Silicon Labs has expanded its timing portfolio to meet the high-performance clocking requirements of 56G PAM-4 SerDes and emerging 112G serial applications. With this portfolio expansion, Silicon Labs is the only timing supplier to offer a comprehensive selection of clock generators, jitter attenuating clocks, voltage-controlled crystal oscillators (VCXOs) and XOs for 100/200/400/600G designs that satisfy sub-100 […]
Telecommunications
Clock generators, jitter attenuators, VCXO/XOs target latest 56G SerDes-based communications
The Silicon Labs Si5391 is said to be the industry’s lowest jitter, any-frequency clock generator. It can provide all clock frequencies needed in 200/400/600G designs from a single IC while delivering sub-100 fsec RMS phase jitter performance for 56G SerDes reference clocks. Featuring up to 12 differential outputs, the Si5391 clock is available in frequency […]
Driver for optical transceivers exhibits low THD
Integrated Device Technology, Inc. introduced its new GX76470 64G linear driver, in die form, for optical integrated modules, for 400G/600G coherent applications. Driven by the ever-increasing amount of digital information, data centers are expanding rapidly across the globe and continuous innovation is required to accommodate an annual traffic growth of 27% and to facilitate 3-5 […]
Synchronous Ethernet for 4G/5G mobile networks using 10Gb PHY
Integrated Device Technology, Inc. introduced today a Synchronous Ethernet solution for 4G/5G mobile networks using Marvell’s Alaska X family of devices. Synchronous Ethernet (SyncE) provides the ability for frequency distribution and synchronization over Ethernet-based packet networks. SyncE helps service providers meet the challenges of increasing bandwidth, coverage and mobile application layer services which require high-accuracy […]
DSP-based ASICs now in 7-nm FinFET technology
MediaTek announced a new addition to its ASIC lineup with a 56G SerDes IP chip available with silicon-proven 7nm FinFET process technology. MediaTek’s 56G SerDes is a high-performance DSP-based solution with PAM4 signaling. Altogether, it demonstrates best-in-class power efficiency, performance and die-area. By developing 7nm and 16nm silicon-proven IP it can integrate easily into cutting-edge […]
4G LTE-M development platform includes STM IoT board
Avnet announced the availability of the AT&T IoT Starter Kit (LTE-M, STM32L4), the latest in a series of AT&T IoT Starter Kits engineered by Avnet in collaboration with AT&T. This LTE-M iteration of the AT&T IoT Starter Kit, with IoT Discovery board from STMicroelectronics, reduces the complexity of LTE-M device development by bringing together all the elements required to develop and prototype highly […]
Directly modulated laser diodes handle 25 Gbps rates for 4.9G and 5G LTE base stations
Renesas Electronics Corporation today announced the RV2X6376A Series of directly modulated laser (DML) diodes. The DML diodes deliver 25 Gbps x four wavelengths as the light source in 100 Gbps optical transceivers that enable high-speed communications inside 4.9G and 5G LTE base stations, and between data center routers and servers. The RV2X6376A Series are the […]
First 16-port 50GbE PHY transceiver
Marvell announced the launch of the 88X7120 50GbE PHY transceiver, the latest offering in its Alaska C family of high-speed Ethernet physical layer (PHY) transceivers, designed to improve bandwidth and performance in the data center. The new transceiver is purpose-built to address the transition in hyperscale data centers from 25GbE (Gigabit Ethernet) and 100GbE to 50GbE, 200GbE and […]
5G MCU operates in 28 GHz band, supports 4 radiating elements, gain and phase controls for analog RF beam steering.
Anokiwave today announced the next product in a new family of second-generation 5G Silicon Quad Core ICs that enable 3GPP compliant base stations with the worldwide release of the 28 GHz AWMF-0157 IC. The second-generation IC family is part of Anokiwave’s on-going strategy to enable the commercialization of 5G mmW systems with silicon ICs. The […]
Integrated chipset offers mobile wallet security and eSIM capabilities
NXP Semiconductors N.V. announced the new NXP SN100U, said to be the world’s first, single-die chipset featuring an embedded Secure Element (SE), Near Field Communications (NFC), and eSIM for added advanced functionality, cellular connectivity, and security. The company also introduced the SU070 standalone eSIM solution, which offers the industry’s smallest footprint and is ideal for smartphones, tablets, […]
