Microchip Technology has expanded its Serial SRAM product line to include larger densities of up to 4 Mb and increased Serial Peripheral Interface/Serial Quad I/O Interface (SPI/SQI) speed to 143 MHz. The 2 Mb and 4 Mb devices are designed to provide a lower-cost alternative to traditional parallel SRAM products and include optional battery backup switchover circuitry in […]
Telecommunications
Compact SSDs support PCIe Gen 4×4 with enhanced data integrality and i-temp compatibility
Silicon Motion Technology Corporation introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications. The latest FerriSSD BGA SSD supports PCIe […]
Root-of-trust devices accelerate secure manufacturing and deployment
Microchip Technology is helping make embedded security solutions more accessible with its CEC1736 TrustFLEX devices. The CEC1736 Trust Shield family is a microcontroller-based platform root of trust solution enabling cyber resiliency for data centers, telecom, networking, embedded computing, and industrial applications. Now, as part of the TrustFLEX platform, the devices are partially configured and provisioned with Microchip-signed […]
Embedded GNSS IC enhances IoT positioning accuracy
u-blox has announced F10, the company’s first dual-band GNSS (Global Navigation Satellite Systems) platform combining L1 and L5 bands to offer enhanced multipath resistance and meter-level positioning accuracy. The platform caters to urban mobility applications, such as aftermarket telematics and micromobility. Applications that use GNSS receivers for accurate positioning are on the rise. Yet, current […]
Automotive SoC offers advanced security and communications for vehicle interfaces
Infineon Technologies AG has launched the new Automotive PSoC 4100S Max family. This microcontroller device family expands Infineon’s portfolio of CAPSENSE-enabled Human Machine Interface (HMI) solutions for automotive body/HVAC and steering wheel applications by delivering higher flash densities, GPIOs, CAN-FD, and HW-Security. The Automotive PSoC 4100S Max with fifth-generation CAPSENSE technology offering 10x higher sensitivity […]
Wireless SoC features low power consumption and enhanced security features
Sony Semiconductor Israel announced that its advanced ALT1350 Wireless System on Chip (SoC) is now commercially available. LPWA cellular modules have been designed by our partners and industry leaders AM Telecom, Fibocom, Murata, Quectel, Semtech, Telit Cinterion, and Wistron NeWeb Corporation (WNC). The modules are now available for sampling, with mass production expected during the […]
Cable kit extends camera distance from Raspberry Pi computers
THine Solutions, Inc. announced a new Camera Cable Extension Kit, the THSER102, for Raspberry Pi (RPi) Camera Modules V2/HQ/V3. This new Kit will also support the RPi Global Shutter (GS) camera with upgraded firmware that will be released soon. The THSER102 is available at Amazon, Digi-Key, and multiple Raspberry Pi Authorized Resellers. The THSER102 frees […]
64/32-bit, Cortex-A35-based MPU designed for industrial HMI applications
Nuvoton announces the NuMicro MA35H0 series, a high-performance microprocessor for industrial HMI (Human Machine Interface) applications. As well as general control and user interface applications, this MPU is ideal for numerous sophisticated tasks across industrial and commercial applications – in fields as diverse as industrial HMI, factory automation, smart buildings, smart homes, smart appliances, smart […]
Software eases LCD design
Nuvoton Technology has announced the launch of its new LCD simulation software, NuTool-LCDView. NuTool-LCDView is a software tool that assists the development of TN-LCDs with Arm-based microcontrollers (MCUs). It provides a clear visual emulation of the planned LCD layout and hardware design during development, enhancing the communication between developers and engineers. Nuvoton is a leading […]
Why 3D packaging could be the next breakthrough for processing
By Brian Hendren, Tektronix As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To […]
