Teledyne HiRel Semiconductors has released an industrial-grade embedded multimediacard (eMMC) module. The device provides 128GB of eMMC 5.1-compliant storage in a 153-ball FBGA package designed for operation in demanding environments. The module operates across the industrial temperature range of –40°C to +85°C, making it suitable for embedded applications in aerospace, defense, industrial automation, and edge […]
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Enhanced product DDR4-3200 module targets embedded platforms
Teledyne HiRel Semiconductors announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C. The TDD416Y12NEPBM01 is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint – smaller than a postage stamp. Packaged […]
