Renesas Electronics Corporation introduced the newest device in its Automotive HD Link (AHL) portfolio that enables automotive manufacturers to deliver high-definition video over low-cost cables and connectors. The new RAA279974 4-channel AHL video decoder processes four input sources simultaneously, making it an economical solution for surround-view and multi-camera applications. Renesas’ AHL technology uses a modulated […]
Automotive
Scalable vector graphics added embedded graphics library
SEGGER introduces support for Scalable Vector Graphics (SVG) in emWin, providing developers with a powerful and efficient solution for rendering scalable and rotatable graphics in embedded applications. SVG is a vector-based image format written in XML. It is an open standard developed by the World Wide Web Consortium (W3C) and is supported by most web […]
Automotive AI domain controllers enable features to be added to autonomous and ADAS vehicle systems
Ambarella, Inc. announced during CES the latest additions to its CV3-AD family of automotive AI domain controllers—the CV3-AD635 and CV3-AD655 systems-on-chip (SoCs). The new CV3-AD635 supports a sensing suite that includes multiple cameras and radars to enable mainstream L2+ feature sets, such as highway autopilot and automated parking, in addition to meeting the GSR2 and NCAP […]
Software stack for autonomous and semi-autonomous driving
Ambarella, Inc. announced its autonomous driving (AD) software stack, which is primarily based on deep learning AI processing for all of its modular components, including environmental perception, sensor fusion and vehicle path planning. This leading-edge AD stack and Ambarella’s CV3-AD AI domain controller system-on-chip (SoC) family were designed in conjunction, so the stack runs optimally […]
Hardware-based RoT enables auto devices to meet automotive functional safety standard
Intrinsic ID released QuiddiKey 400, a hardware-based root-of-trust (RoT) solution for semiconductors in the automotive market that must meet stringent functional safety standards. QuiddiKey 400 has been developed following an ISO 26262 functional-safety-compliant flow and meets the ISO 26262 Automotive Safety Integrity Level (ASIL) B fault metric and ASIL D for systematics failures. It leverages […]
How does MISRA fit into automotive and industrial systems?
MISRA is a set of C and C++ coding standards developed by the Motor Industry Software Reliability Association (MISRA). Today it’s being maintained and expanded by the MISRA Consortium. MISRA has grown into a standard for embedded industries as well as automotive systems. For example, ISO 26262 Functional Safety – Road Vehicles cites MISRA C […]
ASIL D-certified communications framework for software-defined vehicles
Real-Time Innovations (RTI) announced RTI Connext Drive® 3.0: The flexible, future-proof, and data-centric communication framework for software-defined vehicles (SDVs). It expedites time to market by providing the first platform-independent adherence to the highest functional safety standard, ISO26262 ASIL D, and bridges the platform gap between DDS, AUTOSAR Classic, AUTOSAR Adaptive, and ROS 2. With Connext Drive […]
Security IC supports key sizes up to ECC P521, SHA512, RSA-4K, and AES256
As vehicles become more connected and technologically advanced, the need for heightened security measures also rises. New government and automotive OEM cybersecurity requirements are beginning to include larger key sizes and Edwards Curve ed25519 algorithm standards. In response, Microchip Technology has launched its latest TrustAnchor Security IC, the TA101, which can accommodate complex automotive and embedded security use […]
Why 3D packaging could be the next breakthrough for processing
By Brian Hendren, Tektronix As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To […]
Why advanced packaging is vital to the future of semiconductors
The cost and the physics of fitting more transistors in the space available are showing diminishing returns. The concept of “known good die” is much more difficult to quantify. For all the talk in the semiconductor industry about trying to reach 1.8 nm process nodes, advanced packaging and its impact on performance seems to be […]