Server memory chipset adds telemetry and local power

Rambus has released the SOCAMM2 server chipset, a set of LPDDR5X memory interface devices for JEDEC-standard SOCAMM2 server modules that supports data rates up to 9.6 Gb/s and replaces soldered-down LPDDR memory with detachable, upgradable modules for AI server platforms. The chipset includes 12A and 3A voltage regulators for local power conversion and an SPD Hub with an internal temperature sensor that provides module identification, configuration and thermal telemetry over an I3C bus. Targeted at AI servers and other high-density data center systems, the devices are intended to improve power efficiency, serviceability and board-area use while supporting scalable memory architectures.