Semtech Corporation announced sampling of a new solution (GN2255), Semtech’s Tri-Edge CDR to enable emerging 50Gbps PAM4 5G front haul deployments. Based on the proven Tri-Edge CDR platform qualified in data center applications, the new solution delivers the cost-effectiveness, small footprint, low power, ultra-low latency, and performance demanded by 5G front haul applications. The […]
SBCs carry i.MX RT1176 MCUs, target secure mission-critical apps
Avnet is enhancing the launch of NXP Semiconductor’s i.MX RT1170 crossover MCU family with the MaaXBoard RT, a low-cost single-board computer that can be used as a development board or as a versatile building block for integration into original equipment manufacturer (OEM) custom systems. Advanced security features of the NXP i.MX RT1176 MCU, plus additional […]
Super-low-power arm cortex-M33 core MCUs feature advanced cybersecurity, graphics, peripherals
STMicroelectronics has announced a new generation of extreme power-saving microcontrollers (MCUs), the STM32U5* series, to meet the most demanding power/performance requirements for smart applications including wearables, personal medical devices, home automation, and industrial sensors. The industry-leading STM32 MCUs, built upon the highly energy-efficient Arm Cortex-M processors, are already in billions of domestic appliances, industrial controls, […]
Field area network module connects up to 1,000 mesh nodes
ROHM Semiconductor announced its new BP35C5 Wi-SUN FAN (Field Area Network) compatible module solution capable of connecting with up to 1000 nodes in mesh networks for infrastructure applications. Wi-SUN FAN, the latest Wi-SUN international wireless communication standard, eliminates the communication costs associated with conventional LPWA. At the same time, Wi-SUN ensures superior reliability through multi-hop networks […]
SoC power-aware emulation verifies power workloads for multi-billion gate designs
Synopsys, Inc. announced the immediate availability of ZeBu Empower emulation system, delivering breakthrough technology for fast hardware-software power verification of multi-billion gate SoC designs. The performance of ZeBu Empower enables multiple iterations per day with actionable power profiling in the context of the full design and its software workload. With ZeBu Empower, software and hardware designers can utilize the […]
Embedded PCs feature fanless motherboards hosting Intel MCUs
Review Display Systems Inc. has announced the availability of a new range of Mini-STX PCs. The CAT-S PC range includes the Jaguar, Cheetah, Tiger, and Puma, which are ideal for a wide range of embedded computing applications and offer a wide range of performance and customization options. All four models in the CAT-S line-up feature […]
Free sensor dataset for ADAS/AV R&D includes full-waveform data from flash LiDAR sensors
LeddarTech announces its first publicly available sensor dataset for advanced driver assistance and autonomous driving research and development called the Leddar PixSet. This dataset is the first of its kind in the industry to include full-waveform data from LeddarTech’s Leddar Pixell, a 3D solid-state flash LiDAR sensor. LeddarTech will offer these datasets free of charge for academic and […]
High-performance GPU supports two 250-W high-end graphics cards
Cincoze has announced its new flagship GPU edge computing system, the GP-3000. Its crowning feature is an exclusive GPU Expansion Box that provides expansion for up to two high-end GPU graphics cards and creating a high-performance industrial-grade GPU computer. The GP-3000’s extreme computing power starts with an 8th or 9th generation Intel Xeon or Core […]
Low-power NB2 chipset includes ARM Cortex-M4 MCU
Sony Semiconductor Israel announced the launch of the Altair ALT1255, a new low-power NB2 chipset. The ALT1255 is 5G ready, designed with an integrated SIM (iSIM), user MCU, rich application layer, and GSM/GPRS fallback modem. The ALT1255 chipset empowers device manufacturers to develop low-power, cost-sensitive connected devices at a global scale to monitor, manage, and […]
3D flash memory features low read latency, fast I/O
Kioxia Corporation and Western Digital Corp. announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilizing a wide range of technology and manufacturing innovations. This sixth-generation […]
