Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data. Infineon Technologies AG has collaborated with software and 3D Time of Flight system specialist pmdtechnologies ag to develop the world’s smallest and at the same […]
Consumer Electronics
Software handles low-power motion-based gesture control/3D motion tracking/pointing for consumer handhelds
CEVA, Inc. introduced a new generation of its Hillcrest Labs sensor fusion product family, with the launch of the MotionEngine Air software. This production-ready solution delivers low power, motion-based gesture control, 3D motion tracking and pointing for consumer handheld devices in high volume markets, among which are smartphone and PC stylus pens, smart TV and […]
Security cryptocontroller targets contactless payment apps
Infineon Technologies AG new 40nm generation of security chip solutions – the SLC3x – is based on a design concept that provides performance and scalability for a vast array of smart card applications and beyond. Smart card manufacturers and payment solution providers will benefit from a family architecture based on the de-facto industry standard Arm. […]
First 3-W surface-mount, flip-chip, back-emitting VCSEL array needs no package submount/bond wires for mobile 3D sensing cameras
TriLumina announces the launch of the world’s first 3 W surface-mount, flip-chip, back-emitting VCSEL array without the need for a package submount or bond wires for mobile 3D sensing cameras. This new VCSEL-on-Board (VoB) technology enables higher performance, smaller size and lower costs, and simplifies time-of-flight (ToF) camera supply chains as compared to conventional VCSELs […]
Optical color sensor eliminates unwanted image artifacts in smartphone cameras
ams introduced the TCS3408 optical color sensor that enables smartphone world-facing cameras with rolling shutter image sensors to eliminate unwanted image artifacts – such as banding – that are caused by the flickering of artificial light sources. With the wide-spread usage of LED lighting, photography increasingly suffers from what is known as flicker from the […]
Bluetooth 5.0 audio SoC, modules shrink BOM costs via integrated features
To help Bluetooth speaker and headphone manufacturers maintain product differentiation in the competitive wireless audio market, Microchip Technology Inc. released the next generation of its Bluetooth 5.0-qualified dual-mode audio IC and fully certified module. Measuring just 5.5 x 5.5 mm, the low-power IS2083BM IC is ideal for small form factor designs and gives developers more space to […]
Image sensor captures premium video with HDR, ultra-wide angles
OmniVision Technologies, Inc. announced the OV12D, a 1.4 micron 12 MP image sensor with selective conversion gain (SCG) for the optimum balance between low-light image quality and high dynamic range (HDR). The OV12D features a large 1/2.4” optical format, on-chip 4-cell remosaic color filter, high-speed phase-detection autofocus (PDAF) and extra pixels for 4K2K video electronic […]
Reference design simplifies video bridging
Lattice Semiconductor Corporation announced the availability of the first in a series of new reference designs featuring the Lattice CrossLink FPGA for video bridging applications. The MIPI CSI-2 Camera Aggregator Bridge reference design provides customers with a template combining all necessary IP and software needed to easily add CrossLink-based video bridging solutions to applications using […]
Digital proximity sensor module occupies just 1mm3 of volume
ams has announced the world’s smallest digital proximity sensor module. The ultra-small package of the TMD2635 occupies just 1mm3 of volume and enables audio manufacturers of True Wireless Stereo (TWS) earbud products to develop smaller, lighter industrial design earbuds. The IR proximity sensor enables wireless earbud in-and-out of ear detection to help extend battery life between […]
MCU-based system handles offline face recognition/expression ID
NXP Semiconductors N.V. unveiled today the world’s first microcontroller (MCU) -based solution for adding offline face and expression recognition capabilities to smart home, commercial and industrial devices. Built on NXP’s latest crossover MCU, the i.MX RT106F, running FreeRTOS, the new MCU-based face recognition solution enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively incorporate […]