tdkcorporation

ToF sensor platform extends long-range sensing to 5 m

October 1, 2020 By Redding Traiger Leave a Comment

TDK Corporation announces the worldwide availability of the Chirp CH201 long-range ultra-low power integrated ultrasonic Time-of-Flight (ToF) range sensor platform. The solution includes the CH201 MEMS sensor, sensor modules, and developer kits – and accompanies Chirp’s original CH101 ultrasonic ToF sensor product. CH101 provides accurate range measurements for use cases scenarios of up to 1.2m, and the new CH201 builds to provide exact long-range measurements to targets at distances up to 5m. Chirp’s MEMS ultrasonic technologies leverage proprietary Time-of-Flight (ToF) range sensors in a 3.5 mm x 3.5 mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a low-power mixed-signal ASIC.

Following on CH101 as the first commercially available MEMS-based ultrasonic ToF sensor, CH201 is also ultra-low power and compact, provides millimeter-accurate range measurements, and works in any lighting condition, including full sunlight to complete darkness independent of the target’s color and optical transparency. Matching CH101, the CH201 has a configurable Field-of-View (FoV) and a flexible DSP capable of handling a variety of ultrasonic signal-processing algorithms.

The CH201 platform mirrors the flexibility of the CH101, offering flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence/proximity sensing, and object-detection/avoidance.

CH201: The CH201 MEMS sensor provides accurate range measurements to targets up to 5m away. Using ultrasonic time-of-flight measurements, the sensor works in any lighting condition, including full sunlight, and provides millimeter-level accuracy, independent of the target’s color and optical transparency.

DK-CH201: Developer Kit for prototyping with one or more ToF sensors. The DK-CH201 includes one CH201 with the option to add up to four additional ultrasonic modules.

EV_MOD_CH201-03-01: Easy-to-use module for rapid integration and evaluation of hardware designs. Different acoustic housings are available to adjust the field of view.

In a free downloadable white paper, TDK describes how tracking-solution providers can use Chirp’s ultrasonic time-of-flight technology to measure when users come into contact and notify those who may have been exposed to SARS-COV-2 when an infection does occur. Chirp provides a complete sensor API and reference design to make it easy for solution providers to quickly incorporate ultrasonic range-finding technology into their tracking solutions. The complete hardware and software reference design combines Chirp ultrasonic solutions along with a BLE-enabled MCU, for a complete social distancing solution including contact tracing.

The all-in-one sensor platform solution is now available from multiple distributors worldwide.

Stray-EMF position detection sensors cover ISO 11452-8 requirements

September 30, 2020 By Redding Traiger Leave a Comment

TDK Corporation announces the portfolio expansion of the Micronas masterHAL sensor family with the release of HAL 3970, a new stray-field robust 3D HAL position sensor. The sensor, suited for automotive and industrial applications, has highly accurate angular detection from 0° to 360°, linear position detection, and uses Short Pulse Code frames (SPC) to transmit the calculated position information. SPC is an enhancement of the standard SENT protocol according to SAE J2716. It enables data to be transmitted based on a trigger pulse sent by an external ECU, and it supports point-to-point connections as well as a single-wire bus mode with up to four sensors. Parameters such as unit time, frame format, trigger mode, slow channel format, rolling counter, and more, are easily configurable. For example, HAL 3970 can be used for stray-field robust angle detection in steering-wheel position applications. Samples will be available in the fourth quarter of 2020.

Each sensor within the HAL 39xy sensor family is based on the patented 3D HAL pixel cell technology. HAL 3970 uses a special array of Hall plates for high-accuracy measurement of vertical and horizontal magnetic-field components. Due to the sophisticated arrangement of these Hall plates, the sensor detects angles up to 360 degrees and suppresses external magnetic stray fields. Only a simple two-pole magnet is required to determine the rotation angle. Ideally, the magnet should be placed above the sensitive area in an end-of-shaft configuration. The sensor also supports stray-field robust off-axis measurements.

