Sectigo announced the addition of the Sectigo Secure Key Storage SDK (SKS-SDK) to its collection of industry-leading offerings. Secure key storage is a software-based library that cost-effectively manages, seals, and stores encryption keys, passwords, and other confidential information. It removes the risk of exposing credentials of devices lacking a hardware-based secure key storage system such as […]
IoT
Mesh network/multi-sensor units feature Wirepas Massive network connectivity
Fujitsu Components America, Inc. has released a new robust, long-battery life family of the mesh network and multi-sensor units featuring built-in Wirepas Massive network connectivity. The nodes facilitate dense, large-scale network installations to address a wide range of industrial monitoring IoT applications in offices, factories, warehouses, hospitals, schools, and more. Based on the Nordic nRF52832 […]
COMs carry 11th-Gen Intel Core vPro, Xeon W-11000E, Celeron MCUs
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications. Built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU […]
COMs carry Intel Core, Xeon and Celeron 6000 processors
ADLINK Technology Inc. introduces its new Express-TL COM Express Type 6 module with Intel Core, Xeon W, and Celeron 6000 processors and octa-core (8-core) performance. Intel UHD Graphics and Intel AVX-512 VNNI provide superior artificial intelligence (AI) inferencing performance. The Express-TL is well-suited for image processing and analysis, high-speed video encoding and streaming, medical ultrasound, […]
AIoT platform carries Intel 10th-Ge Xeon W and Core i7/i5/i3 processors
ASRock Industrial Computer is releasing the new iEPF-9000S Series/ iEP-9000E Series Ruggedized Edge AIoT Platform powered by Intel 10th Generation Xeon W and Core i7/i5/i3 Processors (Comet Lake) with W480E, Q470E, and H420E chipsets for supreme performance, flexible integration, and reliable durability at the Edge. Featuring workload consolidation, the new Series provides supercomputing power, rich I/Os, […]
Evaluation board works with latest-generation USB power delivery ICs
8FTDI Chip has announced a new development board based on its FT4233HP multi-channel interface ICs. The new FT4233HP high-speed USB serial/FIFO evaluation board will enable engineers to get started much quicker on implementing USB power delivery arrangements. This could be for the retrofitting of this functionality into legacy designs that are already in operation, or […]
Voice-controlled AI enables low-power contactless image processing
Renesas Electronics Corporation announced the joint development of a voice-controlled multimodal AI solution that enables low-power contactless operation for image processing in vision AI-based IoT and edge systems, such as self-checkout machines, security cameras, and video conference systems, and smart appliances such as robotic cleaning devices. The new solution combines the Renesas RZ/V Series vision […]
Software-defined modules speed IIoT projects
Molex announced continued development in driving major advances across its Industry 4.0 and digital manufacturing initiatives. These advances and the introduction of Flexible Automation Modules (FAMs) further extend Molex’s Industrial Automation Solutions (IAS4.0) by empowering supply chain stakeholders to build software-defined machines, robots, and production lines that meet escalating demands for connected, secure, scalable, and efficient operations. […]
New 112-layer SSDs hit 8 TB capacity for U.2, 4 TB for M.2 formats
Innodisk announces its industrial-grade 112-Layer 3D TLC SSDs along with the world’s highest capacity up to 8TB. The 112-layer SSDs introduce a complete product line including the SATA 3TG6-P and 3TE7 series, as well as the PCIe Gen3x4 and Gen4x4 series. The new TLC SSD Series marks Innodisk’s continued development with 3D NAND design, bringing […]
hand-held camera cube reference design enables AI at the edge
Maxim Integrated Products, Inc. unveiled the MAXREFDES178#camera cube reference design, which demonstrates how Artificial intelligence (AI) applications previously limited to machines with large power and cost budgets can be embedded in space-constrained, battery-powered edge devices. The MAXREFDES178# enables ultra-low-power internet of things (IoT) devices to implement hearing and vision and showcases the MAX78000 low-power microcontroller with neural […]
