u-blox has announced the NINA-W15 multiradio and gateway module series, which can simultaneously support both Wi-Fi 802.11 b/g/n connections and dual-mode Bluetooth connectivity. This includes support for both Bluetooth low energy and Bluetooth BR/EDR. Concurrent support for these radio interfaces delivers much design versatility. The modules will be particularly useful in products such as gateways and […]
Telecommunications
Bidirectional buffer facilitates hot-swapping of serial busses
Diodes announced the PI6ULS5V9511A I2C/SMBus buffer, which enables hot-swappable line-cards in ‘always-on’ networks, and is available in an assortment of packages. Rack-based systems enable web servers, networks, and telecommunication applications using standards such PCI/cPCI, VME, and AdvancedTCA. These critical systems need to deliver upwards of 99.999% availability, which makes prolonged maintenance and unplanned downtime unacceptable. […]
CMOS chipset for 200G/400G SR datacom modules
The new IDT developed the new HXT14450/HXR14450 chipset addresses the rapid migration from 100G to 400G that mega data centers are undergoing to meeting the continuing rise in cloud computing. The chipset is primarily designed for 200G/400G SR Ethernet optical transceivers and active optical cables (AOCs) that are largely used in the short distance between […]
A simplified way of devising 5G phased arrays
We recently got a tour of Qorvo‘s new RF front-end module from Qorvo’as Bror Peterson and Keysight’s Osamu Kusanois. The module is said to be the world’s first 39-GHz front-end that integrates a power amp, low-noise amp, and switch in one small package. The module uses gallium nitride technology to get a high power density. […]
Cellular LTE-M development kits feature LPWAN software-defined technology-agile modems
Digi International today announced the immediate availability of the Digi XBee3 Cellular LTE-M development kits, featuring Digi’s next-generation smart cellular modem. This LTE-M certification, to be followed by the certification of Digi XBee3 Cellular NB-IoT in October 2018, allows Digi to bring one of the first LPWAN, software-defined technology-agile modems capable of offering Cat-M or NB-IoT […]
GSM/GPRS module offers simple upgrade to LPWA
u‑blox today announced the SARA-G450 a cost-optimized 2G cellular module for machine-to-machine (M2M) applications, such as utility metering and tracking systems. Provided in the industry-proven SARA form factor, the SARA‑G450 quad-band GSM/GPRS module lets product developers easily migrate their products to 3G, LTE, or LPWA technology to meet a broad range of environmental and technological requirements. […]
Integrated baseband chip supports multiple vocoders
CML Microcircuits is now offering a new product from its Sicomm Technologies design center. The SCT3258TD is a highly integrated baseband solution that includes both DMR and dPMR standards. As well as providing full support for the DMR and dPMR protocol stacks, the device is differentiated from CML’s other baseband processors by embedding multiple low […]
Clocks/oscillators meet stringent 56G SerDes phase-jitter requirements
Silicon Labs has expanded its timing portfolio to meet the high-performance clocking requirements of 56G PAM-4 SerDes and emerging 112G serial applications. With this portfolio expansion, Silicon Labs is the only timing supplier to offer a comprehensive selection of clock generators, jitter attenuating clocks, voltage-controlled crystal oscillators (VCXOs) and XOs for 100/200/400/600G designs that satisfy sub-100 […]
Clock generators, jitter attenuators, VCXO/XOs target latest 56G SerDes-based communications
The Silicon Labs Si5391 is said to be the industry’s lowest jitter, any-frequency clock generator. It can provide all clock frequencies needed in 200/400/600G designs from a single IC while delivering sub-100 fsec RMS phase jitter performance for 56G SerDes reference clocks. Featuring up to 12 differential outputs, the Si5391 clock is available in frequency […]
Driver for optical transceivers exhibits low THD
Integrated Device Technology, Inc. introduced its new GX76470 64G linear driver, in die form, for optical integrated modules, for 400G/600G coherent applications. Driven by the ever-increasing amount of digital information, data centers are expanding rapidly across the globe and continuous innovation is required to accommodate an annual traffic growth of 27% and to facilitate 3-5 […]