The on-chip signal processing of HAL 3970 calculates the angle out of the magnetic-field components and converts this value into a digital output value. The sensor features a powerful DSP and an embedded microcontroller. The DSP is responsible for fast signal processing, while the microcontroller performs the interface configuration and supervision of the functional safety-related tasks.

Primary characteristics like gain and offset, reference position, etc. can be adjusted to the magnetic circuitry by programming the non-volatile memory. HAL 3970 is defined as SEooC (Safety Element out of Context) ASIL B-ready, according to ISO 26262. HAL 3970 is available in the eight-pin SOIC8 SMD package.

Ultrasonic ToF sensor platform handles range-sensing tags to enable social distancing

September 19, 2020 By Aimee Kalnoskas Leave a Comment

TDK Corporation announces the worldwide availability of the Chirp CH101 ultra-low power integrated ultrasonic Time-of-Flight (ToF) range sensor platform solution, which includes the CH101 MEMS sensor, sensor modules, and developer kits. Chirp’s MEMS ultrasonic technology leverages a proprietary Time-of-Flight (ToF) range sensor in a 3.5 mm x 3.5 mm package that combines a MEMS ultrasonic transducer with a power-efficient digital signal processor (DSP) on a low-power mixed-signal ASIC. As the first commercially available MEMS-based ultrasonic ToF sensor, it is ultra-low power, compact, immune to lighting conditions and target composition/color, has a configurable Field-of-View (FoV), and a flexible DSP capable of handling a variety of ultrasonic signal-processing algorithms.

The CH101 enables flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence/proximity sensing, object-detection/avoidance, material composition, as well as wearable range-sensing tags to enable social distancing and contact tracing to help people remain safely distanced from one another, during COVID-19 and other scenarios.

Sensor platform solution:

• CH101: The CH101 MEMS sensor provides accurate range measurements to targets up to 1.2m away. Using ultrasonic time-of-flight measurements, the sensor works in any lighting condition, including full sunlight, and provides millimeter-level accuracy, independent of the target’s color and optical transparency.
• DK-CH101: Developer Kit for prototyping with one or more ToF sensors. The DK-CH101 includes one CH101 with the option to add up to four additional ultrasonic modules.
• EV_MOD_CH101-03-01: Easy-to-use module for rapid integration and evaluation of hardware designs. Different acoustic housings available to adjust the field of view.
• MOD_CH101-03-02: Complete module solution with a 45° FoV acoustic housing and IP5 particle ingress filter for rapid mass production and accelerated time to market

Ensuring safe social distancing in the workplace is one piece of the puzzle in the age of COVID-19. Tracking-solution providers can use Chirp ultrasonic ToF sensors to detect proximity breaches and provide warnings before crossing social distancing guidelines. Chirp provides a complete hardware and software reference design to make it easy for solution providers to quickly incorporate ultrasonic range-finding technology into their tracking solutions.

Multi-sensor IoT modules sport BLE, WiFi connections

July 15, 2020 By Aimee Kalnoskas Leave a Comment

TDK Corporation announces worldwide availability of the InvenSense SmartBug, a compact, wireless multi-sensor solution designed for a plethora of commercial and consumer IoT applications. The out-of-the-box solution enables quick and easy access to reliable and smart sensor data without the need for programming, soldering or extra modifications. SmartBug is an all-in-one sensor module that integrates TDK’s 6-axis IMU (gyroscope + accelerometer) with magnetometer, pressure, temperature, humidity and ultrasonic sensors, and high-precision algorithms. These algorithms include sensor fusion, HVAC filter monitoring, asset monitoring, gesture detection, activity classification, air mouse monitoring and smart door open/close detection.

The SmartBug module enables accurate and remote monitoring via both BLE and WiFi, and provides autonomous SD card data logging capability for IoT applications with large data volumes. With its small size, flat base and wireless features, the SmartBug is a perfect one-size-fits-all solution that can be stuck almost anywhere, from a simple door to an industrial robot, providing high-quality remote data collection.

