By Brian Hendren, Tektronix As semiconductor manufacturers start to reach the potential physical limits of shrinking process nodes, chip packaging is emerging to improve performance. Flip chip assembly remains the most popular method for interconnecting dies, but new advancements in silicon interposers are enabling 2.5D packaging architectures and, in turn, making 3D packaging possible. To […]
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Why advanced packaging is vital to the future of semiconductors
The cost and the physics of fitting more transistors in the space available are showing diminishing returns. The concept of “known good die” is much more difficult to quantify. For all the talk in the semiconductor industry about trying to reach 1.8 nm process nodes, advanced packaging and its impact on performance seems to be […]
ARM, GPU-based SBC controls robots, connects to cloud
JAGUAR SBC-RK3588-AMR is specifically designed for use in robust and reliable autonomous mobile robots (AMR). Typical applications include industrial automation, agriculture and horticulture, construction, retail intralogistics, and hospitality. JAGUAR features Rockchip’s high-end ARM-based SOC RK3588. A variety of interfaces allow the integration of a broad range of sensors, actuators, and communication modules such as high-resolution cameras, LiDAR, and ToF sensors. The […]
OCXOs provide up to GHz frequencies
Q-Tech Corporation announces the availability of the AXIOM line of ultra-low noise (ULN) oven-controlled crystal oscillators (OXCOs) designed and manufactured by the company’s German affiliate, AXTAL. Ultra-low close-in phase noise and noise floor enable higher resolution for radar systems, better quality and more transmissible information in communications systems, and higher accuracy and lower measurement limits […]
Chipset, network, module partnership brings LTE connectivity to IoT devices
Engineers designing IoT devices need to focus on the hardware and software for their device’s applications such as smart meters, logistics tracking devices, and so on. For many designers, connectivity is not their area of expertise. Soracom, a provider and SIM cards and eSIM devices for IoT, has partnered with Sony Semiconductor (formerly Altair) and […]
Optical NoC processor designed for domain-specific AI workloads
Lightelligence introduced a new big data interconnect paradigm with the launch of Hummingbird, the world’s first Optical Network-on-Chip (oNOC) processor designed for domain-specific artificial intelligence (AI) workloads. Hummingbird utilizes advanced vertically stacked packaging technologies to integrate a photonic chip and an electronic chip into one single package serving as the communications network for data centers […]
Switch and LNA modules deliver less than 1 dB noise
pSemi Corporation announced two multi-chip modules featuring dual-channel switches, the PE53230 for 3.3–3.8 GHz and the PE53231 for 3.5–4.0 GHz. Each module contains two switches and two LNAs for high and low band frequencies. The new module portfolio delivers the lowest noise figure in the industry, at less than 1 dB, enabling best-in-class receiver sensitivity […]
Relocker/redriver devices extend USB coverage up to 15 meters
Microchip Technology announces two new reclocker/redriver devices. The automotive EQCO510 and industrial EQCO5X31 reclocker/redriver devices extend USB coverage up to 15 meters for maximum reach and are compatible with the USB 3.2 Generation 1 SuperSpeed protocol. The EQCO510 and EQCO5X31 are USB reclocker/redriver devices that can send high-speed data signals with a rate of 5 Gbps […]
MPU combine 64-bit core with AI engine
STMicroelectronics has introduced the second generation of its STM32 MPUs (microprocessors), coming with a new architecture built upon the same ecosystem and raising performance and security for applications at the industrial and IoT edge. The first product line in this new generation, the STM32MP25, is available with single or dual 64-bit Arm Cortex-A35 cores running efficiently at […]
UWB chipset leverages ToA and 3D AoA
Samsung Electronics Co., Ltd. announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive, and Internet of Things (IoT) devices, offering precise distance and location information. Samsung also unveiled ‘Exynos Connect’, a new brand that consolidates its short-range wireless […]
