The Genio Pro, Genio 420 and Genio 360 IoT platforms from MediaTek are edge AI and embedded processors designed for IoT, robotics and machine vision systems. Built on a 3 nm process, Genio Pro integrates Arm Cortex-X925, Cortex-X4 and Cortex-A720 cores with an 8th generation NPU delivering over 50 TOPS, supports up to 16 cameras, […]
computing
MXM 3.1 Blackwell GPU modules span 45W to 150W for edge AI
The MXM embedded GPU modules from ADLINK Technology are MXM 3.1 Type A and Type B accelerator modules based on NVIDIA RTX PRO™ Blackwell architecture for edge AI and graphics workloads. The modules support power configurations from 45 W to 150 W, deliver FP32 performance up to 49.8 TFLOPS, include up to 24 GB GDDR7 […]
COM-HPC v1.3 standard supports PCIe Gen6, boosts high-performance computing
The COM-HPC® Revision 1.3 specification from PICMG updates the Computer-on-Module standard with support for PCI Express Gen 6 and Compute Express Link (CXL), enabling higher data throughput and coherent connectivity for memory and accelerator resources in embedded systems. The revision also adds support for MIPI-CSI C-PHY, Modern Standby (S0ix) power states, expanded GPIO and I2S […]
COM Express 3.1 Type 6 Compact modules support -40 to +85 °C industrial temperature range
The conga-TCRP1 from congatec is a COM Express Type 6 Compact module built on AMD Ryzen™ AI Embedded P100 Series processors, combining up to 6 Zen5/Zen5c CPU cores, a Radeon™ RDNA™ 3.5 GPU and an XDNA2 NPU delivering up to 50 TOPS for edge AI workloads. The module supports up to 96 GB DDR5-5600 memory […]
Expandable edge computer adds dockable PCIe module support
The NDiS B340 from NEXCOM is a fanless edge computer based on low-power Intel platforms including Amston Lake X series, Intel N97 and Intel Processor N150, designed with a dockable PCIe expansion option for scalable edge deployments. The system supports dual HDMI 2.0 4K@60Hz outputs, dual 2.5GbE LAN, rich industrial I/O and optional PCIe x4 […]
