SSDs play in high-end workstation PCs and gaming systems apps

Toshiba Memory America, Inc. announced the XG6-P solid state drive (SSD) series, a derivative of its NVMe M.2-based XG6 Series featuring class-leading write performance. Offering up to 2,048 gigabytes (GB) of capacity, XG6-P SSDs are ideal for high-end workstation PCs and gaming systems, as well as cost-optimized data center and composable infrastructures. With over 30 percent higher sequential and random write speeds and over 15 percent higher random read speeds than its predecessor, the XG6-P Series enables enhanced application performance and data access

Leveraging Toshiba Memory’s 96-layer BiCS FLASH 3D TLC (3-bit-per-cell), XG6-P SSDs provide high storage capacity, while maintaining the promise of ultra-thin, high-speed storage with exceptional power efficiency. The XG6-P Series features a PCIe Gen 3 x4 lane (rev. 3.1a) interface and delivers up to 3,180 megabytes per second (MB/s) of sequential read and 2,920MB/s of sequential write, and up to 355,000 random read and 365,000 random write IOPS. Furthermore, XG6-P SSDs operate at less than 5 watts, providing an excellent performance-to-power ratio in a dense, compact footprint. With double the capacity of the XG6, faster write speeds than the XG5-P, and a lower power envelope and smaller form factor than the data center-class XD5, the new XG6-P Series offers an additional M.2 NVMe storage option to further optimize client solutions or data center environments.

Designed with a future-ready NVMe revision 1.3a protocol, the XG6-P Series offers new NVMe based privacy and management features beneficial to both client and data center customers. These include sanitize operations, telemetry data and namespace management. Additionally, XG6-P SSDs offer enhanced security options including TCG Pyrite Version 1.0 support for Non-SED (Self-Encrypting Drive) configurations and TCG Opal Version 2.01 support for SED, as well as support for Block SID Authentication and digital signature.

The XG6-P SSD is available in a single-sided M.2 2280 (22 x 80mm) form factor and will begin sampling later next month.