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IoT

Try your hand at the “IoT on Wheels” design challenge

July 20, 2017 By Maddie Lippert Leave a Comment

element14.com, the world’s largest electronic design community, has launched a new Design Challenge for designers and engineers called ‘IoT on Wheels’. Sponsored by STMicroelectronics, element14 is looking for 10 community members to demonstrate the power of IoT-connected transport solutions by creating a prototype that shows how current technologies can make today’s vehicles safer, smarter and […]

Filed Under: Applications, Industry News, IoT

USB 3.1 PHY designs optimized for low power consumption

July 14, 2017 By Aimee Kalnoskas Leave a Comment

Faraday Technology Corporation today announced that the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB 3.1 Type-C PHY with USB-PD 2.0 support on UMC 40LP process. Faraday introduced the industry’s first USB 3.0 PHY IP solution in 2009; today’s launched USB 3.1 Gen 1 solutions are then designed with optimized PPA […]

Filed Under: Applications, Automotive, Consumer Electronics, IoT Tagged With: faradaytechnologycorp

Configurable LTE Cat M1/NB1 multi-mode module fits in compact package

July 11, 2017 By Aimee Kalnoskas Leave a Comment

u-blox announced the SARA-R410M-02B, a configurable LTE Cat M1/NB1 multi-mode module with worldwide coverage. It is the industry’s smallest module available in the market today, measuring just 16 x 26 mm, to offer both LTE Cat M1 and Cat NB1 in a single hardware package, as well as software-based configurability for all deployed bands. The SARA-R410M-02B multi-mode […]

Filed Under: Applications, Connectivity, IoT Tagged With: ublox

Polarfire mid-range FPGAs carry 100K to 550K logic elements

June 30, 2017 By Aimee Kalnoskas Leave a Comment

Microsemi Corporation today announced its PolarFire™ field programmable gate array (FPGA) engineering samples (ES) are available for ordering. The PolarFire FPGA family provides the lowest power, cost-optimized mid-range devices spanning from 100K logic elements (LEs) to 500K LEs. Its PolarFire Evaluation Kit, already shipping to key customers, is also available for ordering from the company and its distribution […]

Filed Under: Aerospace and Defense, Applications, Data centers, Industrial, IoT, Tools Tagged With: microsemicorporation

Narrow-band IoT module keys on LPWA networking

June 29, 2017 By Maddie Lippert Leave a Comment

MediaTek Inc. today unveiled its first narrow band Internet of Things (NB-IoT) System-on-Chip (SoC), the MT2625, and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm X 18mm) around the chipset. MediaTek’s new ultra-low-power MT2625 SoC supports a full frequency band (from 450MHz to 2.1GHz) of 3GPP R13 (NB1) and […]

Filed Under: Applications, Connectivity, IoT, microcontroller Tagged With: mediatek

Raspberry Pi add-on board sports sensors, processors for IoT work

June 22, 2017 By Maddie Lippert Leave a Comment

Premier Farnell, the Development Distributor, announces an exclusive partnership with MATRIX Labs to manufacture and distribute MATRIX Creator to a global network of developers and makers of all skills levels. The MATRIX Creator is a Raspberry Pi add-on that provides multiple functionality and enables faster and more cost-effective development of IoT devices. MATRIX Creator is […]

Filed Under: IoT Tagged With: premierfarnell

Micro:Bit coding device now available from US distributor

June 21, 2017 By Maddie Lippert Leave a Comment

Premier Farnell, the Development Distributor, has made the BBC Micro:bit available to buy in North America through Newark element14 and MCM Electronics. The micro:bit was originally launched in the UK in March 2016 following an educational programme led by the BBC, in partnership with a group of technology partners including ARM, Microsoft and Premier Farnell.  […]

Filed Under: IoT, Tools Tagged With: premierfarnell

WiFi SiP handles dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready”

June 21, 2017 By Maddie Lippert Leave a Comment

Silex Technology America, Inc., a global leader in wired and wireless networking solutions, today introduced its newest embedded Wi-Fi solution, the SX-SDPAC SDIO System-in-Package (SiP). This dual-band 1×1 802.11a/b/g/n/ac plus Bluetooth 4.1+HS “Smart Ready” SiP is based on the latest Qualcomm Atheros QCA9377 System-on-Chip (SoC). It offers cost effective, small form factor, and low power Wi-Fi+BT connectivity […]

Filed Under: IoT Tagged With: silextechnologyamericainc.

ARM design environment aids development of mixed-signal IoT designs

June 20, 2017 By Maddie Lippert Leave a Comment

Cadence Design Systems, Inc. today announced expanded support for the enhanced ARM® DesignStart™ program, including the newly added ARM Cortex®-M3 processor and the ARM CoreLink™ SDK-100 System Design Kit, which includes the fully verified CoreLink SSE-050 subsystem, enabling engineers to further accelerate the delivery of mixed-signal internet of things (IoT) designs. The Cadence® Hosted Design Solutions (HDS) design environment […]

Filed Under: IoT Tagged With: cadence

SIM intelligently roams to find strongest signals for IoT connections

June 16, 2017 By Aimee Kalnoskas Leave a Comment

The futuristic dream of the universal, invisible and always-on Internet of Things (IoT) is coming into view with the first SIM that intelligently roams to identify and automatically connect to the strongest signal globally, MetTel announced today. MetTel, a fast-growing communications provider for businesses, has launched IoT Single SIM which ensures the best possible connectivity […]

Filed Under: Applications, IoT, microcontroller Tagged With: metel

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