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Haptic feedback eval kits help wring out piezo actuators

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Haptic feedback eval kitsTDK has announced two evaluation kits that provide an initial impression of the varied possibilities of haptic feedback that can be realized with PowerHap piezo actuators.

The BOS1901-Kit development kit is designed for and includes three 60 V actuators. The ordering code for the kit is Z63000Z2910Z1Z44. The board is based on the CapDrive™ driver architecture from Boréas Technologies, a developer of ultra-low-power haptic technologies with which TDK Electronics has signed a cooperative agreement. The main features of the BOS1901 piezoelectric driver are its small dimensions, low current consumption and fast response times.

The second evaluation kit is suitable not only for the 60 V PowerHap types, but also the 120 V types, and is available in two versions: A driver for one actuator (Z63000Z2910Z1Z1), and driver for up to five actuators (Z63000Z2910Z1Z7). These kits likewise contain three types of PowerHap actuators.

Both kits feature a USB interface and offer extensive setting options with regard to voltage amplitude, frequency, pulse repetition rate, signal shape and sensor functionality.

Ultrasonic 6-DoF position and orientation tracking controller for VR apps

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TDK Corporation expands its Chirp Microsystems ultrasonic product portfolio with Chirp SonicTrack, an ultrasonic six-degree-of-freedom (6-DoF) controller tracking solution for all-in-one (AIO) virtual reality (VR) systems. Chirp SonicTrack is an inside-out tracking system that fuses ultrasonic and inertial sensor data to provide 6-DoF position and orientation tracking of a hand-held controller with sub-millimeter precision over a field of view (FoV) of over 240 degrees. The first VR system to use the SonicTrack tracking solution is the developer kit of HTC’s Vive Focus all-in-one VR system, where Chirp-enabled 6-DoF controllers allow users to experience immersive VR content with a standalone headset.

Powered by Chirp’s tiny, ultra-low power ultrasonic transceiver product, the CH-101, Chirp SonicTrack is the only inside-out tracking solution on the market today based on true 3D position information. The position tracking system utilizes sonar by transmitting ultrasonic pulses between CH-101 sensors inside the VR system’s head-mounted display (HMD) and the hand-held controllers, providing 3D position information of the controllers relative to the HMD. Competing camera-based solutions have only 2D image data, requiring computation-intensive image processing from multiple cameras to estimate 3D position information. Chirp’s true 3D ultrasonic sensing advantage results in a solution that is much lower power and better optimized for the mobile processors used in all-in-one VR/AR/XR systems. The CH-101’s omnidirectional response makes it easy to track controllers over an extremely wide field of view – another advantage over camera-based systems.

Chirp SonicTrack is designed to enable VR system providers to introduce their own 6-DoF controllers with fast time-to-market. Chirp supplies a hardware reference design and the complete software stack, including a state-of-the-art sensor fusion software library. Relative to a 3-DoF controller design, a Chirp SonicTrack 6-DoF controller requires only the addition of CH-101 ultrasonic sensors. The small size of these sensors gives customers flexible industrial design options for VR controllers and HMDs. The Chirp SonicTrack sensor fusion software library uses minimal processor resources and is ready for use on Qualcomm Snapdragon and other mobile processors.

Chirp Microsystems, a TDK group company, will showcase the Chirp SonicTrack platform, along with a comprehensive portfolio of sensors, electronic components and solutions for mobile, wearables, AR/VR, automotive, IoT and industrial applications at the Consumer Electronics Show in Las Vegas, Nevada this January 8 – 11, 2019. See the exhibition in LVCC, South Hall 3, Booth #30306.

Sensor array targets next-gen virtual reality apps

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ICM-20602 sensor arrayTDK Corporation announced the launch of a complete portfolio of VR sensors enabling a new class of highly accurate and affordable all-in-one VR solutions. The key platform components are:

  • InvenSense ICM-42688 6-axis motion sensor for HMDs provides the lowest noise figure in the industry and features the only high-resolution measurement mode, enabling the measurement of VR headset movement with unprecedented accuracy.
  • InvenSense ICM-42686 6-axis motion sensor for VR controllers provides the industry’s only extended range motion measurement mode, enabling the accurate tracking of the handheld controller movement at any speed.
  • Chirp Microsystem’s ultralow power CH-101 ultrasonic transceiver coupled with Chirp’s SonicTrack™ system is the only time-of-flight based inside-out tracking solution for all-in-one VR systems that delivers true 3D positioning between the head-mounted-display and the handheld controllers.
  • TDK Sensor Fusion software that processes the sensor inputs simultaneously to create a simple, fused output that describes the exact 3D position and movement of all VR HW components and runs on commercial application processors.
  • TDK TMR sensing elements that enable magnetometers with significantly higher resolution than traditional Hall-effect based magnetometers, thereby enabling the exact determination of the orientation changes of the HMD and controllers.

