To reduce the risk of fires in the kitchen and also floods in the laundry room, European IEC 60730 and U.S. UL 60730 Class B specifications require safety mechanisms in home appliances, such as ovens, cooktops, washing machines, and clothes dryers. Helping designers meet these functional safety requirements in touch screen enabled appliances, Microchip Technology […]
Software speeds development of IEEE 1588 system integration
Silicon Labs announced a new complete solution designed to simplify the implementation of IEEE 1588 in communications, smart grid, financial trading, and industrial applications. Silicon Labs’ ClockBuilder Pro software enables designers to accelerate the development of IEEE 1588 system integration by combining PTP profile selection, PTP network configuration, and physical-layer clock/port configuration in a single, […]
Curved, side-mounted capacitive sensor optimized for mobile devices
Fingerprint Cards AB announces the launch of a new, slim and curved capacitive touch sensor for biometric authentication. Following the success of the FPC1540 sensor, the uniquely curved FPC1542 sensor is set to enable innovation in the latest borderless smartphone designs. As demand for side-mounted touch sensors grows, the curved sensor offers OEMs enhanced design […]
Software tools help build Linux-based environments for Renesas RX MCUs
IAR Systems adds support for Renesas RX microcontrollers (MCUs) in build tools supporting implementation in Linux-based frameworks for automated application build and test processes. This addition further extends IAR Systems’ offering for flexible automated workflows. Modern industrial applications are smarter, more feature-rich, and more complex than ever before. This drives a need in making the […]
SMARC-standard carrier board hosts latest Intel Atom processors
DATA MODUL is expanding its carrier board portfolio in the embedded sector, bringing a universally applicable carrier board onto the market in the form of the eDM-CB-SM-IPCS. The new board is compatible with Intel’s latest Atom x6000E, Celeron, and Pentium (“Elkhart Lake”) processor platforms, as well as with future x86 generations and ARM platforms. Furthermore, […]
Wi-Fi 6E MIMO antenna system optimized for IoT access points
The Antenna Company announced a new Wi-Fi 6E MIMO antenna system designed to increase network capacity, extend the range, and reduce latency in enterprise and industrial IoT networks. The antenna system enables simultaneous operation in the 2.4, 5, and 6 GHz frequency bands, resulting in an additional 1.2 GHz of the spectrum and a greater […]
SMARC board speeds development of HMI, AI IoT face/object detection, image processing
Renesas Electronics Corporation introduced a scalable System-on-Module (SoM) Smart Mobility ARChitecture (SMARC) Winning Combination board solution comprised of 10 Renesas ICs, including a microprocessor (MPU), power and analog ICs. The board solution speeds the development of artificial intelligence (AI) IoT face/object detection, image processing, and 4K video playback applications, including surveillance cameras, inspection equipment, and […]
IC supports in-vehicle network security via secure boot, firmware update, message authentication
Due to the rise of in-vehicle network connections like Bluetooth and LTE/5G, today’s vehicles host more vulnerabilities than ever before, driving new cybersecurity regulations and specifications for the automotive market. Helping OEMs and their module suppliers simplify the upgrade of existing designs to meet security requirements for future generations, Microchip Technology Inc. announced its CryptoAutomotive security […]
Modules sport 11th Gen Intel Core processors for outdoor/in-vehicle apps
Congatec introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments. The value package includes […]
COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]
