Renesas Electronics Corporation expanded its popular ZMOD4410 Indoor Air Quality (IAQ) sensor platform with the industry’s first software-configurable IP67-qualified waterproof option for IAQ applications operating in wet or dirty environments such as kitchens, bathrooms, and hospital rooms, where they are frequently exposed to water, oils, and dust. The firmware-configurable waterproof ZMOD4410 sensor features a unique hermetically sealed package […]
tactical grade, force-rebalance SMD MEMS accelerometer includes digital interface
TDK Corporation announces the release of Tronics AXO315, a miniature high-performance 1-axis closed-loop MEMS accelerometer with a 24-bit digital SPI interface and SMD package that reaches quartz sensors performances, outperforms commercial MEMS sensors, and eases integration. The new force-rebalance accelerometer delivers an excellent one-year composite bias repeatability of 1 mg and composite scale factor repeatability […]
Software platform handles edge AI development, deployment, management tasks
Blaize fully unveiled the Blaize AI Studio offering, the industry’s first open and code-free software platform to span the complete edge AI operational workflow from idea to development, deployment, and management. AI Studio dramatically reduces edge AI application deployment complexity, time, and cost by breaking the barriers within existing application development and machine learning operations […]
Utilities speed software development on complex MCU cores
Renesas Electronics Corporation announced the release of IP Utilities – a new series of solutions aimed at simplifying the development of devices incorporating Renesas intellectual property (IP). The new IP Utilities include application packages and evaluation kits, as well as expanding Renesas’ growing portfolio of leading-edge IP licenses. With the emergence of CPUs based on […]
Open-source IoT middleware platform improves data tagging, customized editing features
EdgeX Foundry announced the “Hanoi” release that makes IoT deployment easier and the launch of new ecosystem resources. Launched in April 2017, and now part of the LF Edge umbrella, EdgeX Foundry is an open-source, loosely-coupled microservices framework that provides the choice to plug and play from a growing ecosystem of available third-party offerings or to augment proprietary […]
Prototyping system holds up to 8 FPGAs
S2C announces a new class of FPGA prototyping products, the S2C Prodigy Logic Matrix family. Logic Matrix is architected from the ground up to meet today’s needs for both large design scaling and performance. Conventional FPGA prototyping systems typically host up to four FPGAs per system targeting single system deployment or limited expansion, whereas emulators […]
New IDE linker program shrinks executable code by 15%
SEGGER’s Embedded Studio for RISC-V now comes with the SEGGER Linker in addition to the GNU linker. The SEGGER Linker has been developed from the ground up to create executables for Embedded Systems. For RISC-V, it shrinks the size of the resulting programs by up to 15%, shortens link time, delivers a detailed map file, […]
FPGAs augment NICs for cloud data center uses
Inventec (2356.TW), in collaboration with Intel, announces the release of the new Inventec FPGA SmartNIC C5020X that complements the Intel FPGA SmartNIC C5000X platform architecture. Inventec is one of Intel’s first ecosystem partners to leverage this platform. The FPGA SmartNIC C5020X works to extend traditional Network Interface Controllers (NICs) beyond its existing restrictions for the […]
IoT module hosts LTE-optimized transceiver, SIM card, includes data plan
Sequans Communications S.A. introduced an LTE IoT module that offers device makers a quick and easy solution for connecting their IoT devices to the Orange LTE-M Network. The Monarch GMS01Q module, a third-generation module from the Orange Live Booster program, is based on Sequans’ industry-leading Monarch LTE-M/NB-IoT chip platform and includes an LTE-optimized transceiver and […]
Open standard module release defines postage-stamp-sized computer PCBs
SGET e.V. announces release 1.0 of the new OSM Computer-on-Module standard. OSM, which is short for Open Standard Module, defines one of the first standards for directly solderable and scalable embedded computer modules. It also marks a new milestone in the miniaturization of modular COM/carrier designs, replacing credit card-sized modules with postage-stamp-sized ones. The new […]