Congatec has released aReady.IOT, a software package that extends its Computer-on-Module (COM) platform with IoT connectivity tools. The package implements OPCUA, MQTT, and REST protocols for machine-to-cloud communication, enabling data transfer between embedded systems and cloud services including AWS, Azure, and Telekom Cloud. The COM Manager component provides remote management capabilities for Computer-on-Modules, while the […]
Connectivity
Chip design framework shows 2-3x efficiency for AI processing
Arm has released the first public specification of its Chiplet System Architecture (CSA), a framework for standardizing chipset connectivity and system partitioning. The specification is now supported by more than 60 technology companies, including ADTechnology, Alphawave Semi, AMI, Cadence, Jaguar Micro, Kalray, Rebellions, Siemens, and Synopsys. The CSA framework enables designers to create reusable chipsets […]
Wi-Fi 7 module targets automotive designs
u-blox has launched its first automotive-grade Wi-Fi 7 module, enabling OEMs to enhance the user experience of in-vehicle infotainment and telematics. According to the TSR Wireless Connectivity Market Report 2024, the attach rate of Wi-Fi for in-vehicle infotainment and telematics control unit applications will increase sharply over the next five years. Wi-Fi 7 will be […]
What’s new with Matter: how Matter 1.4 is reshaping interoperability and energy management
Since its initial launch in 2022, Matter has led the charge on making smart homes smarter – allowing devices from different manufacturers and ecosystems, like Apple Home and Amazon Alexa, to communicate seamlessly. The open-source, IP-based protocol has become a key player in the push for device interoperability, aiming to create a reliable user experience […]
Die-to-die interconnect achieves 64 Gbps data rates with enhanced protocol support
Alphawave Semi introduces the industry’s first 64 Gbps Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP Subsystem to deliver unprecedented chipset interconnect data rates, setting a new standard for ultra-high-performance D2D connectivity solutions in the industry. The third generation, 64 Gbps IP Subsystem builds on the successes of the most recent Gen2 36 Gbps IP […]
IoT dev board adds GNSS and DECT NR + connectivity
Nordic Semiconductor launches its latest IoT prototyping platform, the Nordic Thingy:91 X, for LTE-M, NB-IoT, Wi-Fi SSID locationing, DECT NR+, and GNSS applications. The Thingy:91 X simplifies the IoT prototyping process for developers through its comprehensive suite of onboard features that streamline the development of cellular IoT applications and shorten time-to-market. Thingy:91 X is a […]
Teledyne e2V releases models for Arm-based space processor
Teledyne e2v announces engineering models of the LX2160-Space 16-core Arm Cortex A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications. LX2160-Space engineering models have the same fit/form/function as flight models (FMs). LX2160-Space can be used in many heavy computing applications in Space, from Earth Observation Satellites […]
500 MHz automotive microcontroller features post-quantum security
Infineon Technologies AG announced the launch of the AURIX TC4Dx microcontroller (MCU), the first member of the latest AURIX TC4x family. Based on 28nm technology, the AURIX TC4Dx offers increased performance and high-speed connectivity. It combines power and performance enhancements with the latest trends in virtualization, Artificial Intelligence, functional safety, cybersecurity, and networking functions paving […]
Edge computing MPU features post-quantum security
Microchip Technology has announced the PIC64HX family of microprocessors (MPUs). Unlike traditional MPUs, the PIC64HX is purpose-built to address the unique demands of intelligent edge designs. The latest in Microchip’s 64-bit portfolio, the PIC64HX is a high-performance, multicore 64-bit RISC-V MPU capable of advanced Artificial Intelligence and Machine Learning (AI/ML) processing and designed with integrated Time-Sensitive […]
Gateway brings industrial AI to network edge
NEXCOM subsidiary announces the availability of the NISE 54 Industrial Edge AI Gateway for high-performance edge gateway applications. Powered by Intel Atom Amston Lake or Alder Lake CPUs, the NISE 54 gateway supports up to 16GB of DDR5-4800MHz SO-DIMM memory with In-Band Error Correction Code (IBECC) capability, to boost multitasking performance, reliability, and safety. Applications […]
