Congatec introduces six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments. The value package includes […]
Development Kits
Dev kit speeds industrial Ethernet comm projects for CC-Link IE TSN systems
IAR Systems announces the availability of the new evaluation kit IAR KickStart Kit for Renesas’ R-IN32M4-CL3, assisting developers in the development and evaluation of R-IN32M4-CL3 IC for industrial Ethernet communication which supports CC-Link IE TSN targeted for smart factory applications. The CC-Link IE TSN is an open Industrial Ethernet (IE) technology from CC-Link Partner Association. […]
Development kit enables rapid development for 1 kW to 10 kW applications
ON Semiconductor has introduced its advanced and flexible Motor Development Kit to accelerate the development of more efficient motor control solutions for applications ranging from less than 1 kW to over 10 kW. Electric motors account for over half of all the power generated and consumed by industrialized countries. The majority of those motors are […]
Economical desktop computer based on Raspberry Pi
Newark announced the availability of the new-to-market Raspberry Pi 400 desktop computer. Available in ready-to-use kit form, the competitively priced Raspberry Pi 400 is an ideal desktop computer for use in the home or education. Raspberry Pi 400 can also be purchased on its own for use in industrial and commercial applications including point-of-sale terminals and thin […]
FPGA family in ceramic quad flat pack option is QML-qualified
Microchip Technology announced its RTG4 Field Programmable Gate Array (FPGA) family is the first in a Ceramic Quad Flat Pack (CQFP) option to achieve qualification to the industry’s Qualified Manufacturers List (QML). The achievement will enable space system developers to create systems using more reliable packages that simplify the layout and routing of Printed Circuit […]
Mounting base kit simplifies electronic prototyping tasks
Digi-Key Electronics announced that it has expanded its product portfolio to include Phase Dock Inc.’s WorkBench project development kit. This distribution partnership is part of Digi-Key’s Marketplace initiative to broaden the product offerings now available for customers, making Digi-Key more of a one-stop-shop than ever before. Phase Dock offers a unique project development kit series, the Phase […]
Development platform speeds 2K high-resolution imaging radar work
Arbe announced the rollout of their Radar Development Platform empowering customers to revolutionize their imaging radar systems. Tier 1s, OEMs, and new mobility players are enhancing their perception algorithms based on the 2K high-resolution Imaging Radar Development Platform, or A Sample as referred to in the automotive industry. Arbe is currently collaborating with over 20 tier-1 and OEM […]
Development kit focuses on Arduino-based, LTE-powered IoT apps
Telit announced the launch of Charlie, a turnkey innovation kit for fast, inexpensive development of Arduino-based, LTE-powered IoT applications. The new kit is the latest example of Telit’s commitment to providing makers and other innovators with low-cost development solutions as they explore the burgeoning IoT market opportunity. Telit designed Charlie to provide all of the key features […]
Health sensor kit cuts development time for wearables
Save at least six months of development time using the Health Sensor Platform 3.0 (HSP 3.0) from Maxim Integrated Products, Inc. Also known as MAXREFDES104#, this ready-to-wear wrist form factor reference design monitors blood oxygen saturation (SpO2), electrocardiogram (ECG), heart rate (HR), body temperature, and motion. Included algorithms provide HR, heart-rate variability (HRV), respiration rate […]
LoRaWAN TS1-1.0.4 Spec simplifies development, deployment, Interoperability
The LoRa Alliance announced that it published the LoRaWAN TS1-1.0.4 Link Layer (L2) Specification. This latest definition of the LoRaWAN standard includes all required implementation elements to facilitate LoRaWAN deployments globally. According to industry research firm IoT Analytics, LoRaWAN is the most adopted LPWAN technology to date, representing more than one-third of all deployments globally. This market […]