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Connectivity combo chip leverages 28nm process technology to prolong battery life

September 25, 2017 By Aimee Kalnoskas Leave a Comment

Cypress Semiconductor Corp. announced a new combo solution that delivers ultra-low power Wi-Fi and Bluetooth connectivity to extend battery life for wearables, smart home products and portable audio applications. The new Cypress CYW43012  prolongs battery life by leveraging 28nm process technology to cut power consumption up to 70 percent in receive mode and up to 80 percent in sleep mode when compared to current solutions. The solution is IEEE 802.11a/b/g/n-compliant and 802.11ac-Friendly, meaning it is interoperable with 802.11ac access points using standard modes. This enables it to offer higher throughput and better energy efficiency, along with the enhanced security and coverage of 802.11ac Wi-Fi networks.

The CYW43012 combo chip’s advanced coexistence engine enables optimal combined performance for dual-band 2.4- and 5-GHz Wi-Fi and dual-mode Bluetooth/Bluetooth Low Energy (BLE) 5.0 applications simultaneously. The CYW43012 solution is supported in Cypress’ all-inclusive, turnkey, WICED Studio IoT development platform, which streamlines the integration of wireless technologies for developers.

“Battery life is a key differentiator for a wide range of connected devices, including wearables, smart home security cameras and wireless speakers; everyone wants a great connected experience for longer without having to recharge,” said Brian Bedrosian, vice president of marketing for the IoT Business Unit at Cypress. “Cypress’ new combo solution is a game-changer, setting a new standard for power consumption that makes long battery life with Wi-Fi a reality. The 802.11ac-Friendly capability combined with Cypress’ unmatched multi-radio coexistence engine provide cleaner air with high-fidelity connections and enhanced range, which is critical for the consumer experience in today’s world with a rapidly increasing number of wireless devices competing for airtime.”

The CYW43012 combo solution is currently sampling to lead customers. Full production is expected in the fourth quarter of 2017.

Filed Under: Applications, Connectivity, microcontroller Tagged With: cypresssemiconductorcorp

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