A new kind of flash memory is optimized specifically to handle the hostile environment imposed on electronics in vehicular uses. Leland Teschler | Executive Editor You’d have to say the NAND flash memory had an inauspicious beginning. Invented in 1987 by Toshiba, the first NAND flash chip didn’t sell until 1995 when it finally found […]
toshibamemorycorporation
First UFS Ver. 3.0 embedded flash memory devices become available
Toshiba Memory America, Inc. says it has started sampling the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new lineup utilizes the company’s cutting-edge 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128 gigabytes, 256 GB and 512 GB. With high-speed read/write performance and low power […]
New flash memory chip holds 1.33 terabits with four bits/cell
Toshiba Memory America, Inc. (TMA) announced the development of a prototype sample of 96-layer BiCS FLASH, its proprietary three-dimensional (3D) flash memory, with 4-bit-per-cell (quad level cell, QLC) technology. With this milestone achievement, Toshiba demonstrates its technology leadership in the storage market by delivering technology that boosts single-chip memory capacity to the highest level yet achieved1. […]
Universal FLASH storage devices use 64-layer BiCS FLASH 3D memory
Toshiba Memory America, Inc. (TMA) has begun sampling Universal Flash Storage (UFS) devices[ utilizing its cutting-edge 64-layer BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets and augmented /virtual reality systems. The new lineup will be […]
3D flash memory uses through-silicon via technology
Toshiba announced the development of the world’s first[ BiCS FLASH three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased […]
