S3 Semiconductors today announced an online bill of materials (BOM) calculator that shows how custom ICs are economically viable even in low to medium volumes. Learning from S3 Semiconductors’ 20 years of experience in designing custom ICs, the BOM calculator will provide an estimate of project development costs and give a guide to break-even volumes using just […]
PCB Design
Chip design CAD software supports integrated fan-out advanced packaging, chip-on-wafer-on-substrate packaging technologies
Mentor, a Siemens business, today announced several enhancements to its Calibre® nmPlatform, Analog FastSPICE™ (AFS™) Platform, Xpedition® Package Integrator and Xpedition Package Designer tools in support of TSMC’s innovative InFO integrated fan-out advanced packaging and CoWoS® chip-on-wafer-on-substrate packaging technologies. The TSMC InFO and CoWoS 3D packaging technologies enable customers to mix multiple silicon dice on a single device and […]
Chip design CAD system supports 7-nm FinFET Plus and 12-nm FinFET process technologies
Mentor, a Siemens business, today announced certification for TSMC’s 12nm FinFET Compact Technology (12FFC) and the latest version of 7nm FinFET Plus processes for its Mentor Calibre® nmPlatformand Analog FastSPICE™ (AFS™) Platform. Nitro-SoCTM place and route system is also certified to support TSMC’s 12FFC process technology. “TSMC is pleased to work closely with Mentor, which continues to increase its […]
