congatec announces the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D. The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver workloads […]
Robotics/Drones
Embedded industrial computers target autonomous mobile robot apps
Cincoze’s latest DI-1100 series of compact, high-performance and power-saving rugged embedded industrial computers with rich interface options is receiving a warm welcome in the smart factory industry. The DI-1100 series is ideal for autonomous mobile robots (AMRs), ensuring on-time delivery of components to the production line or goods to warehouse racks, and suitable for 24/7 […]
Robotics development platform includes sensor pack, ROS drivers
TDK Corporation announced the newest solution to the SmartRobotics product family, TDK RoboKit1. The next-generation robotic development platform enables quick prototyping and development for robotic developers, designers, and enthusiasts, by providing a robust hardware platform accompanied by full ROS1 and ROS2 compliant drivers and software algorithms. TDK continues to dominate the robotics industry by advancing […]
COMs feature 12th-gen Intel Core processors
ADLINK Technology Inc. introduces the world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Client Type and COM Express Type 6. ADLINK COMs with the Intel 12th Gen Intel Core processor family (Codename: Alder Lake-H) allows for a unique design that can be adapted for single-thread or multithread performance. The […]
Industry 5.0 makes collaborative working a reality
By Marcel Consee, Mouser Electronics The basic concepts of Industry 4.0 with its highly automated factory environments promised to deliver business benefit by combining technologies such as sensors, data processing, connectivity, and cloud computing. Human workers or even engineers were not a significant part of the equation. Industry 5.0 re-instates the human element, collaborating with […]
High-precision GNSS module/RTK combo targets agricultural & construction machines, robotic vehicles
Point One Navigation and Quectel Wireless Solutions announced the LG69T-AM, the latest addition to the LG69T GNSS Module Series. Point One’s positioning engine powers the LG69T-AM and enables centimeter-level global accuracy by integrating augmented GNSS in an affordable yet easy-to-use module with open-source API. The LG69T-AM GNSS module features STMicroelectronics’ TeseoV dual-band L1/L5 positioning receiver platform […]
Flexible printed circuit antennas handle LTE, 4G and 5G NR transmissions
Antenova Ltd is announcing ‘Affini’, part number SRFL064, which is a flexible printed circuit (FPC) antenna for the LTE, 4G, and 5G NR networks in global markets. This antenna covers all main 4G bands plus 617-698MHz which offers 5G coverage and the popular Band 71. The Affini antenna measures 78mm x 17mm x 0.15mm, which […]
Qualcomm QRB5165-based AI-on-module designed for robotics and drones
ADLINK Technology Inc. released the LEC-RB5 SMARC module –its first SMARC AI-on-Module based on a Qualcomm Technologies, Inc. processor. The Qualcomm QRB5165 processor is designed for robotics and drones applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, […]
ultra-low power AI inference accelerator IP specialized for convolutional neural network inference processing
LeapMind Co., Ltd. announced version 2 of the ultra-low-power AI inference accelerator IP Efficiera, scheduled to be available in December 2021. Efficiera is highly valued for its power-saving, high performance, space-saving, and performance scalability features. Efficiera v2’s improved features and benefits expand the range of applications by providing wider coverage of performance with broader product […]
SoM platform supports Hailo-8 AI accelerator modules
NXP Gold partner MicroSys Electronics announced that its new embedded SoM (System-on-Module) platform miriac AIP-S32G274A, which is based on NXP S32G vehicle network processors, now supports Hailo-8 AI accelerator modules. A result of MicroSys’s partnership with leading AI (Artificial Intelligence) chipmaker Hailo the powerful AI solution delivers up to 52 TOPS (tera operations per second) […]
