Teledyne LeCroy, Inc. the worldwide leader in Bluetooth protocol analysis and testing services is pleased to introduce the Bluetooth Protocol Expert System software module, enabling accelerated development of Bluetooth devices and speeding development and troubleshooting of device interoperability in the Internet of Things (IoT). The Bluetooth Protocol Expert System software module presents errors, warnings, and violations impacting […]
IoT
Wireless and MCUs: Bluetooth, Wi-Fi, or Zigbee?
Most of the things in the Internet of Things (IoT) will include processors, sensors, and a wireless communication path to the Internet, and all likely will be limited to a small power budget. Which one should you use? Bluetooth, Wi-Fi, and ZigBee are different wireless communication protocols that are often accessible as modules for easy […]
Try your hand at the “IoT on Wheels” design challenge
element14.com, the world’s largest electronic design community, has launched a new Design Challenge for designers and engineers called ‘IoT on Wheels’. Sponsored by STMicroelectronics, element14 is looking for 10 community members to demonstrate the power of IoT-connected transport solutions by creating a prototype that shows how current technologies can make today’s vehicles safer, smarter and […]
USB 3.1 PHY designs optimized for low power consumption
Faraday Technology Corporation today announced that the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB 3.1 Type-C PHY with USB-PD 2.0 support on UMC 40LP process. Faraday introduced the industry’s first USB 3.0 PHY IP solution in 2009; today’s launched USB 3.1 Gen 1 solutions are then designed with optimized PPA […]
Configurable LTE Cat M1/NB1 multi-mode module fits in compact package
u-blox announced the SARA-R410M-02B, a configurable LTE Cat M1/NB1 multi-mode module with worldwide coverage. It is the industry’s smallest module available in the market today, measuring just 16 x 26 mm, to offer both LTE Cat M1 and Cat NB1 in a single hardware package, as well as software-based configurability for all deployed bands. The SARA-R410M-02B multi-mode […]
Polarfire mid-range FPGAs carry 100K to 550K logic elements
Microsemi Corporation today announced its PolarFire™ field programmable gate array (FPGA) engineering samples (ES) are available for ordering. The PolarFire FPGA family provides the lowest power, cost-optimized mid-range devices spanning from 100K logic elements (LEs) to 500K LEs. Its PolarFire Evaluation Kit, already shipping to key customers, is also available for ordering from the company and its distribution […]
Narrow-band IoT module keys on LPWA networking
MediaTek Inc. today unveiled its first narrow band Internet of Things (NB-IoT) System-on-Chip (SoC), the MT2625, and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm X 18mm) around the chipset. MediaTek’s new ultra-low-power MT2625 SoC supports a full frequency band (from 450MHz to 2.1GHz) of 3GPP R13 (NB1) and […]
Raspberry Pi add-on board sports sensors, processors for IoT work
Premier Farnell, the Development Distributor, announces an exclusive partnership with MATRIX Labs to manufacture and distribute MATRIX Creator to a global network of developers and makers of all skills levels. The MATRIX Creator is a Raspberry Pi add-on that provides multiple functionality and enables faster and more cost-effective development of IoT devices. MATRIX Creator is […]
Micro:Bit coding device now available from US distributor
Premier Farnell, the Development Distributor, has made the BBC Micro:bit available to buy in North America through Newark element14 and MCM Electronics. The micro:bit was originally launched in the UK in March 2016 following an educational programme led by the BBC, in partnership with a group of technology partners including ARM, Microsoft and Premier Farnell. […]
WiFi SiP handles dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready”
Silex Technology America, Inc., a global leader in wired and wireless networking solutions, today introduced its newest embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers cost effective, small form factor, and low power Wi-Fi+BT connectivity […]