OmniVision Technologies, Inc. announced in advance of CES the OV40A, a 40MP, 1.0-micron pixel image sensor that features super high gain and de-noise technologies for the best-in-class low light camera performance in the 1/1.7” optical format. This sensor also offers multiple high dynamic range (HDR) options for the best quality still and video captures. Additionally, it supports 1080p slow-motion and high-speed video captures at […]
Applications
Flash programmer gets quad-mode capability for QSPI flashes
SEGGER adds quad mode programming for QSPI Flashes to its universal flash programmer, maximizing programming speed for production environments. Flasher PRO ensures that the time gained using 4-pin transfer translates directly to increased productivity. Operating in either PC-based or stand-alone mode, the Flasher PRO reaches the theoretical minimum programming time of the QSPI device itself. […]
4-MP, 2-u image sensors target IoT security cameras
OmniVision Technologies, Inc. announced in advance of CES the OS04C10, the best-in-class 2.0-micron pixel, 4 megapixel (MP) resolution image sensor for both IoT and home security cameras. When paired with the designer’s selected platform, the OS04C10 can enable a system ultra low power mode for battery-powered cameras with AI functionality. Additionally, it provides high 2688 […]
LTE Cat 1 chip platform handles VoLTE/100 kbps IoT apps
Sequans Communications S.A. announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling. Calliope 2 is designed for the cost-effective support of IoT applications that require VoLTE and a data rate higher than 100 kilobits per second that cannot be supported by LTE-M or NB-IoT technologies. Typical Calliope 2 applications […]
Bluetooth LE/802.15.4 wireless modules incorporate STM32 MCUs
STMicroelectronics is offering a solution to accelerate the market introduction of new Bluetooth LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module. The 7mm x 11.3mm STM32WB5MMG module lets product teams build connected devices without needing wireless-design skills. Made to enable low-cost PCB technology requiring a minimal number of layers, it integrates everything […]
New 0.7-Micron pixel smartphone image sensor brings 32-MP resolution to selfie cameras
OmniVision Technologies, Inc. announced in advance of CES the OV32B image sensor, featuring a 0.7-micron pixel size to provide 32 megapixel (MP) resolution in a 1/3” optical format. This enables smartphone designers to offer the highest possible front-facing, selfie camera resolution in the limited space available. The OV32B also supports 2- and 3-exposure HDR timing for up to […]
DDS connectivity software runs on vehicle network processors
RTI Connext Drive software now runs natively on NXP automotive-grade S32G vehicle network processors, enabling a zonal electrical/electronic (E/E) architecture through a flexible, modular and scalable platform. Connext Drive is RTI’s automotive-grade connectivity software based on the Data Distribution Service (DDS) Standard. Together, the companies aim to accelerate the next-generation of production-track autonomous vehicles. NXP’s […]
ASICs optimized for entry-level, stand-alone driver monitoring systems
OmniVision Technologies, Inc. announced in advance of CES the OAX8000 AI-enabled, automotive application-specific integrated circuit (ASIC), which is optimized for entry-level, stand-alone driver monitoring systems (DMS). The OAX8000 uses a stacked-die architecture to provide the industry’s only DMS processor with on-chip DDR3 SDRAM memory (1GB). This is also the only dedicated DMS processor to integrate a neural processing […]
Designer’s guide to smart home tech, Part 2
This continues the discussion on smart home technology basics. You can find part 1 here. What is Z-Wave? Behind the Z-Wave standard is the Z-Wave Alliance. It is a wireless protocol that will connect and control smart home and IoT devices today. Today, there are over 3400 certified Z-Wave smart home devices on the market. […]
176-layer, 4D NAND flash improves bit productivity
SK Hynix Inc. announced the completion of developing the industry’s most multilayered 176-layer 512 Gigabit (Gb) Triple-Level Cell (TLC) 4D NAND flash. The Company provided the samples to controller companies last month to make a solution product. SK Hynix has been promoting 4D technology from the 96-layer NAND flash products that combine Charge Trap Flash […]