To provide the highest level of protection, Infineon Technologies AG is launching the SLS37 V2X hardware security module (HSM), a plug-and-play security solution for vehicle-to-everything communication (V2X). The SLS37 V2X HSM is based on a highly secured, tamper-resistant microcontroller tailored to the security needs in V2X applications within telematics control units. It is protecting the […]
Automotive
GbE M12 X-coded I/O modules optimized for railways
The GbE M12 X-Coded CMI module for railways is compatible with two major Cincoze product lines: the DIAMOND Series rugged embedded computers (DS, DI, and DX series) and GOLD Series embedded GPU computers (GM and GP series). The new module is easy and convenient to install, stabilizes data transmission, and ensures a comprehensive safety overview […]
Updated MIPI I3C basic simplifies designs, boosts speed
The MIPI Alliance announced the first update to its publicly available, royalty-free, MIPI I3C Basic specification. Version 1.1.1 dramatically enhances the speed and flexibility of I3C Basic, simplifying the development of innovative designs for products such as smartphones, wearables, and systems in automobiles and server environments. As the successor to the legacy I2C interface, MIPI I3C/I3C Basic provides a […]
Protocol analyzer test UniPro and UFS3.0 flash memory designs
Prodigy Technovations Pvt. Ltd introduces its PGY-UFS4.0-PA M-PHYSM, UniPro, UFS4.0 Protocol Analyzer for development and validation of next-generation flash memory UFS 4.0 at 23.2 Gbps per lane interface for 5G, Mobile, Automotive, IoT, AR/VR applications. PGY-UFS4.0-PA is the leading instrument that enables the design and test engineers to test the UniPro and UFS3.0 designs for […]
Mission computer sports 6th gen Intel atom MCU for deterministic ethernet networking
Curtiss-Wright’s Defense Solutions has introduced a new ultra-rugged miniature mission computer that combines a low-power, quad-core 6th gen Intel Atom x6400E Series (Elkhart Lake) processor with support for real-time 802.1-based Time-Sensitive Networking (TSN) network connectivity. The ultra-small form factor (USFF) Parvus DuraCOR 313 mission computer is one of the industry’s first solutions for deploying a MIL-grade […]
DSP 128 & 256-bit IP designs feature low power consumption
To address the broader range of power, performance, and area (PPA) demands of embedded applications, Synopsys, Inc. announced it has expanded its DesignWare ARC Processor IP portfolio with new 128-bit ARC VPX2 and 256-bit ARC VPX3 DSP Processors. Based on the same VLIW/SIMD architecture as the company’s higher-performance 512-bit ARC VPX5 DSP processor, the new […]
Automotive HMI tools fully compatible with Android
Rightware introduced Kanzi One, the first and only automotive HMI toolchain to be fully compatible with Android. Delivering industry-leading 3D graphics, Kanzi One empowers automakers to create the ultimate user interface (UI) for the advanced intelligent automotive cockpit. Revealed at IAA Mobility 2021, Kanzi One lets manufacturers create future-looking user experiences for advanced HMIs in […]
Reference platform lets Android automotive OS run on hypervisors, SoCs
OpenSynergy introduced the company’s new automotive reference platform for virtual Android 11 (based on Trout). With technology from Google and Qualcomm Technologies, Inc., the reference platform features the integration of the Virtual I/O (VIRTIO) framework into Android Automotive OS, which allows Android to run on any hypervisor supporting the upcoming VIRTIO devices and any system […]
FPGAs optimized for infotainment, ADAS, safety system use
Lattice Semiconductor expanded its growing portfolio of automotive products with the announcement of versions of the Lattice Certus-NX FPGA family optimized for infotainment, advanced driver assistance systems (ADAS), and safety-focused applications. Built on the Lattice Nexus platform, these new Certus-NX devices combine automotive-grade features with best-in-class I/O density, power efficiency, small size, reliability, instant-on performance, and support for fast PCI Express (PCIe) […]
MEMS challenges – and silicone solutions
by Jayden Cho, Manabu Sutoh, and Roderick Chen, Dow The market for microelectromechanical system (MEMS) devices is growing, especially in the automotive industry. However, designers of these devices face engineering, manufacturing, and application challenges. For example, traditional organic adhesives may not be able to withstand the higher temperatures associated with today’s electronics, especially in 5G […]