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Artificial intelligence/ML

Next-gen DSP boosts AI and audio processing on power-limited SoCs

January 23, 2026 By Puja Mitra Leave a Comment

The Tensilica HiFi iQ DSP from Cadence is a sixth-generation audio and voice DSP IP based on a new architecture designed for AI-enhanced audio processing in edge devices. The DSP delivers higher compute density and energy efficiency than prior HiFi cores, with support for AI data types such as FP8 and BF16, enhanced vectorization and […]

Filed Under: Applications, Artificial intelligence/ML, Consumer Electronics Tagged With: cadence, DSP

What is an AI governor and how does it relate to physical AI?

January 21, 2026 By Jeff Shepard Leave a Comment

An AI governor is a framework, set of policies, or an oversight mechanism designed to ensure that the development and use of AI systems are ethical, safe, transparent, and compliant with legal and societal standards. The term can also refer to an actual piece of code or circuit (governor logic) used as a safety mechanism […]

Filed Under: AI Engineering Collective, Applications, Artificial intelligence/ML, FAQ, Featured Tagged With: FAQ, PAI

Entry-level AI MCU enables low-power edge inference on one chip

January 15, 2026 By Puja Mitra Leave a Comment

The NuMicro M55M1 AI MCU from Nuvoton Technology, developed in collaboration with the Industrial Technology Research Institute, integrates an Arm Cortex-M55 core with an Arm Ethos-U55 micro-NPU to deliver about 110 GOP/s for edge AI inference. The device includes up to 1.5 MB SRAM and 2 MB Flash with optional HyperRAM and HyperFlash expansion, enabling […]

Filed Under: AI Engineering Collective, Applications, Artificial intelligence/ML, microcontroller Tagged With: MCU, nuvoton

How is physical AI used in autonomous and electric vehicles?

January 14, 2026 By Jeff Shepard Leave a Comment

Physical AI (PAI) in autonomous and electric vehicles (EVs) involves systems that perceive the environment, make intelligent decisions, and execute appropriate actions in real-time, bridging the gap between digital intelligence and physical motion. PAI is autonomous, and electric vehicles can be used for several functions. Initially, it’s helping improve battery management and energy efficiency. In […]

Filed Under: AI Engineering Collective, Applications, Artificial intelligence/ML, Automotive, EV Engineering, FAQ, Featured Tagged With: EV, FAQ, PAI

Low-power LPDDR5X memory IP targets AI data centers

January 13, 2026 By Aimee Kalnoskas Leave a Comment

Cadence introduced an LPDDR5X memory IP system supporting data rates up to 9600 Mbps for enterprise and data center applications. The design combines LPDDR5X IP with symbol-based error correction to provide reliability comparable to DDR5 ECC while maintaining low power consumption and compact implementation. The subsystem supports 40-bit channels and sideband ECC to preserve bandwidth […]

Filed Under: Applications, Artificial intelligence/ML, Data centers, Storage

Embedded controller firmware adds authenticated boot and advanced power control

January 9, 2026 By Puja Mitra Leave a Comment

The MEC1723 embedded controller from Microchip Technology is paired with custom firmware to support system management in NVIDIA DGX Spark personal AI supercomputers, combining power sequencing and energy regulation with secure firmware authentication and ECC-P384-based cryptographic verification to establish a root of trust at boot. The firmware adds a DGX-specific packet-command host interface, plus EMI […]

Filed Under: Applications, Artificial intelligence/ML, Controllers Tagged With: embedded, Microchip Technology

COM Express module scales edge AI compute

January 7, 2026 By Puja Mitra Leave a Comment

The SOM-COMe-BT6-PTL from SECO is a COM Express Type 6 Basic module based on Intel Core Ultra Series 3 processors, combining hybrid CPU cores, an Intel NPU 5 delivering up to 50 TOPS and up to 180 platform TOPS for edge AI workloads. The module supports up to 128 GB DDR5 memory, PCIe Gen4 and […]

Filed Under: Applications, Artificial intelligence/ML, SoM Tagged With: AI, seco

Edge AI framework targets autonomous decisioning

January 7, 2026 By Puja Mitra Leave a Comment

The new eIQ Agentic AI Framework from NXP Semiconductors provides software for developing and deploying autonomous edge AI systems with agent-based decision making and real-time control. Integrated with NXP’s eIQ AI development tools and supporting i.MX 8 and i.MX 9 application processors and Ara neural processing units, the framework enables on-device, low-latency inference across multiple […]

Filed Under: Applications, Artificial intelligence/ML Tagged With: Edge AI, nxpsemiconductor

What are the applications of physical artificial intelligence?

January 7, 2026 By Jeff Shepard Leave a Comment

Physical artificial intelligence (PAI) enables machines to perceive, reason, and act within the real world, bridging the gap between digital AI (DAI), sometimes called virtual AI, and physical action. PAI often leverages spatial artificial intelligence (SAI) technology. PAI applications span numerous industries, from basic automation to autonomous vehicles and complex surgical procedures. PAI applications represent […]

Filed Under: AI Engineering Collective, Applications, Artificial intelligence/ML, FAQ, Featured Tagged With: FAQ, PAI

Multimodal AI workloads run on single processor

January 5, 2026 By Aimee Kalnoskas Leave a Comment

The MIPS S8200 is a RISC-V neural processing unit designed to run transformer-based and agentic AI models directly on autonomous edge platforms. Developed with a software-first architecture, it supports early model optimization on virtual platforms and targets embedded transportation, robotics, and mission-critical systems requiring multimodal AI processing. The device is sampling now, with silicon reference […]

Filed Under: Applications, Artificial intelligence/ML, Automotive, Robotics/Drones Tagged With: mips

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