Würth Elektronik launches further WE-SPXO series quartz oscillators onto the market. The additions to the program include a new design with LVDS or LVPECL output signal plus 32.768 kHz oscillators. While the hermetically sealed oscillators were already outstandingly well specified for a wide range of industrial applications, the new arrivals are even more temperature-stable and […]
PCB Design
Embedded Wi-Fi antennas operate up to 6 GHz
AVX Corporation released a new series of embedded Wi-Fi antennas designed to satisfy steadily increasing cross-market demand for smaller and thinner wireless products with superior signal sensitivity. The new W Series Embedded Wi-Fi Antennas offer a wide range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band […]
Bluetooth LE/802.15.4 wireless modules incorporate STM32 MCUs
STMicroelectronics is offering a solution to accelerate the market introduction of new Bluetooth LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module. The 7mm x 11.3mm STM32WB5MMG module lets product teams build connected devices without needing wireless-design skills. Made to enable low-cost PCB technology requiring a minimal number of layers, it integrates everything […]
tactical grade, force-rebalance SMD MEMS accelerometer includes digital interface
TDK Corporation announces the release of Tronics AXO315, a miniature high-performance 1-axis closed-loop MEMS accelerometer with a 24-bit digital SPI interface and SMD package that reaches quartz sensors performances, outperforms commercial MEMS sensors, and eases integration. The new force-rebalance accelerometer delivers an excellent one-year composite bias repeatability of 1 mg and composite scale factor repeatability […]
FPGAs augment NICs for cloud data center uses
Inventec (2356.TW), in collaboration with Intel, announces the release of the new Inventec FPGA SmartNIC C5020X that complements the Intel FPGA SmartNIC C5000X platform architecture. Inventec is one of Intel’s first ecosystem partners to leverage this platform. The FPGA SmartNIC C5020X works to extend traditional Network Interface Controllers (NICs) beyond its existing restrictions for the […]
Protocol exerciser handles PCIe 5.0 traffic validation
Viavi Solutions Inc. introduced the Xgig Protocol Exerciser for the 5P16 Platform for protocol traffic validation and performance evaluation. Together with the recently introduced Xgig 5P16 Analyzer — the first 16-lane protocol analysis system for PCIe 5.0 — the VIAVI Xgig Protocol Exerciser enables powerful real-time emulation, manipulation, and analysis of PCIe 5.0 data traffic at all layers of the stack. The VIAVI Xgig […]
FPGA family in ceramic quad flat pack option is QML-qualified
Microchip Technology announced its RTG4 Field Programmable Gate Array (FPGA) family is the first in a Ceramic Quad Flat Pack (CQFP) option to achieve qualification to the industry’s Qualified Manufacturers List (QML). The achievement will enable space system developers to create systems using more reliable packages that simplify the layout and routing of Printed Circuit […]
Health sensor kit cuts development time for wearables
Save at least six months of development time using the Health Sensor Platform 3.0 (HSP 3.0) from Maxim Integrated Products, Inc. Also known as MAXREFDES104#, this ready-to-wear wrist form factor reference design monitors blood oxygen saturation (SpO2), electrocardiogram (ECG), heart rate (HR), body temperature, and motion. Included algorithms provide HR, heart-rate variability (HRV), respiration rate […]
Tiny, MIPI-compliant switch supports high-speed and low-power connection
Diodes Incorporated announced the PI3WVR628 3-lane 2:1 switch measuring just 1.7mm x 2.4mm x 0.5mm. The MIPI-compliant switch supports high speed (HS) and low power (LP) connections to CSI/DSI, D-PHY, and C-PHY modules. With its industry-leading small outline, the PI3WVR628 is suitable for any device that integrates multiple camera modules, such as smartphones, tablets, and […]
PCB for NVIDIA Jetson Xavier NX module provides 12 camera/sensor inputs
D3 Engineering today announced its new DesignCore Carrier Board, which allows engineers to quickly connect multiple cameras or sensors with the recently launched NVIDIA Jetson Xavier NX module to enable AI at the edge. Sensor data is delivered via a serial link and is deserialized into MIPI CSI-2 data for consumption on the Jetson Xavier NX module. […]
