Microchip Technology has expanded its Bluetooth Low Energy portfolio with 12 new products. These additions provide designers with a broad range of choices to overcome their unique challenges, effectively reducing barriers for designs ranging from the simplest to the most complex. The new offerings include the RF-ready WBZ350 module and the PIC32CX-BZ3 SoC, which offers […]
Wireless
Module pair adds computing power, longer battery life to IoT
u-blox has announced two additions to its Bluetooth LE portfolio, ALMA-B1 and NORA-B2. The modules are based on the latest generation nRF54 Series Systems-on-Chip (SoCs) from Nordic Semiconductor. They both support Bluetooth LE 5.4 and Thread/Matter technologies in a compact, power-efficient, and secure format. ALMA-B1 and NORA-B2 are designed for a wide range of IoT applications, including […]
Next-gen wireless chips set to meet upcoming cyber-protection standards
STMicroelectronics has revealed the next generation of its short-range wireless microcontrollers. These innovative, all-in-one components enable wearables and smart objects including smart home devices, health monitors, and smart appliances to become ever more miniaturized, easy to use, secure, and affordable. Short-range wireless technologies like Bluetooth LE, Zigbee and Thread (popular in smart meters and smart […]
Advanced UWB IP supports FiRa 2.0 for high performance in dense, wireless areas
Ceva, Inc. announced the general release of its RivieraWaves ultra-wideband (UWB) IP for FiRa 2.0, the latest technical specification released by the FiRa industry consortium promoting standardization and compliance efforts for the widespread adoption of UWB-driven applications. Leveraging its unique low-power MAC-to-PHY solution, Ceva’s latest generation UWB IP includes a cutting-edge interference cancelation scheme to […]
Wireless SoC features low power consumption and enhanced security features
Sony Semiconductor Israel announced that its advanced ALT1350 Wireless System on Chip (SoC) is now commercially available. LPWA cellular modules have been designed by our partners and industry leaders AM Telecom, Fibocom, Murata, Quectel, Semtech, Telit Cinterion, and Wistron NeWeb Corporation (WNC). The modules are now available for sampling, with mass production expected during the […]
Expertly-tuned audio software allows designers to add support for immersive spatial audio
Ceva, Inc. and THX Ltd. announce RealSpace Tuned by THX, a premium software offering for original equipment manufacturers (OEMs) to add support for immersive spatial audio customized to any consumer or prosumer audio device including TWS earbuds, wireless headphones, smartphones, speakers, and soundbars. RealSpace Tuned by THX, featuring Ceva’s RealSpace spatial audio rendering and head […]
Ruggedized, rack-mountable 1U enclosure holds two SDRs
Pixus Technologies has announced a new rackmountable 1U tall enclosure that holds two of NI’s Ettus Research brand X310 Software Defined Radios (SDRs). The new 1U unit boasts superior cooling with front-to-rear airflow. The air-cooled RX310 meets Transport Grade ruggedization for military rackmount applications. The semi-rugged enclosure features a thicker and reinforced metal structure. With […]
Single-stream, SoC device added to wireless connectivity portfolio
Synaptics Incorporated announced the expansion of its industry-leading wireless connectivity family for the Internet of Things (IoT) with the introduction of the SYN43711. This Wi-Fi 6E and Bluetooth 5.3 combo system-on-chip (SoC) adds to the portfolio of products tailored for the high-performance segment of the market. The SYN43711 explicitly targets use cases that demand superior Wi-Fi throughput and […]
Microprocessor chip/module let engineers add Bluetooth 5.3 to IoT designs
STMicroelectronics has released two new products to enable the next generation of better, smaller, and longer lasting smart short-range wireless connectivity devices. The latest Bluetooth specification creates exciting opportunities for these to become even smarter, allowing designers to create items such as wireless beacons and devices that can calculate their location indoors with centimeter accuracy. […]
Why 3D packaging could be the next breakthrough for processing
By Brian Hendren, Tektronix As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To […]
