Infineon Technologies LLC announced the availability of its second-generation non-volatile Static RAMs (nvSRAM). The new generation of devices are qualified for QML-Q and high-reliability industrial specifications to support demanding non-volatile code storage and data-logging applications in harsh environments, including aerospace and industrial applications. The 256 kb STK14C88C and 1 Mb STK14CA8C nvSRAMs are qualified in […]
Storage
pSLC microSD card stores up to 64 GB
To keep in step with industry development and meet market demands, FORESEE, the technology-based brand of Longsys has officially launched the FORESEE pSLC microSD storage card recently. With highly reliable pSLC storage chips and capacity options ranging from 8GB, 16GB, 32GB, 64GB, to 128GB, it aims to provide industry customers with diversified mobile storage solutions. […]
176-layer, 4D NAND flash improves bit productivity
SK Hynix Inc. announced the completion of developing the industry’s most multilayered 176-layer 512 Gigabit (Gb) Triple-Level Cell (TLC) 4D NAND flash. The Company provided the samples to controller companies last month to make a solution product. SK Hynix has been promoting 4D technology from the 96-layer NAND flash products that combine Charge Trap Flash […]
SSDs with 3D NAND flash memory support serial ATA
TDK Corporation announces a new generation of flash storage products with five series, available December 2020, optimized for industrial, medical, art grid, transportation, and security applications. All five series use GBDriver GS2, TDK’s proprietary NAND flash memory control IC, which supports serial ATA. As 3D flash memory technology advances, flash storage solutions with capacities over […]
Enterprise-grade 16-channel PCIe 4.0 NVMe hardware + firmware combo speeds SSD development
Silicon Motion Technology Corporation announced the SM8266, a complete enterprise-grade 16-channel PCIe 4.0 NVMe hardware plus firmware turnkey SSD controller solution. Customers can rapidly develop and bring to market enterprise SSDs for data centers by using our complete development platform that includes a turnkey NVMe firmware stack and hardware reference design kit. The SM8266 controller […]
Bidirectional level translator connects SD 3.0 memory with low-voltage processing hardware
Diodes Incorporated announced the PI4ULS3V4857, an SD 3.0-compliant bidirectional level translator for use in communication, consumer, and computing system applications including smartphone handsets, notebooks, SD/MicroSD card readers, wireless access points, and 5G femtocells. The PI4ULS3V4857 has the capacity to translate a 1.2V to 1.8V host side voltage into a memory card voltage signal of either […]
176-layer NAND expands storage capability across data-intensive applications
Representing Micron’s fifth generation of 3D NAND and second-generation replacement-gate architecture, the world’s first 176-layer NAND flash memor features approximately 30 percent smaller die size than best-in-class competitive offerings. Micron’s 176-layer NAND’s compact design is well-suited for small-form-factor applications in spanning data center, intelligent edge, and mobile devices and serves as an essential building block […]
PCIe 4.0 NVMe 1.4 Controllers optimized for Gen4 performance at low power consumption
Silicon Motion Technology Corporation announced a new portfolio of PCIe 4.0 NVMe 1.4 controller solutions to address performance, mainstream, and value SSD applications. The portfolio consists of SM2264 for performance, SM2267 for mainstream, and SM2267XT for value DRAM-less client SSDs. Silicon Motion’s latest controller family has been designed from the ground up with PCIe Gen4 […]
NAND-based SSDs optimized for low-volume uses
ATP Electronics launches the A700Pi/E700Pi Series, a new generation of Premium Line pSLC NAND-based embedded SSDs. A game-changing highlight for this generation is a new ATP-developed firmware and supporting mass production infrastructure, which is fully customizable to endurance configurations that are tailor-fitted to customer’s requirements, to address any variety of embedded/industrial usage cases. This once […]
AI applications and emerging computing architectures – Virtual Conversation (part 1 of 2)
Hosted by Jeff Shepard, EE World has organized this “virtual conversation” with Gary Bronner (GB), Senior Vice President with Rambus Labs. Mr. Bronner has generously agreed to share his experience and insights into AI applications and emerging computing architectures. JS: What is usually the biggest challenge designers face when first using artificial intelligence? GB: One […]
