Memory management is important in all digital electronic devices including devices designed for use on the Internet of Things (IoT). It supports efficient resource allocation and memory utilization and prevents memory fragmentation, improving efficiency. It also supports memory protection and device security. This FAQ briefly reviews the common weakness enumeration (CWE) scheme for identifying software […]
IoT
Securing devices for the IoT – firmware, software, and OTA
Over-the-air (OTA) updating of firmware and software on Internet of Things (IoT) devices is a requirement, not an option. The large number of IoT devices makes manual updates impractical and even dangerous. This FAQ reviews two key tools for managing and implementing OTA for IoT devices: open-source standards for managing resource-constrained devices and industry standards […]
Securing devices for the IoT — minimize the attack surface
An attack surface is the sum of all the attack vectors or ways that an attacker can gain malicious access to a network or system. The growth in remote work and the adoption of cloud services have increased the number of attack vectors and the size of the attack surface for most organizations and applications. […]
Scalable vector graphics added embedded graphics library
SEGGER introduces support for Scalable Vector Graphics (SVG) in emWin, providing developers with a powerful and efficient solution for rendering scalable and rotatable graphics in embedded applications. SVG is a vector-based image format written in XML. It is an open standard developed by the World Wide Web Consortium (W3C) and is supported by most web […]
Matter 1.2 is here — what does that mean for the smart home?
by Rob Alexander, Principal Product Manager for Matter at Silicon Labs The rapid evolution and expansion of the IoT over the last decade has resulted in “smart” devices becoming a pervasive part of our everyday lives. Thousands of smart home products exist on the market today, and everything from our light switches to our vacuum cleaners now […]
Hardware-based RoT enables auto devices to meet automotive functional safety standard
Intrinsic ID released QuiddiKey 400, a hardware-based root-of-trust (RoT) solution for semiconductors in the automotive market that must meet stringent functional safety standards. QuiddiKey 400 has been developed following an ISO 26262 functional-safety-compliant flow and meets the ISO 26262 Automotive Safety Integrity Level (ASIL) B fault metric and ASIL D for systematics failures. It leverages […]
Single-stream, SoC device added to wireless connectivity portfolio
Synaptics Incorporated announced the expansion of its industry-leading wireless connectivity family for the Internet of Things (IoT) with the introduction of the SYN43711. This Wi-Fi 6E and Bluetooth 5.3 combo system-on-chip (SoC) adds to the portfolio of products tailored for the high-performance segment of the market. The SYN43711 explicitly targets use cases that demand superior Wi-Fi throughput and […]
Microprocessor chip/module let engineers add Bluetooth 5.3 to IoT designs
STMicroelectronics has released two new products to enable the next generation of better, smaller, and longer lasting smart short-range wireless connectivity devices. The latest Bluetooth specification creates exciting opportunities for these to become even smarter, allowing designers to create items such as wireless beacons and devices that can calculate their location indoors with centimeter accuracy. […]
Microcontroller adds security platform for IoT design
CommScope and STMicroelectronics announced the integration of CommScope’s PKIWorks IoT security platform with ST’s popular STM32WB microcontroller unit (MCU). This integrated solution offers device manufacturers a turnkey solution for developing IoT devices that meet the Connectivity Standards Alliance Matter standard for security. The solution simplifies manufacturing secure Matter-device-credentials development and provisioning, in addition to reducing costs and […]
Why 3D packaging could be the next breakthrough for processing
By Brian Hendren, Tektronix As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To […]