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Telecommunications

Serial SRAM reduces board size and integrates easily with MCUs

April 1, 2024 By Redding Traiger Leave a Comment

Microchip Technology has expanded its Serial SRAM product line to include larger densities of up to 4 Mb and increased Serial Peripheral Interface/Serial Quad I/O Interface (SPI/SQI) speed to 143 MHz. The 2 Mb and 4 Mb devices are designed to provide a lower-cost alternative to traditional parallel SRAM products and include optional battery backup switchover circuitry in […]

Filed Under: Data centers, Memory, microcontroller, Products, Telecommunications Tagged With: microchiptechnology

Compact SSDs support PCIe Gen 4×4 with enhanced data integrality and i-temp compatibility

March 28, 2024 By Redding Traiger Leave a Comment

Silicon Motion Technology Corporation introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications. The latest FerriSSD BGA SSD supports PCIe […]

Filed Under: Automotive, Data centers, Embedded, Industrial, Products, Storage, Telecommunications, Tools Tagged With: siliconmotiontechnology

Root-of-trust devices accelerate secure manufacturing and deployment

March 26, 2024 By Redding Traiger Leave a Comment

Microchip Technology is helping make embedded security solutions more accessible with its CEC1736 TrustFLEX devices. The CEC1736 Trust Shield family is a microcontroller-based platform root of trust solution enabling cyber resiliency for data centers, telecom, networking, embedded computing, and industrial applications. Now, as part of the TrustFLEX platform, the devices are partially configured and provisioned with Microchip-signed […]

Filed Under: Data centers, Industrial, Products, Security, Software, Telecommunications, Tools Tagged With: microchiptechnology

Embedded GNSS IC enhances IoT positioning accuracy

March 19, 2024 By Redding Traiger Leave a Comment

u-blox has announced F10, the company’s first dual-band GNSS (Global Navigation Satellite Systems) platform combining L1 and L5 bands to offer enhanced multipath resistance and meter-level positioning accuracy. The platform caters to urban mobility applications, such as aftermarket telematics and micromobility. Applications that use GNSS receivers for accurate positioning are on the rise. Yet, current […]

Filed Under: Connectivity, Embedded, IoT, Products, receivers, Telecommunications, Tools Tagged With: ublox

Automotive SoC offers advanced security and communications for vehicle interfaces

March 5, 2024 By Redding Traiger Leave a Comment

Infineon Technologies AG has launched the new Automotive PSoC 4100S Max family. This microcontroller device family expands Infineon’s portfolio of CAPSENSE-enabled Human Machine Interface (HMI) solutions for automotive body/HVAC and steering wheel applications by delivering higher flash densities, GPIOs, CAN-FD, and HW-Security. The Automotive PSoC 4100S Max with fifth-generation CAPSENSE technology offering 10x higher sensitivity […]

Filed Under: Automotive, microcontroller, Products, Security, SoC, Telecommunications, Tools Tagged With: infineontechnologiesag

Wireless SoC features low power consumption and enhanced security features

February 23, 2024 By Redding Traiger Leave a Comment

Sony Semiconductor Israel announced that its advanced ALT1350 Wireless System on Chip (SoC) is now commercially available. LPWA cellular modules have been designed by our partners and industry leaders AM Telecom, Fibocom, Murata, Quectel, Semtech, Telit Cinterion, and Wistron NeWeb Corporation (WNC). The modules are now available for sampling, with mass production expected during the […]

Filed Under: Products, Security, SoC, Telecommunications, Tools, Wireless Tagged With: sonysemiconductor

Cable kit extends camera distance from Raspberry Pi computers

February 16, 2024 By Redding Traiger Leave a Comment

THine Solutions, Inc. announced a new Camera Cable Extension Kit, the THSER102, for Raspberry Pi (RPi) Camera Modules V2/HQ/V3. This new Kit will also support the RPi Global Shutter (GS) camera with upgraded firmware that will be released soon. The THSER102 is available at Amazon, Digi-Key, and multiple Raspberry Pi Authorized Resellers. The THSER102 frees […]

Filed Under: Applications, Camera modules, Development Kits, Products, Software, Telecommunications, Tools Tagged With: thinesolutionsinc

64/32-bit, Cortex-A35-based MPU designed for industrial HMI applications

February 6, 2024 By Redding Traiger Leave a Comment

Nuvoton announces the NuMicro MA35H0 series, a high-performance microprocessor for industrial HMI (Human Machine Interface) applications. As well as general control and user interface applications, this MPU is ideal for numerous sophisticated tasks across industrial and commercial applications – in fields as diverse as industrial HMI, factory automation, smart buildings, smart homes, smart appliances, smart […]

Filed Under: Consumer Electronics, Data centers, Industrial, Machine learning, Medical, Microprocessor, Products, Security, Telecommunications, Tools Tagged With: nuvoton

Software eases LCD design

December 15, 2023 By Redding Traiger Leave a Comment

Nuvoton Technology has announced the launch of its new LCD simulation software, NuTool-LCDView. NuTool-LCDView is a software tool that assists the development of TN-LCDs with Arm-based microcontrollers (MCUs). It provides a clear visual emulation of the planned LCD layout and hardware design during development, enhancing the communication between developers and engineers. Nuvoton is a leading […]

Filed Under: Software, Telecommunications, Tools Tagged With: nuvoton

Why 3D packaging could be the next breakthrough for processing

November 6, 2023 By Brian Hendren, Tektronix Leave a Comment

By Brian Hendren, Tektronix As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To […]

Filed Under: Applications, Automotive, FAQ, Featured, Featured Contributions, IoT, Storage, Telecommunications, Wireless Tagged With: FAQ

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Five challenges for developing next-generation ADAS and autonomous vehicles

Securing IoT devices against quantum computing risks

RISC-V implementation strategies for certification of safety-critical systems

What’s new with Matter: how Matter 1.4 is reshaping interoperability and energy management

Edge AI: Revolutionizing real-time data processing and automation

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