Exar Corporation today announced a family of high-speed RS-485/RS-422 receivers that accommodate the complex demands of next generation high-speed serial communications designs. The XR33180, XR33181, XR33183, and XR33184 occupy a 3mm x 3mm footprint and feature 52Mbps data rates, fast 15ns propagation delay and 2ns maximum receiver skew. This family is best suited for high-performance […]
Connectivity
Bluetooth beacons feature rugged housings, stronger signals
Bluvision today announced new products that further strengthen their product suite and address the needs of Industrial IoT and the Industrial and Manufacturing sectors as a whole. The new products include – the Industrial BEEKS™ beacon with ruggedized housing, the BEEKS Plus LR [Long-Range] beacons – with over 0.6-mile radius, first-of-its-kind Directional Beamforming antenna and industry […]
Dual-band, low power MCU integrates three chips into one
Expanding the functionality of Internet of Things (IoT) networks, Texas Instruments today announced availability for mass production of the industry’s lowest-power dual-band wireless microcontroller (MCU) supporting Sub-1 GHz and Bluetooth® low energy connectivity on a single chip. As part of TI’s pin-to-pin and software compatible SimpleLink™ ultra-low power platform, the new SimpleLink dual-band CC1350 wireless […]
Chip makes secure connections to Amazon Web Services IoT cloud
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the industry’s first end-to-end security solution for Internet of Things (IoT) devices that connect to Amazon Web Services IoT (AWS IoT). Microchip and AWS collaborated to develop this integrated solution to help IoT devices quickly and easily comply with AWS’s […]
SSD controller optimized for next-gen slim computing devices
Marvell a world leader in storage, cloud infrastructure, Internet of Things (IoT), connectivity and multimedia semiconductor solutions, today announced the expansion of its solid-state drive (SSD) portfolio to include the 88NV1160 Non-Volatile Memory (NVM) Express DRAM-less SSD controller. Marvell’s 88NV1160 DRAM-less SSD controller provides the industry’s leading performance per Watt and up to 1600MB/s read […]
Eight, four-channel controllers for SSDs
Microsemi Corporation today announced the availability of its mainstream Flashtec NVM Express (NVMe)2108 eight channel and NVMe2104 four channel controllers, enabling leading enterprises and data centers worldwide to realize cost and power effective high capacity solid state drives (SSDs). The second generation PCIe devices extend Microsemi’s product line to mainstream capacity, performance, and power while maintaining architectural consistency […]
PCIe switch sports super-high density
Microsemi Corporation today announced the availability of its Switchtec PFX PCIe switch, providing the industry’s highest density, lowest power PCIe switch for data center, communications, defense and industrial applications. Using simple hardware configuration and advanced diagnostics and debug capabilities, the PFX enables PCIe solutions for a wide variety of systems from scalable JBOFs (just a bunch of flash) to general purpose applications […]
SSD controllers integrate DDR4 DRAM on chip
Microsemi Corporation announced the production release of its Flashtec NVM Express (NVMe)2032 and NVMe2016 controllers, enabling the world’s leading enterprises and data centers to realize the highest performance solid state drives (SSDs) utilizing next-generation NAND technologies. Providing the highest capacity, performance and reliability to store critical data, the devices are the industry’s first SSD controllers to integrate DDR4 DRAM, alleviating bottlenecks […]
High-speed, PLC input isolators handle up to 8 channels
Silicon Labs has introduced the industry’s first high-speed, multi-channel digital isolators designed to meet the demands of programmable logic controller (PLC) applications. The new Si838x PLC field input isolator family offers an unmatched combination of high-speed channels (up to 2 Mbps), exceptional channel integration (up to eight channels per device), bipolar input flexibility, high noise […]
BLE chips pull just 3.6 mA in transmit mode
Toshiba America Electronic Components, Inc. (TAEC) today introduced three new integrated circuits (ICs) that support Bluetooth® Low Energy (LE)1 ver.4.1 communications for Bluetooth Smart devices2, including wearable electronics, sensors and high-end coin battery-powered devices. At 3V supply voltage, the TC35678FSG, TC35678FXG, and TC35679FSG consume just under half the power of previous Toshiba products3 – in […]
