Digi International announced general availability of its ConnectCore® 6UL module platform. The ConnectCore 6UL delivers a secure connected Linux-based NXP i.MX6UL System-on-Module (SOM) with integrated dual-band 802.11ac wireless LAN and Bluetooth 4.2 connectivity in a low-profile surface mount form factor slightly larger than a postage stamp. The ConnectCore 6UL is the most power efficient, lowest cost and […]
Consumer Electronics
NAND Flash chips squeeze 256 Gb into a smaller space
SK Hynix Inc. today introduced the industry’s first 72-Layer 256Gb(Gigabit) 3D(Three-Dimensional) NAND Flash based on its TLC(Triple-Level Cell) arrays and own technologies. The company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production. A single 256Gb NAND Flash chip can represent 32GB(Gigabytes) […]
Industrial SBC carries i.MX6 NXP CPU based on ARM Cortex A9 core
Technologic Systems, an Arizona-based embedded computing company, has announced the introduction of its newest industrial single board computer, the TS-7970. The TS-7970 takes full advantage of the powerful features of i.MX6 NXP CPU based on the ARM Cortex A9 core. “We designed the TS-7970 to be the Swiss Army Knife of the embedded computing world. […]
SRAM compiler billed as having world’s smallest memory footprint
Faraday Technology Corporation, a leading ASIC design service and IP provider, announced the enhancement of its memory compiler IP offerings on both UMC 40eHV and 40LP processes. Based on UMC’s leading-edge 40nm bit cell and Faraday’s design optimization on the peripheral circuit, the newly-launched compilers are able to generate memory instances based on the world’s […]
Teardown: Inside the
Anki Overdrive racecar set
Robotic race cars make clever use of software and infrared optics to follow lines slyly hidden on the track. Leland Teschler, Executive Editor The Overdrive starter kit we analyzed contains sections of track that can go together in various ways and can even include jumps. An interesting feature of the track is that its sections […]
Industrial Isolated USB 3.0 Hub does 5 Gbps with four ports
Advantech’s IIoT Automation Group is pleased to announce the launch of the USB-4630, an industrial isolated USB 3.0 hub which provides four high-speed downstream ports with five Gbps transfer speed and 2.500 Vdc isolation protection. The USB-4650 provides the fastest data transmission between a USB controller and connected units with isolation protection. Offering up to […]
Low-Power, long-range LoRa gateway speeds network setup
Laird announced the release of its new Enterprise Internet of Things (EIoT) Low-Power, Long-Range LoRa gateway, which enables enterprise customers to deploy EIoT networks in practically any geographic location, even where traditional communications infrastructure is unavailable. “The Sentrius RG1xx has been purpose-built from the ground up to create a secure, scalable, robust LoRa network solution,” said […]
Intel Atom-based module targets ultra-low power applications
The embedded specialist TQ extends its x86 product range: The new COM Express Compact module, TQMxE39C2, is equipped with Intel Atom E3900 series processors and, with two DDR3L SO DIMM sockets, offers high flexibility for system integration. A further version, with soldered DDR3L storage and ECC support, is also nearing preparation and will be available […]
Diode arrays bring ESD protection to high-speed interfaces
Littelfuse, Inc., the global leader in circuit protection, today introduced a series of TVS Diode Arrays (SPA® Diodes) designed to provide eight channels of ultra-low capacitance common mode and differential mode protection for electronic equipment exposed to electrostatic discharges (ESD). SP8008 Series Low Capacitance TVS Diode Arrays offer the robustness necessary to protect against ESD […]
FIPS 140-2 Level 3 compliant encryption implemented by STM reference design
STMicroelectronics and ClevX, an intellectual-property innovator and technology developer for portable storage and mobile device manufacturers, today announced the availability of a FIPS 140-2 Level 3 compliant Encryption Technology Platform reference design for security applications using commercial/industrial-, rather than military-grade chips. The STM32 microcontroller-based platform will aid designers and manufacturers to design and build highly […]