STMicroelectronics has extended its portfolio of FlightSense Time-of-Flight (ToF) sensors with the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene.
This first-of-its-kind product comprises a 940nm Vertical Cavity Surface Emission Laser (VCSEL) light source, a System-on-Chip sensor integrating a VCSEL driver, the receiving array of Single Photon Avalanche Diodes (SPADs), and a low-power 32-bit MCU core and accelerator running sophisticated firmware. The VL53L5 retains the Class 1 certification of all ST’s FlightSense sensors and is fully eye-safe for consumer products.
Housed in a miniature module, the VL53L5 ToF sensor contains optical elements in the receive aperture that creates 64 ranging zones, unlocking a host of new features and use cases.
With a vertically integrated manufacturing model for its FlightSense sensors, ST builds its SPAD wafers on a 40nm proprietary silicon process in the Company’s state-of-the-art 12” wafer plant at Crolles, France before assembling all of the module components in ST’s back-end plants in Asia. This approach delivers exceptional quality and reliability to customers.
Customer development with the VL53L5 can build on ST’s strong relationships with a key smartphone and PC platform suppliers as ST has pre-integrated the sensor onto these platforms. Android and Windows device drivers are also widely available for FlightSense products. The VL53L5 is in mass production with millions of units already shipped to leading wireless and computer manufacturers.
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