Hosted by Jeff Shepard In this Virtual Roundtable session on emerging memory technologies, we are joined by Nando Basile (NB), Technology Marketing Manager for Memory with X-FAB; Bob Brennan (BB), Vice President of Emerging Memory at Micron; and Mark Reiten (MR), Vice President, Licensing Business Unit, Silicon Storage Technology (SST), a wholly-owned subsidiary of Microchip […]
Storage
NV memory optimized for Arm-based MPUs
Dialog Semiconductor plc announced the DA16600, a module that uniquely combines Dialog’s market-leading Wi-Fi and BLE capabilities into a single solution. This two-in-one module is comprised of two groundbreaking SoCs, the newly announced DA16200 and the SmartBond TINY DA14531, to provide best-in-class, low-power Wi-Fi and BLE for customers and further broaden Dialog’s IoT connectivity portfolio. […]
Memory-centric computing and memory system architectures
This three-part FAQ series began by considering “Memory Basics – Volatile, Non-volatile and Persistent.” Part two looked at “Memory Technologies and Packaging Options.” Recently developed persistent memory technologies, three-dimensional packaging for memories, advanced multicore processors, demands to process larger and larger datasets and databases, and artificial intelligence are driving the emergence of a new category […]
Memory technologies and packaging options
Solid-state memory devices are available in a wide variety of standard package styles that they have in common with other semiconductor devices, including DIP, TSSOP, DFN, WLCSP, and many others. And various packages are offered in plastic, glass, ceramic, and metal containing one or more devices. They are also available in hermetically-sealed packages and non-hermetic […]
Memory basics – volatile, non-volatile and persistent
Computers, gaming consoles, telecommunications, automobiles, industrial systems, and myriad electronic devices and systems rely on various forms of solid-state memory for operation. Designers need an understanding of the various options for volatile and non-volatile memory devices to optimize the performance of systems. A new form of solid-state memory called persistent memory (PMEM) has recently emerged […]
NVMe controller enables power and form-factor optimized enterprise NVMe SSDs
As data centers support more Artificial Intelligence (AI) and Machine Learning (ML) workloads, there is a need for cloud-scale infrastructure that provides more bandwidth to storage and more storage density per rack. The trend is therefore to adopt PCIe Gen 4-capable NVM Express (NVMe) Solid State Drives (SSDs) in smaller form factors such as M.2 […]
Tech enablement program designed to accelerate DDR5 adoption
Micron Technology, Inc. announced a comprehensive enablement program which will provide early access to technical resources, products, and ecosystem partners. The Technology Enablement Program will aid in the design, development, and qualification of next-generation computing platforms that use DDR5, the most technologically advanced DRAM available. Today’s news, alongside the ratification of the JEDEC DDR5 standard, builds on […]
Serial-attached SCSI 24G SSDs target servers, enterprise storage
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) became the first company to bring 24G SAS to server and storage applications with the introduction of its 6th-generation enterprise SAS SSD family. First demonstrated at Flash Memory Summit 2019, KIOXIA’s new PM6 Series of enterprise SAS SSDs is built on 24G SAS technology. Designed for modern IT […]
RAID adapters designed for cost-sensitive end applications
To support cloud, enterprise, and workstation customers that require the robustness and performance of hardware RAID at an entry-level cost point, Microchip Technology Inc. announces the Adaptec SmartRAID 3100E RAID adapters which are designed to provide reliable hardware RAID protection for customer data in cost-sensitive end applications. The SmartRAID 3100E provides over 60 percent performance acceleration over […]
RAM chips lower form factor via Wafer-Level Chip-Scale Packaging
Winbond Electronics Corporation announced the introduction of new HyperRAM products with WLCSP, which reaches an unprecedented thin form factor in embedded applications. HyperBus technology was first published by Cypress in 2014. Compared to the transmission and control interface of other memory, one of the characteristics of the HyperBus interface is the low pin count, which […]