5G and AIoT need more speed and more capacity, and PCIe 4.0 delivers, doubling the speed of PCIe 3.0 and providing the much-needed performance boost to keep pace with innovation and industry trends. Not only speed and capacity, but tolerance of wide-range temperature is also crucial. Consumer-grade products aren’t tough enough to withstand the high […]
5G
Protocol analyzer test UniPro and UFS3.0 flash memory designs
Prodigy Technovations Pvt. Ltd introduces its PGY-UFS4.0-PA M-PHYSM, UniPro, UFS4.0 Protocol Analyzer for development and validation of next-generation flash memory UFS 4.0 at 23.2 Gbps per lane interface for 5G, Mobile, Automotive, IoT, AR/VR applications. PGY-UFS4.0-PA is the leading instrument that enables the design and test engineers to test the UniPro and UFS3.0 designs for […]
Chipset for tablets, portable notebooks integrates octa-core CPU architecture
MediaTek announced its new Kompanio 900T chipset, expanding MediaTek’s portfolio of mobile computing solutions for tablets, portable notebooks, and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch of Kompanio 1300T, which is designed for premium tablets. MediaTek’s Kompanio platform combines powerful computing capabilities and ultra-low power consumption with the company’s advanced technologies […]
Compact 1.6T Ethernet PHY enables routers, switches, and line cards to double bandwidth
Routers, switches, and line cards need higher bandwidth, port density, and up to 800 Gigabit Ethernet (GbE) connectivity to handle escalating data center traffic driven by 5G, cloud services, and Artificial Intelligence (AI) and Machine Learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the […]
MEMS challenges – and silicone solutions
by Jayden Cho, Manabu Sutoh, and Roderick Chen, Dow The market for microelectromechanical system (MEMS) devices is growing, especially in the automotive industry. However, designers of these devices face engineering, manufacturing, and application challenges. For example, traditional organic adhesives may not be able to withstand the higher temperatures associated with today’s electronics, especially in 5G […]
AIoT platform carries Intel 10th-Ge Xeon W and Core i7/i5/i3 processors
ASRock Industrial Computer is releasing the new iEPF-9000S Series/ iEP-9000E Series Ruggedized Edge AIoT Platform powered by Intel 10th Generation Xeon W and Core i7/i5/i3 Processors (Comet Lake) with W480E, Q470E, and H420E chipsets for supreme performance, flexible integration, and reliable durability at the Edge. Featuring workload consolidation, the new Series provides supercomputing power, rich I/Os, […]
New 112-layer SSDs hit 8 TB capacity for U.2, 4 TB for M.2 formats
Innodisk announces its industrial-grade 112-Layer 3D TLC SSDs along with the world’s highest capacity up to 8TB. The 112-layer SSDs introduce a complete product line including the SATA 3TG6-P and 3TE7 series, as well as the PCIe Gen3x4 and Gen4x4 series. The new TLC SSD Series marks Innodisk’s continued development with 3D NAND design, bringing […]
Serial bus exerciser, protocol analyzer handle interface development tasks
Prodigy Technovations Pvt. Ltd introduces PGY-QSPI-EX-PD, PGY-SMI-EX-PD, PGY-SMBus-EX-PD, and PGY-JTAG-EX-PD. These serial bus Exercisers and Protocol Analyzers are for the development of interfaces for consumer, automotive, and 5G applications. PGY-EX-PD is a family of leading instruments that enables the design and test engineers to test the QSPI, SMI (MDIO), SM Bus, and JTAG designs for its specifications by configuring […]
Cloud-based platform speeds development of far-edge cloud compute, data analytics, AI/ML software
Wind River has introduced its latest release of Wind River Studio. Unique to the industry, Wind River Studio is a cloud-native platform for the development, deployment, operations, and servicing of mission-critical intelligent systems from devices to the cloud. It enables dramatic improvements in productivity, agility, and time-to-market, with seamless technology integration that includes far edge cloud computing, […]
Fanless computer targets railway industry
DFI has announced the RC300-CS high-reliability embedded system designed for the railway industry that requires reliable and high-performance AIoT edge computing. Railway has gradually stepped into the application areas of AIoT, such as autonomous driving, railway intrusion detection, and crowd flow analysis. In addition, the train is in a state of vibration for a long time, and the […]