Advanced Thermal Solutions, Inc. now provides fanSINKS heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS, and other package types used in telecomm, optics, test/measurement, military, and other applications. ATS fanSINKS features cross-cut, straight aluminum fins. They support omnidirectional airflow for optimum […]
advancedthermalsolutions
Multi-sectional heat sinks outperform liquid cooling for high-power CPUs
Advanced Thermal Solutions, Inc., ATS, has introduced the QuadFLOW fansink, which uses directed airflow in multiple fin fields to cool electronic components up to 30% more effectively than the liquid cooling methods currently deployed in 1 and 2U commercial servers. Conventional heat sinks provide large amounts of cooling surface relative to their volumes. They work […]
