By Dima Feldman, VP of Product Management and Marketing at Sony Semiconductor Israel The CAT-1 LTE modem was initially defined in 2008 as a low-cost, low-power alternative to connect IoT devices that needed to transfer limited amounts of data. However, vendors and network providers at that time focused on higher throughput. The actual device introduction […]
Telecommunications
Relay feature that extends LoRaWAN coverage for metering, utilities, smart cities
The LoRa Alliance announced that it has expanded the LoRaWAN link-layer standard with the addition of a relay specification. Relay allows for battery-operated, easy-to-deploy network coverage extensions at a fraction of the cost of adding additional gateways. This allows LoRaWAN to achieve excellent coverage in use cases requiring deep indoor or underground coverage, or relay data […]
MPUs feature built-in vision AI accelerator for image recognition, multi-camera image support
Renesas Electronics Corporation has expanded its AI-capable RZ/V Series of microprocessors (MPUs), with a new device that enables AI processing of image data from multiple cameras, offering a new level of highly accurate image recognition for vision AI applications. Equipped with two 64-bit Arm Cortex-A53 cores, the new device is capable of delivering high computing […]
Microcontroller boosts automotive security
NXP Semiconductors has announced the NCJ37x Secure Element (SE), an automotive-qualified secure microcontroller with advanced cryptographic accelerators and physically built-in electrical attack resistance for various security-critical automotive applications such as smart access key fobs, Qi 1.3 authentication, or car-to-cloud communication. The device supports the protocols from the Car Connectivity Consortium (CCC) and its passive NFC […]
PCIe repeater IC works from 1.8 V
Diodes Incorporated has further strengthened its range of PCIe solutions with the addition of a new high-speed data rate ReDriver device. The DIODES PI2EQX16924 is the industry’s first available PCIe 4.0 ReDriver that operates from a 1.8V voltage rail, where competing solutions have to use a 3.3V rail. It addresses a broad variety of computing and […]
MCUs for industrial Ethernet support TSN
Renesas Electronics Corporation announced the RZ/N2L microprocessor units (MPUs) for Industrial Ethernet communication that make it easy to add network functionality to industrial equipment and devices. The RZ/N2L complies with many industry-standard specifications and protocols to facilitate the development of industrial automation devices that require real-time capabilities. The new products support the increasingly popular Time-Sensitive […]
What? LORAN may be back? Why? How? Part 3
The defunct, obsolete LORAN navigation system is being revived with enhancements to overcome GNSS’s potential performance and availability risks. Congress debated whether to retain and upgrade the LORAN-C infrastructure to become enhanced LORAN (eLORAN), a national backup to GPS. In October 2009, Congress enacted a Department of Homeland Security appropriations measure allowing LORAN-C termination. […]
RX family 32-Bit MCUs boast superior noise tolerance for home appliances, industrial apps
Renesas Electronics Corporation announced a new addition to the RX 32-bit MCU Family, the RX660 Group of microcontrollers (MCUs) that supports operating voltages of up to 5V, offering superior noise tolerance for home appliances and industrial equipment exposed to high electromagnetic interference. The RX660 is the first in Renesas’ higher-end RX general-purpose MCU devices to […]
Verification IP (VIP) handles virtual network co-simulation for 800Gbps Ethernet 2-7 network stack
Avery Design Systems announced that its fully-tested Verification IP (VIP) for 800Gbps Ethernet can now be used to perform virtual network co-simulation for the full layer Ethernet 2-7 network stack. The combination of the VIP and a virtual co-simulation/co-emulation system enables the running of full hardware/software system verification on pre-silicon SoC RTL and software integrations. […]
MIPI UniPro v2.0 doubles peak data rate
The MIPI Alliance announced a significant update to its versatile, application-agnostic MIPI UniPro transport layer for chip-to-chip/interprocessor communication (IPC) applications in traditional and modular device architectures. Version 2.0 of the specification adds key features to double the data rate while offering greater throughput and reduced latency particularly required by today’s most demanding flash storage applications. First introduced in […]