The key sensor requirement for any VR system is the precise alignment between the Head-Mounted-Display (HMD) and the Handheld Controllers. This means that even the slightest head or the most extreme hand movement needs to be measured fast and accurately, to allow the immediate rendering of the changed VR scenery. Even small misalignments between the HMD and controllers can severely impact the user experience and eventually lead to game-over “motion sickness”.

In addition to the excellent performance of the VR sensor platform, TDK all-in-one VR platform also sets new standards with respect to small size, low weight, and reduced Bill-of-Materials (BOM), which taken together enable the most affordable and wearable all-in-one VR systems in the industry.

Programmers handle magnetic Hall effect sensors

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Magnetic Sensor Programmer MSP V1.0TDK Corporation expands its tool chain for the easy programming of various Micronas Hall-effect sensors with the Magnetic Sensor Programmer MSP V1.0. It replaces the APB 1.5 and complements the existing programmer line, which comprises the USB-Programming Kit V1.01 and the HAL APB V5.1. These programmers are specially designed for use in the development laboratory. TDK now offers three dedicated tools supporting all programmable Micronas sensors. The Magnetic Sensor Programmer is available from mid-September and can be ordered via TDK-Micronas’ sales offices or one of its distribution partners listed on www.micronas.com/sales.

The new Magnetic Sensor Programmer is suitable for all members of the product families HAL 18xy, HAL/R 24xy, HAL 28xy, HAL/R/C 37xy as well as forthcoming angular sensors. The devices are mainly applied in automotive applications for position detection or angle measurement, and amongst others, in throttle valves, accelerator pedals, EGR, neutral-gear recognition, transmission gear sensor, bending lights and steering-angle applications. Additionally, in the field of industrial electronics, the programmable linear sensors HAL 18xy and HAL 24xy are used for current measurement, joysticks, rocker switches, and for manifold extended position measurement scenarios.

To optimize the system performance in these customer applications, an individual programming of the sensor is necessary. Therefore, TDK offers the corresponding hard- and software. Compared to its predecessor, the Magnetic Sensor Programmer is able to drive higher currents and to handle latest Micronas sensors with PSI5-output. The Magnetic Sensor Programmer can simply be connected to a PC via its RS-232 or USB interface. TDK provides dedicated software supporting a command interface for the communication with a PC. This allows the implementation of specific PC software for engineering purposes or development. For each of the programmable Hall sensor families, a specific software exists providing a graphical user interface based on LabViewTM. Customers currently using APB 1.5 can easily switch to the new Magnetic Sensor Programmer, which is compatible to previous software versions. This easy way of programming offers customers improved productivity and optimized sensor performance.

The programming software for the different sensor families is provided for free. After registration, it can be downloaded from TDK-Micronas’ online service portal service.micronas.com.

Angle sensors boast only ±0.05 ° error at room temperature

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Angle sensorsTDK Corporation is expanding its portfolio of TMR angle sensors with the TAD2140 type in a TO-6 package for automotive and industrial applications. The new sensor provides an innovative system-in-package solution for PCB-less applications. It includes two full TMR bridges, a dedicated ASIC for signal conditioning and integrated passive components. Like all of TDK’s TMR sensors, the TAD2140 features an angle accuracy of ±0.2 °, achieving the world’s smallest angle error of only ±0.05 ° at room temperature. The sensors are capable of contactless sensing from 0 ° to 360 ° over a temperature range of −40 °C to +150 °C. The sensor’s fast response, high angular accuracy, and advanced compensation algorithms make it ideal for the optimization of motor control applications such as BLDC motor commutation. Moreover, thanks to its small package size, the sensor is perfectly suited for applications with limited available space, such as steering motor commutation. Samples will be available from the third quarter of 2018. Start of production is planned for the third quarter of 2019.

The TAD2140 comes in a new TO-6 package that integrates six capacitors and one resistor. The sensor can be welded or soldered directly onto a package lead, a connector or a terminal, eliminating the need for a PCB, thus reducing total system size and cost. Furthermore, by using fewer external components and lowering the number of solder joints, thus improving the long-term reliability of the overall system.

The TAD2140 uses an embedded DSP from ICsense, an ASIC design specialist that TDK acquired in March 2017. Thanks to the integrated static and dynamic compensation functions of the ASIC, design-in effort is considerably reduced. The sensor can compensate any drifts of gain, offset or orthogonality as well as mechanical non-idealities like magnet tilt or displacement. In addition, the implemented algorithms allow higher assembly tolerances of mechanical components or increase of the system performance with existing solutions. The ASIC provides several digital outputs such as Hall emulation (UVW), encoder (ENC), pulse-width modulation (PWM), and SENT on two interfaces simultaneously. Furthermore, its various internal diagnostic features make it suitable for demanding automotive applications where functional safety is required (ASIL B rating).

