The emergence of advanced driver assistance systems (ADAS) is changing how designers use and specify microcontrollers (MCUs), but it’s only one dimension of the changes occurring in the design of automotive systems (Figure 1). This FAQ will begin with the basics of AEC-Q100 requirements for automotive integrated circuits – those requirements are not going away […]
Automotive
Rugged AI platform enhances inference computing in data-driven embedded systems
The new Jetsys-5320 from Elma Electronic Inc. meets the growing data processing needs of extremely rugged and mobile embedded computing applications by easily handling data-intensive computation tasks. It provides complex GPGPU inference computing at the edge for deep learning (DL) and machine learning (ML) operations in artificial intelligence (AI) applications. Used for high-performance intelligent video analytics (IVA), […]
Ultra Temperature DDR4 DRAM module operates from -40 to 125 C
Innodisk has just released the first-of-its-kind Ultra Temperature DDR4 DRAM module that can operate from a chilling -40 degrees Celsius to a scorching 125 degrees Celsius. The Ultra Temperature format extends the standard industrial-grade maximum temperature. The series brings extra features to the table, opens the doors for new industrial applications, and passes multiple strict tests to prove its […]
Small inductors geared for Bias-T automotive circuits
Murata has announced the availability of the LQW43FT series, a new line of broadband inductors developed for the automotive market. The 1812 size is the world’s smallest inductor for Bias-T circuits that support an inductance range of 10 μH to 22 μH and a high current of 700 mA. It is ideal for vehicle-mounted Power […]
Automotive-qualified GNSS module is IMU-software combo
To support the positioning market with state-of-the-art GNSS chipset and modules, STMicroelectronics has introduced the Teseo-VIC3DA, the latest member of the Teseo module family. Teseo-VIC3DA combines ST’s high-performing Automotive Teseo III GNSS IC with the automotive 6-axis MEMS inertial measurement unit (IMU) and dead reckoning software to create a convenient, automotive-qualified navigation module. Leveraging ST’s in-house manufacturing […]
Tool suite works with open-source automation servers
LDRA announced a plug-in that brings the capabilities of the LDRA tool suite into the Jenkins automation server for continuous integration (CI) for agile software development. Jenkins automates and manages the build process and connects build and version control systems with quality management and automated testing processes for large-scale system-level software projects. LDRA has long […]
ISO 26262 functional safety packages accelerate development of DSC, MCU ASIL B/C safety level designs
Safety is a primary concern in automotive applications to ensure reliable operation and end users’ wellbeing. Microchip Technology Inc. is offering newly certified functional safety packages to enable engineers to develop their products as per the ISO 26262 functional safety standard. Microchip is announcing the release of ISO 26262 functional safety packages for dsPIC33C digital signal […]
Infineon garners 2021 LEAP Award in Embedded Computing
The first memory solution to combine security and functional safety in a single NOR Flash device has earned Infineon Infineon’s Semper Secure NOR Flash an Embedded Computing LEAP Award. LEAP Awards honor innovative products across 12 categories. More than 100 entrants were received for the annual competition which celebrates the most innovative and forward-thinking products […]
What does automotive qualification mean?
Automotive qualification means that a component or system meets specific industry standards for manufacturing and performance. Automotive qualification is not a static landscape. New standards are developed in response to new technologies, and existing standards evolve in response to changing applications and new mission profiles. This FAQ reviews and contrasts key international automotive standards such […]
Embedded platform hosts up to five AI accelerator modules
MicroSys Electronics announced its partnership with leading AI (Artificial Intelligence) chipmaker Hailo to launch its miriac AIP-LX2160A embedded platform hosting up to 5 integrated Hailo-8 AI accelerator modules. The new edge server-grade AI solution enables high-performance and scalable AI inference capabilities at the edge. The new, application-ready AI platform offers industries a high bandwidth and power-efficient solution at the […]
