DATA MODUL is expanding its carrier board portfolio in the embedded sector, bringing a universally applicable carrier board onto the market in the form of the eDM-CB-SM-IPCS. The new board is compatible with Intel’s latest Atom x6000E, Celeron, and Pentium (“Elkhart Lake”) processor platforms, as well as with future x86 generations and ARM platforms. Furthermore, […]
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Wi-Fi 6E MIMO antenna system optimized for IoT access points
The Antenna Company announced a new Wi-Fi 6E MIMO antenna system designed to increase network capacity, extend the range, and reduce latency in enterprise and industrial IoT networks. The antenna system enables simultaneous operation in the 2.4, 5, and 6 GHz frequency bands, resulting in an additional 1.2 GHz of the spectrum and a greater […]
SMARC board speeds development of HMI, AI IoT face/object detection, image processing
Renesas Electronics Corporation introduced a scalable System-on-Module (SoM) Smart Mobility ARChitecture (SMARC) Winning Combination board solution comprised of 10 Renesas ICs, including a microprocessor (MPU), power and analog ICs. The board solution speeds the development of artificial intelligence (AI) IoT face/object detection, image processing, and 4K video playback applications, including surveillance cameras, inspection equipment, and […]
IC supports in-vehicle network security via secure boot, firmware update, message authentication
Due to the rise of in-vehicle network connections like Bluetooth and LTE/5G, today’s vehicles host more vulnerabilities than ever before, driving new cybersecurity regulations and specifications for the automotive market. Helping OEMs and their module suppliers simplify the upgrade of existing designs to meet security requirements for future generations, Microchip Technology Inc. announced its CryptoAutomotive security […]
COM-HPC carrier board includes interfaces for programming, firmware flashing, reset
Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name […]
AMD Ryzen embedded V2000 CPUs now on COM express modules
Congatec significantly broadens the application areas of its AMD Ryzen Embedded processor-based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched on the COM Express Compact footprint. The new congatec conga-TCV2 powered by the new Ryzen Embedded V2000 processor impresses with […]
SOC design software features verification planning, memory-aware debug and performance analysis
Synopsys, Inc. announced the availability of the industry’s first Verification IP (VIP) for Compute Express Link (CXL) 2.0 designed for breakthrough performance in data-intensive system-on-chips (SoCs). CXL is the next-generation open standard interconnect that enables an ecosystem for high-speed communication between the CPU and workload accelerators, such as GPUs, FPGAs, and other purpose-built accelerator solutions, as well […]
Crystal clock oscillator operates over 1.6 to 3.63-V range
IQD Frequency Products has launched new tight stability and variable supply voltage crystal clock oscillator which operates with a supply voltage range from 1.6 V to 3.63 V. The IQXO-951 25TS series delivers a frequency stability performance down to ±5 ppm over the full industrial temperature range of – 40 to 85 degrees C. Housed […]
Dev kit speeds industrial Ethernet comm projects for CC-Link IE TSN systems
IAR Systems announces the availability of the new evaluation kit IAR KickStart Kit for Renesas’ R-IN32M4-CL3, assisting developers in the development and evaluation of R-IN32M4-CL3 IC for industrial Ethernet communication which supports CC-Link IE TSN targeted for smart factory applications. The CC-Link IE TSN is an open Industrial Ethernet (IE) technology from CC-Link Partner Association. […]
Latest release of ROS allow for rapid development, testing, debugging of distributed robotics system
Real-Time Innovations (RTI) announced the availability of the Connext 6 ROS Middleware Wrapper (RMW) Layer, bringing the field-proven, production-grade strength of RTI Connext 6 to the latest release of the Robot Operating System (ROS 2). Robotics software developers can now leverage the ROS 2 ecosystem together with RTI Connext Tools to more rapidly develop, test, and debug […]