor
Congatec introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module is setting a new performance per watt benchmark, which finds its sweetest spot in 15 Watt TDP designs[1]. This extraordinary low power platform performance […]
RISC-V development tools certified for functional safety use
IAR Systems announces the availability of a certified edition of its development toolchain for RISC-V. The functional safety edition of IAR Embedded Workbench for RISC-V is certified by TÜV SÜD according to the requirements of IEC 61508, the international umbrella standard for functional safety, as well as ISO 26262, which is used for automotive safety-related […]
SMARC modules incorporate i.MX 8M Plus processor for AI, embedded vision processing
Congatec presents its brand new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision, and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra-low-power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for situational awareness, […]
Low-power conversational AI chips support Google hot words
Syntiant Corp. announced that it supports Ok Google and Hey Google hot words with the Syntiant NDP120 Neural Decision Processor (NDP). Using the ultra-low-power Syntiant Core 2 tensor processor, the NDP120 can activate the Google Assistant at under 280uW (microwatts) power consumption with the hot words, “Hey Google” or “Ok Google.” The advanced artificial intelligence built into […]
Computer-on-module HPC board features 11th gen Intel core processor
Congatec presents a brand new COM-HPC starter set at embedded world 2021 DIGITAL. Ideal for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0, and up to ultra-fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel […]
Oscillators for LVPECL, LVDS feature low current consumption
Battery-powered, wireless communication products require not only a high data rate but low current consumption to reduce power loss. Suntsu is introducing a new set of oscillators, the SLO series, to meet these market demands and with the lowest current consumption and unmatchable phase noise performance. The SLO Series oscillator is designed with fundamental and third […]
Five, six-junction vertical-cavity surface-emitting laser arrays target consumer, automotive LiDAR, 3D sensing apps
Lumentum Holdings Inc. announced new high-power and high-efficiency five and six junctions vertical-cavity surface-emitting laser (VCSEL) arrays for advanced consumer, automotive LiDAR, and other 3D sensing applications. The use of LiDAR and 3D sensing is expanding into new applications in the consumer electronics, automotive, and industrial markets. New applications and new functionality are driving the need for higher […]
Optimized 32-bit MCU targets IoT edge applications
Silicon Labs announced the launch of the EFM32PG22 (PG22) 32-bit microcontroller unit (MCU), a low-cost, high-performance solution with an industry-leading combination of energy efficiency, performance, and security. With easy-to-use, cost-efficient analog capabilities, the PG22 MCU is ideally suited for the rapid development of consumer and industrial applications with demanding size constraints and low-power operation requirements. […]
Automotive Wi-Fi 6E modules connect in-vehicle infotainment systems
LG Innotek announced on March 2nd that it has developed the world’s first automotive Wi-Fi 6E module with next-generation Wi-Fi technology. Automotive Wi-Fi 6E modules are near-field wireless communication components connecting in-vehicle infotainment (IVI) systems, which control driving information and multimedia content, to internal smart devices and external routers. With the next-generation Wi-Fi 6E (6th […]
