A new 3D image sensor in the REAL3 chip family, based on Time-of-Flight (ToF) technology, makes possible the world’s smallest camera module for integration in smartphones with a footprint of less than 12 x 8 mm, including the receiving optics and VCSEL (Vertical-Cavity Surface-Emitting Laser) illumination. Compared to other 3D sensor principles, such as stereoscopic […]
infineontechnologies
Fully Certified FlexRay Transceiver With ESD Robustness for High-Speed In-Vehicle Communication
The new TLE9221SX is fully compliant to the most current FlexRay Electrical Physical Layer Specification version 3.0.1. It enables very high data rates of up to 10Mbit/s for in-vehicle communication and features best-in-class ESD rating of +/-10kV. As an interface between the communication controller unit and bus wires, the TLE9221SX transceiver was developed for use […]