congatec announces its new workload consolidation kit for vision-based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation […]
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SBC in 3.5-in format optimized for Gen 5 Intel Atom, Celeron, Pentium processors
congatec announces its brand new conga-SMC1/SMARC-x86 3.5-inch carrier board. The new size-optimized SMARC 2.1 carrier board in 3.5-inch form factor is application-ready and off-the-shelf deployable in small to mid-sized series in combination with any congatec SMARC Computer-on-Module available to date. Tailored to make 3.5-inch SBC designs modular, it is optimized for the Gen 5 Intel […]
Starter kit simplifies AI system development tasks
Congatec and the Japanese AI experts at Hacarus today unveiled the world’s first embedded computing kit for Artificial Intelligence (AI) that uses Sparse Modeling technology. Sparse Modeling needs little training data to make highly accurate predictions. This is an advantage for vision-based inspection systems, among others, because the reject rate is naturally lower when manufacturing […]
What is the COM Express standard?
The COM Express open standard, initially released in 2005, covers Computer on Modules (CO) and Single Board Computers (SBCs) under the auspices of the PCI Industrial Computer Manufacturer’s Group (PICMG), a consortium of equipment and system vendors, component suppliers, and end users for the embedded computer market. Open standards are not open source, but they […]
