New RFFE modules are designed for Bluetooth, Wi-Fi 6E, and the next-generation standard, Wi-Fi 7. The modules are designed for a wide array of device segments beyond smartphones – including automotive, XR, PCs, wearables, mobile broadband, IoT, and more. “With Qualcomm Technologies’ new products, we are extending our RFFE leadership into automotive and IoT, helping […]
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Wi-Fi 7 platform supports 320 MHz channel, 33 Gbps wireless interface capacity
The Wi-Fi 7-capable Networking Pro Series Gen 3 family of platforms is said to be the world’s highest performance Wi-Fi 7 network infrastructure platform portfolio commercially available. Building upon the multi-generation legacy of Networking Pro Series platforms, the products combine Wi-Fi 7 features with Qualcomm Technologies’ intelligent multi-channel management technologies to improve speeds, lower latency, […]
Smart cameras feature AI inferencing
The Qualcomm QCS7230 solution expands the Qualcomm Vision Intelligence Platform portfolio, driving the digital transformation of enterprise security and public safety segments, designed to help safeguard environments with smart devices at the connected intelligent edge. The new solution delivers superior AI inferencing at the edge, improving security and operation effectiveness with real-time edge compute, artificial […]
NB2 IoT chipset delivers low cost, ultra-low power in tiny 5.7mm x 5.7mm footprint
Given the radio technology’s power efficiency, cost savings, reliability, and global reach, Narrowband IoT (NB-IoT) promises to a standout for IoT applications. With an estimated 3.2 billion cellular IoT connections in 2024, Qualcomm Technologies, Inc. is placing bets on that promise with the introduction of their 212 LTE IoT modem. The one-chip device includes a […]
SoC aims at robotics apps with 4G/LTE connectivity, on-device ML
Qualcomm Technologies, Inc. announced its Qualcomm Robotics RB3 Platform – the company’s first integrated, comprehensive offering designed specifically for robotics. This purpose-built platform features ahighly optimized set of hardware, software and tools designed to help manufacturers to create the next generation of advanced consumer, enterprise and industrial robotics products. Based on the Qualcomm SDA/SDM845 system-on-chip (SoC), […]
5G PC platform includes 5G modem
Qualcomm Technologies, Inc. announced today at Mobile World Congress the PC industry’s first commercial 5G PC Platform, the Qualcomm Snapdragon 8cx 5G compute platform. Featuring the second-generation Qualcomm Snapdragon X55 5G modem, the Snapdragon 8cx 5G platform will help PC manufacturers take advantage of the global rollout of 5G networks. With the power and performance […]
First mobile platform with integrated 5G
Qualcomm Technologies, Inc. announced the Qualcomm Snapdragon Mobile Platform with 5G integrated into a System-on-Chip (SoC). Qualcomm is offering a newly integrated Snapdragon 5G mobile platform, which reinforces the Company’s role in providing the global mobile ecosystem with the flexibility and scalability needed for broad and fast 5G adoption. OEMs will be able to utilize the […]
5G CPE reference design covers sub-6 GHz, mmWave fixed wireless broadband products
Qualcomm Technologies announced its first 5G customer premise equipment (CPE) reference design for sub-6 GHz and millimeter wave (mmWave) 5G fixed wireless broadband (FWB) products. The reference design features the newly announced second-generation Qualcomm Snapdragon X55 5G modem and next-generation Qualcomm RF front-end (RFFE) components and modules for sub-6 GHz and mmWave deployments, providing a […]
Dev kit speeds creation of mesh Wi-Fi systems with Alexa built-in
Qualcomm Technologies, Inc. announced the industry’s first development kit for mesh Wi-Fi networks, qualified by Amazon, to integrate the Amazon Alexa Voice Service (AVS). The Qualcomm Mesh Networking Development Kit offers manufacturers the necessary building blocks to quickly and cost-effectively create mesh Wi-Fi systems with Alexa built-in, bringing the convenience of voice control to connected devices […]
Automotive cockpit platforms cover entry level, mid-tier, and super computing schemes
Qualcomm Technologies introduced its 3rd Generation Qualcomm Snapdragon Automotive Cockpit Platforms, with a new tiering system comprised of Performance, Premiere and Paramount classes for the entry-level, mid-tier and supercomputing platforms, respectively. The automotive industry is evolving at an unprecedented pace of innovation driven by the adoption of new technology. To keep up with this pace, and to help […]
