MemVerge, the pioneers of Big Memory software, announced general availability of Memory Machine software. Used with Intel Optane persistent memory, Memory Machine fundamentally changes in-memory computing infrastructure. IT organizations depend on high-performance DRAM while coveting lower-cost and persistent memory. The Memory Machine engineering team answered with the industry’s first software-defined pools of DRAM and persistent […]
Storage
Exploiting the full potential of GPUDirect Storage with PCIe fabrics
By Vincent Haché, Technical Staff, FW Engineering, Microchip Technology Big data analytics and AI model training present huge challenges for processing with GPUs. Their datasets can be hundreds of terabytes requiring millions of file access on an equal number of files. As the pace of this data onslaught continues, it has become obvious that conventional […]
Floating-point library supports embedded variant of RISC-V core
SEGGER announces a new version of the RISC-V Floating-Point Library with full support for RV32E – the embedded variant of the RISC-V core. The new library leads to a massive reduction in code size for RISC-V applications using floating point. With all arithmetic functions hand-coded in assembly language, the memory footprint of RISC-V applications using […]
JEDEC-compliant, low-power DDR5 data buffers optimized for data center, server apps
Renesas Electronics Corporation announced a new high-speed, low-power DDR5 data buffer for data center, server, and high-performance workstation applications. Advancements over the past few years in real-time analytics, machine learning, HPC, AI, and other memory and bandwidth-hungry applications have fueled explosive growth in server memory bandwidth requirements. The new JEDEC-compliant DDR5 data buffer 5DB0148 from […]
Discrete graphics memory accelerates photorealistic 3D experiences at 1 terabyte per second
Micron Technology, Inc. announced the world’s fastest discrete graphics memory solution, GDDR6X, the first to power system bandwidth up to 1 terabyte per second (TB/s). Working with visual computing technology leader NVIDIA, Micron debuted GDDR6X in the new NVIDIA GeForce RTX 3090 and GeForce RTX 3080 graphics processing units (GPUs), which are tailored to support the fast […]
Advances in memory system architectures – Virtual Roundtable (part 2 of 2)
The second part of our Virtual Roundtable series on memories focuses on “advances in memory system architectures.” We are joined by Nando Basile (NB), Technology Marketing Manager for Memory with X-FAB, Bob Brennan (BB), Vice President of Emerging Memory at Micron. JS: What design challenges should system architects be aware of when employing persistent memory? […]
Emerging memory technologies – Virtual Roundtable (part 1 of 2)
Hosted by Jeff Shepard In this Virtual Roundtable session on emerging memory technologies, we are joined by Nando Basile (NB), Technology Marketing Manager for Memory with X-FAB; Bob Brennan (BB), Vice President of Emerging Memory at Micron; and Mark Reiten (MR), Vice President, Licensing Business Unit, Silicon Storage Technology (SST), a wholly-owned subsidiary of Microchip […]
NV memory optimized for Arm-based MPUs
Dialog Semiconductor plc announced the DA16600, a module that uniquely combines Dialog’s market-leading Wi-Fi and BLE capabilities into a single solution. This two-in-one module is comprised of two groundbreaking SoCs, the newly announced DA16200 and the SmartBond TINY DA14531, to provide best-in-class, low-power Wi-Fi and BLE for customers and further broaden Dialog’s IoT connectivity portfolio. […]
Memory-centric computing and memory system architectures
This three-part FAQ series began by considering “Memory Basics – Volatile, Non-volatile and Persistent.” Part two looked at “Memory Technologies and Packaging Options.” Recently developed persistent memory technologies, three-dimensional packaging for memories, advanced multicore processors, demands to process larger and larger datasets and databases, and artificial intelligence are driving the emergence of a new category […]
Memory technologies and packaging options
Solid-state memory devices are available in a wide variety of standard package styles that they have in common with other semiconductor devices, including DIP, TSSOP, DFN, WLCSP, and many others. And various packages are offered in plastic, glass, ceramic, and metal containing one or more devices. They are also available in hermetically-sealed packages and non-hermetic […]