Imagimob announced that the new release of its tinyML platform is now available to its customers. The new release focuses on making it easier and faster for developers to build and deploy performance-ready tinyML applications on edge devices. New features include: Starter projects save time for developers. They increase the quality of the AI application […]
Products
SoMs geared toward V2X infrastructure applications
The .MX 8XLite System on Module (SOM) line is engineered for a variety of V2X applications. Available in single- or dual-core configurations, these new SOMs pack all the essential components required to quickly develop V2X, V2I and industrial IoT applications in a 30×47-mm form factor. “In order to accelerate the adoption of autonomous vehicle technology, […]
Heat sinks accommodate wide range of FPGAs, ASICs
Advanced Thermal Solutions, Inc. now provides fanSINKS heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS, and other package types used in telecomm, optics, test/measurement, military, and other applications. ATS fanSINKS features cross-cut, straight aluminum fins. They support omnidirectional airflow for optimum […]
Raspberry Pi-based PLCs run industrial controller apps
Kontron expands its PiXtend product range by supporting the engineering software logi.CAD 3 from the company logi.cals and the Spider Control I4.0 Integration Suite from iniNet. With Pi-Tron and PiXtend, the advantages of the Raspberry Pi can be combined with the engineering platform logi.CAD 3 from logi.cals. Sophisticated control applications for industrial automation solutions can be […]
Small inductors geared for Bias-T automotive circuits
Murata has announced the availability of the LQW43FT series, a new line of broadband inductors developed for the automotive market. The 1812 size is the world’s smallest inductor for Bias-T circuits that support an inductance range of 10 μH to 22 μH and a high current of 700 mA. It is ideal for vehicle-mounted Power […]
RTOS supports 11th Gen Intel Core, Intel Celeron MPUs
Wind River announced support for Intel Atom x6000 Series and Intel Pentium and Celeron N and J Series processors and 11th Gen Intel Core processors and Intel Celeron processors. This development is part of a multi-year effort to optimize Wind River software for Intel industrial system-on-a-chip offerings (SoCs). The industry-leading VxWorks real-time operating system (RTOS), a part of Wind River […]
Small SBCs carry 11th generation Intel core U-series and Celeron 6000 series MPUs
Kontron launches a new 3.5″ single-board computer, named 3.5″-SBC-TGL, powered by 11th Generation Intel Core U-Series and Celeron 6000 Series processors (Code Name: Tiger Lake UP3), to help system developers build a low-latency, graphics-demanding, and AI-enabled embedded system for smart retail, industrial automation, smart city, healthcare or similar IoT / AIoT related applications. Besides the […]
Cloud service automates IoT device connection/registration via X.509 device certificates
Infineon Technologies AG launched CIRRENT Cloud ID, a service that automates cloud certificate provisioning and IoT device-to-cloud authentication. The easy-to-use service extends the chain of trust and makes tasks easier and more secure from chip-to-cloud while lowering companies’ total cost of ownership. Cloud ID is ideal for cloud-connected product companies in the industrial, consumer, healthcare, […]
Rugged 3U OpenVPX processor module provides hardware-accelerated graphics
Curtiss-Wright’s Defense Solutions has announced the latest addition to its portfolio of DO-254 / DO-178C safety certifiable commercial off the shelf (COTS) products with the introduction of the V3-717, a rugged 3U OpenVPX high-performance graphics processor module. Expanding Curtiss-Wright’s support for the modular open system approach (MOSA), the V3-717 adds hardware-accelerated graphics with video encode/decode hardware acceleration […]
Wireless MCUs support latest BLE 5.3 Spec
Renesas Electronics Corporation announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification. The new devices will be part of the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE device introduced last year. Renesas expects to have the […]