The all-in-one sensor solution is currently stocked at TDK’s distribution partners including Arrow, Avnet, DigiKey, Mouser, Symmetry and Components Distributors Inc. (CDI).

Low-power pulse density modulation mic targets mobile, IoT and consumer devices

June 16, 2020 By Aimee Kalnoskas Leave a Comment

TDK Corporation introduces the InvenSense T3902, the world’s lowest power Pulse Density Modulation (PDM) microphone for mobile, IoT and other consumer devices. The T3902 is an ultra-low power, low noise, multi-mode bottom-port MEMS microphone, enhancing voice-based services which are now commonplace in many devices and homes.

The microphone offers an exceptionally efficient 185 µA ultra-low power mode, high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a 3.5 mm x 2.65 mm x 0.98 mm package. The microphone’s AlwaysOn functionality in low-power mode enables immediate accessibility upon wake command.

TDK’s new T3902 microphone enables OEM partners to differentiate their product offerings by improving the consumer experience with reduced power consumption. This is especially critical to wearable and IoT designs where reduced board space and battery size are key factors to enabling a small form factor as well as providing a flexible and efficient (low power AlwaysOn) system design.

The InvenSense T3902 is available from multiple distributors worldwide.

Orientation sensor combines 3-axis gyroscope and 3-axis accelerometer

May 8, 2020 By Aimee Kalnoskas Leave a Comment

TDK Corporation announces the availability of the InvenSense ICM-42688-P high-performance motion sensor, a 6-axis MEMS MotionTracking device that combines a 3-axis gyroscope and a 3-axis accelerometer in a 2.5mm x 3mm x 0.9mm package. The device enables high-precision motion-sensing applications such as robotics, wearable devices, drones, and many other IoT devices.

Compared to traditional consumer-grade IMUs, the ICM-42688-P provides a 40% lower noise-figure and improves temperature stability by 2x, ensuring any motion event is measured with the highest accuracy, independent of temperature changes. The ICM-42688-P also includes two key innovations not available in any other consumer-grade IMU: a 100% accurate clock that eliminates timing errors and a high-resolution analog-to-digital converter. The converter enables an 8x increase in gyroscope resolution and a 4x increase in accelerometer resolution. Other industry-leading features include the InvenSense on-chip APEX Motion Processing Engine for gesture recognition, activity classification, and pedometer, along with programmable digital filters, and an embedded temperature sensor.

A comprehensive development platform, the DK-42688-P, along with necessary software is available to enable quick-to-market development of customer systems.

The DK-42688-P features:
• Single Board “Out of the Box” experience
• Comprehensive software tools to expedite evaluation and development
o MotionLink and embedded motion driver (eMD)
• On-board embedded developer tools to help with code development
• 15-minute setup time

The InvenSense ICM-42688-P and DK-42688-P developer kit are available from multiple distributors.

Gyroscope/accelerometer combo enables high-precision motion sensing

May 5, 2020 By Aimee Kalnoskas Leave a Comment

A comprehensive development platform, the DK-42688-P, along with necessary software is available to enable quick-to-market development of customer systems.

The DK-42688-P features:

Single Board “Out of the Box” experience
Comprehensive software tools to expedite evaluation and development
- MotionLink and embedded motion driver (eMD)
On-board embedded developer tools to help with code development
15-minute setup time

The InvenSense ICM-42688-P and DK-42688-P developer kit are available from multiple distributors.

Fault-tolerant inertial measurement unit targets industrial apps

January 7, 2020 By Aimee Kalnoskas Leave a Comment

TDK Corporation launches a new high performance and fault-tolerant InvenSense inertial measurement unit (IMU) family targeted at industrial applications. The new products, IIM-46234 and IIM-46230, include multiple 6-axis sensors, each of which can measure three dimensions of linear acceleration and three dimensions of rotational rate.