Multidimensional magnetic field sensor targets safety-critical ISO 26262 apps

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magnetic field sensor TDK Corporation  expands its Micronas Dual-Die Hall-effect sensor portfolio with the HAR 379x magnetic field sensors for multidimensional measurements in safety-critical automotive applications according to ISO 26262 rules and in industrial applications. The new sensors come with a digital output: besides pulse-width modulation (PWM) output, the SENT protocol according to the latest generation of SAEJ2716 (rev. 4) is also supported. HAR 379x is the Dual-Die SMD package version of the HAC 37xy family using the proprietary Micronas 3D HAL technology for detecting angles in a range between 0° and 360° (end-of-shaft and through-shaft setup) as well as linear movement or position. Samples will be available from July 2018. Start of production is planned for the first quarter of 2019.

The HAR 379x sensors’ versatile programming characteristics and its high accuracy make the HAR 379x the perfect system solution for gear selector applications – especially because of the possibility to provide the magnetic field amplitude in combination with the angle information. Both parameters are made available via the fast channel of the SENT interface. Additionally, the magnetic field amplitude information enables the required push-functionality. The device fits perfectly into applications where linear movements have to be measured, e.g. in dual-clutch transmission applications, for clutch pedal position detection, as engine stroke sensor, for transmission position measurement, or for cylinder and valve position sensing.

Each HAR 379x sensor contains two dies operating fully independently. The two dies are placed upon each other in a way that they are still mechanically separated and electrically insulated from one another. Both sensitive elements are very close to each other thanks to the selected advanced assembly technology. The advantage is that the two Hall elements measure almost the same magnetic field, therefore ensuring synchronous output signals. Redundant sensor solutions in a single package reduce system costs while at the same time increasing the reliability of the system due to smaller PCBs and less solder joints. The HAR 379x is available in a very small eight-pin SOIC8 package.

Conventional planar Hall technology is only sensitive to the magnetic field orthogonal to the chip surface. By developing its 3D HAL technology, Micronas enabled the integration of vertical Hall plates into the standard CMOS process. Thus, evaluating the relative strength out of the horizontal and vertical magnetic field components became feasible – the key for excellent angular performance. HAR 379x are dual-die integrated circuits with full redundant signals. Each sensor includes a so-called pixel cell, consisting of two vertical (BX, BY) and one horizontal (BZ) Hall plate with spinning current offset compensation for detection of X, Y or Z magnetic field components at one point. Magnetic field lines in parallel to the sensor surface are detected by the vertical Hall elements, whereas the component perpendicular to the chip surface is captured by the horizontal Hall element. HAR 379x sensors allow temperature-stable position measurements with high accuracy at reduced system cost. Furthermore, each sensor includes a signal processor for calculation and signal conditioning of two magnetic field components, protection devices, PWM and SAEJ2716 SENT output.

SMD pulse transformers for Gigabit Ethernet and PoE

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TDK Corp. has expanded the ALT4532 series of pulse transformers with new types for Gigabit Ethernet and Power over Ethernet (PoE) applications. The new ALT4532P type is designed for emerging 2.5GBASE-T (2.5 Gbit/sec) and 5GBASE-T (5 Gbit/sec) LAN applications as well as 1000BASE-T (1 Gbit/sec) applications with 600-mA PoE. The new ALT4532H type is compatible with the 10GBASE-T standard (10 Gbit/sec).

The components feature a compact SMD package with dimensions of 4.5×3.2×2.9 mm. Mass production of tdk pulse transformersthe new pulse transformers was launched in February 2018.

Unlike conventional products with toroidal shaped cores, the new TDK transformers feature a special core design that is optimized for fully-automated production and winding processes, resulting in extremely stable quality. The discrete ALT4532 types offer designers greater flexibility for circuit board layouts than conventional LAN modules that combine pulse transformer and common-mode filters in a single package, for example, enabling mounting on both sides of the PCB.

TDK Corp. of America RF Solutions, 1101 Cypress Creek Road, Cedar Park, TX 78613, (512) 258-9478, product.tdk.com/info/en/catalog/datasheets/090007/trans_alt4532p_en.pdf, product.tdk.com/info/en/catalog/datasheets/090007/trans_alt4532h_en.pdf

Low-noise MEMs microphones target IoT apps

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TDK Corporation announces an expansion of its ultra-low noise MEMS microphone family with the ICS-40740, delivering 70 dB (A) SNR with 133 dB sound pressure level Acoustic Overload Point. The low self-noise coupled with wide dynamic range makes the ICS-40740 ideal for voice controlled IoT applications, especially those with integrated loudspeakers, as well as wearable applications like noise canceling headsets.

