Microsemi Corporation announced the production release of its Flashtec™ NVM Express (NVMe) 2108 eight-channel controllers, enabling leading enterprises and data centers worldwide to realize cost- and power-efficient high capacity solid state drives (SSDs). The devices extend Microsemi’s leadership in the NVMecontroller segment with robust mainstream performance and support for capacities to 16GB and greater. Customers will enjoy the architectural […]
Data centers
Software that accelerates pattern search and facial classification
BrainChip Holdings Ltd., a developer of software and hardware accelerated solutions for advanced artificial intelligence and machine learning applications, today announced the release of its new software product, BrainChip Studio. BrainChip Studio is the result of more than 10 years development and uses an artificial intelligence technology called a spiking neural network, a type of […]
NAND Flash meets AEC-Q100 automotive quality standards
Macronix International Co. today announced that it has launched its AEC-Q100 Grade 2/3 compliant NAND Flash memory product. With over 27 years of experience and capabilities in semiconductor design and fabrication, Macronix NAND Flash memory has passed all the stringent AEC-Q100 reliability standards, and becomes the first AEC-Q100 full compliant NAND Flash product supplier for Automotive […]
10/25 GbE Ethernet NIC adapters provide full NFV
Cavium, Inc. announced the new FastLinQ QL41000 Series of 10/25GbE Ethernet NICs, which are supported on Dell EMC14thGeneration PowerEdge servers. The FastLinQ QL41000 Series are the industry’s only NIC solution that gives customers the technology choice and investment protection with support for concurrent RoCE, RoCEv2 and iWARP. The FastLinQ adapters coupled with new generation PowerEdge […]
3D flash memory uses through-silicon via technology
Toshiba announced the development of the world’s first[ BiCS FLASH three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased […]
Polarfire mid-range FPGAs carry 100K to 550K logic elements
Microsemi Corporation today announced its PolarFire™ field programmable gate array (FPGA) engineering samples (ES) are available for ordering. The PolarFire FPGA family provides the lowest power, cost-optimized mid-range devices spanning from 100K logic elements (LEs) to 500K LEs. Its PolarFire Evaluation Kit, already shipping to key customers, is also available for ordering from the company and its distribution […]
USB Type-C controllers carry built-in protection circuits
STMicroelectronics has introduced two new USB Type-C™ -certified port-controller ICs with built-in protection, which help designers implement interfaces cost-effectively to support their required blend of USB features. These can include power negotiation, managed active cables, and support for guest protocols. USB Type-C specifies reversible plug orientation and cable direction, which simplifies attaching and powering a wide range […]
Chip design IP now works with 7-nm Leading-Performance (7LP) FinFET process
Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology. Synopsys and GF collaboration on the new process addressed several new challenges specific to the 7LP process. This process is expected to deliver 40 percent more processing power and twice the area scaling […]
Platform boosts I/O performance with Intel Omni-Path fabric for dense HPC
Super Micro Computer, Inc., a global leader in compute, storage and networking technologies including green computing, delivers the Intel Omni-Path Architecture (Intel OPA) in the new generation, high-performance, X11 8U/4U SuperBlade systems supporting the upcoming Intel Xeo Processor Scalable Family (codenamed Skylake). The X11 SuperBlade is a density and performance optimized solution for high performance and Artificial […]
GPU accelerator supports AI applications
Inspur unveiled GX4, a new flexible and high scalability AI accelerating box at ISC 2017. The GX4 is able to achieve the decoupling coprocessor resources including CPU and GPU, Xeon Phi and FPGA, expand the computing power on demand, and provide highly flexible support to various AI applications in GPU-accelerated computing. This is another innovative effort […]