With its ability to take precise measurements in harsh environments characterized by the presence of vibration and wide temperature variations, the IIM-4623X product family is applicable to a variety of navigation and stabilization applications including precision agriculture, construction machinery, aerial vehicles, and industrial robots. An example application would be a construction vehicle that can combine IIM-4623X measurements with data from a global navigation system, such as GPS, to determine precise position, attitude, and motion in real-time. Such real-time information is crucial for increased automation, efficiency and safety of mobile industrial machinery. The new family also integrates TDK’s unique SensorFT feature for fault tolerance.

IIM-46234 and IIM-46230 products deliver:

Precise measurements enabled by highly accurate and ultra-low noise sensors
Factory calibration ensuring that the measurements are reliable over a wide temperature range
A microsecond accurate timestamp with all the sensor measurements enabling accurate time transfer with rest of the system

TDK customers can combine the high-performance industrial IMU family with the InvenSense Coursa Drive software to deliver a market-ready inertial navigation system (INS) with minimal development cost and resources. In real-time, Coursa Drive provides high-rate, 100 Hz delta positions and orientation to the AV system, complementing the lower-rate position references from GNSS and perception systems. For improved system fault-tolerance, Coursa Drive can provide decimeter position precision for short periods when the GNSS or perception systems are uncertain or unavailable.

Dev kit helps integrate sensors onto robotic platforms

January 7, 2020 By Aimee Kalnoskas Leave a Comment

TDK Corporation announces RoboKit, a new development kit that enables seamless integration of solutions from TDK’s portfolio designed for the robotics market. RoboKit integrates key TDK offerings such as InvenSense ICM-42688-P 6-axis IMU, InvenSense ICP-10111 capacitive barometric pressure sensor, InvenSense ICS-43434 multi-mode digital microphone, Chirp CH-101 and CH-201 ultrasonic ToF sensors, and Micronas motor controller, angle sensor, and position sensors.

The robotics market is one of the seven key market segments of TDK, with a dominant footprint in typical robotic systems such as sensors, controllers, batteries, and components. TDK delivers solutions that meet the rigorous demands of the robotics market, such as heading accuracy of under 10 degrees per hour using InvenSense IMUs and RoboVac software, market-ready inertial navigation system (INS) from Coursa Drive, robust obstacle detection for any color objects in all lighting conditions using Chirp ultrasonic ToF sensor, in addition to robot joint control using Micronas motor controllers. Also included are a temperature sensor and magnetometer.

Additionally, the TDK RoboKit software integrates with the leading robotic operating system, ROS. ROS-ready drivers for IMU and ultrasonic range sensor are available now.

TDK and Qualcomm Technologies also announce the compatibility of TDK RoboKit with the Qualcomm Robotics RB3 platform. Fundamental to every type of robot are three operations: sensing, thinking, and acting. With TDK providing the “sensing” and “acting” operations through its extensive portfolio of sensors and software, and Qualcomm Technologies enabling the “thinking” operation through the power and performance of the Qualcomm SDA845 processor, the TDK RoboKit platform offers seamless integration for development and support across multiple robotics applications.

The TDK RoboKit is available to select early partners and customers. General availability is expected in the second half of 2020.

Haptic feedback eval kits help wring out piezo actuators

June 25, 2019 By Aimee Kalnoskas Leave a Comment

TDK has announced two evaluation kits that provide an initial impression of the varied possibilities of haptic feedback that can be realized with PowerHap piezo actuators.

The BOS1901-Kit development kit is designed for and includes three 60 V actuators. The ordering code for the kit is Z63000Z2910Z1Z44. The board is based on the CapDrive™ driver architecture from Boréas Technologies, a developer of ultra-low-power haptic technologies with which TDK Electronics has signed a cooperative agreement. The main features of the BOS1901 piezoelectric driver are its small dimensions, low current consumption and fast response times.

The second evaluation kit is suitable not only for the 60 V PowerHap types, but also the 120 V types, and is available in two versions: A driver for one actuator (Z63000Z2910Z1Z1), and driver for up to five actuators (Z63000Z2910Z1Z7). These kits likewise contain three types of PowerHap actuators.

Both kits feature a USB interface and offer extensive setting options with regard to voltage amplitude, frequency, pulse repetition rate, signal shape and sensor functionality.