MEMs microphonesA microphone’s Signal to Noise Ratio (SNR) has long been recognized as a key specification to enable far-field voice capture. But as the smart speaker market has shown, the capability of these microphones to operate in a very loud environment is also critical to enable the user to interrupt loud audio with spoken commands. The ICS-40740 performs in both demanding respects.

Beyond simple SNR and dynamic range, the ICS-40740 performs across a very wide frequency band, from 80 Hz to 20 kHz. The sensitivity tolerance of ±1 dB also makes it ideal for use in an array with very consistent performance from unit to unit.

Wearable noise-canceling applications are also a fit for the ICS-40740. With a 4 mm by 3 mm by 1.2 mm package and consuming only 155 uA in operation, the ICS-40740 fits both the size and power budget of a noise-canceling headset.

The ICS-40740 is sampling now to select customers and is slated for production in the second quarter of 2018. The ICS-40740 leverages a proven, robust supply chain for fabrication, packaging and test for smooth launch into high volume consumer applications.

TDK Corporation and its group companies EPCOS, InvenSense, and TDK-Micronas will be showcasing the ICS-40740 MEMS microphone and additional innovative sensor solutions in Booth 30325, South Hall 3 of the Las Vegas Convention Center at CES® 2018, January 9-12

More information:  www.invensense.com; InvenSense Sales at sa…@invensense.com. , Las Vegas, Nevada, USA.

Low-power barometric pressure sensor targets smartphones, IoT apps

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TDK Corporation announces the InvenSense ICP-10100, an ultra-low noise and ultra-low power MEMS capacitive barometric pressure sensor. The ICP-10100 achieves the industry’s lowest pressure noise* of 0.4 Pa RMS, attains the industry’s lowest power consumption of 1.3 µA, and ensures excellent temperature stability with a temperature coefficient of ±0.5 Pa/°C.

The capacitive pressure sensor can measure extremely small pressure differences of ±1 Pa, enabling the ICP-10100 to detect altitude changes of less than 5 cm. With a temperature coefficient of ±0.5 Pa/°C, the MEMS capacitive temperature stable pressure sensor can operate over wide temperature ranges and a variety of applications.

The combination of high accuracy, low power, temperature stability, and waterproofing in a small package footprint enables improved activity identification, mobile indoor/outdoor navigation, altitude-hold in drones, and extends battery life of always-on motion sensing applications.

“InvenSense recently released the ICM-20789, the industry’s first 7-axis (3-axis accel, 3-axis gyro, 1-axis pressure) targeting the drone and wearable markets,” said Amir Panush, InvenSense Vice President and General Manager of the Motion and Pressure Business Unit. “The ICP-10100 expands our footprint into additional market segments of consumer electronics, IoT, and mobile – enabling our customers to achieve new use cases not possible with previous technology due to improved motion sensing capabilities.”

InvenSense ICP-10100 is currently available in wide distribution. In addition to the ICP-10100 in a 2 x 2 x 0.72 mm 1.5 m waterproof package, InvenSense is sampling to strategic customers the ICP-101xx pressure sensor family in a 2 x 2.5 x 0.92 mm industry-standard package footprint, and the entire ICP-101xx pressure sensor family will be available in wide distribution in February 2018.

More information: https://www.invensense.com/products/1-axis/icp-101xx/ or contact InvenSense Sales at sa…@invensense.com.

High-accuracy three-axis magnetometer features low RMS noise and current consumption

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A highly accurate three-axis magnetometer combines an extremely sensitive tunnel magneto-resistive (TMR) element developed by TDK and an advanced electronic compass ASIC designed by AKM in a small package. The new TMR magnetometer on a chip, which has miniature dimensions of just 1.6×1.6×0.6 mm, features the industry’s lowest RMS noise of just 40 nT-rms and a current consumption of only 40 µA at an output data rate of 100 Hz.

Thanks to its high sensitivity of 10 nT/LSB, the magnetic sensor can precisely detect minute changes tdk magnetometerin magnetic fields, enabling the highly accurate detection of both position and orientation with the help of the Earth’s magnetic field or a magnetic field generator. These qualities make the TMR magnetometer a candidate for compact electronic devices such as smartphones, tablets, game console controllers and all kinds of wearable devices, as well as other applications that demand high position and orientation precision such as virtual, augmented or mixed reality (VR, AR, and MR) or indoor navigation. The new three-axis magnetic sensor is also suitable for integration into IoT devices, for which strong market growth is expected.

Main applications include compact electronic devices such as smartphones, tablets and game console controllers, all kinds of wearable devices or IoT devices, and any applications that demand high position and orientation precision such as virtual, augmented or mixed reality (VR, AR, and MR) or indoor navigation

TDK U.S.A. Corp., 455 RXR Plaza, Uniondale, NY 11556, (516) 535-2600, http://www.tdk.com/