AVX Corporation released a new series of embedded Wi-Fi antennas designed to satisfy steadily increasing cross-market demand for smaller and thinner wireless products with superior signal sensitivity. The new W Series Embedded Wi-Fi Antennas offer a wide range of standard solutions with ultraminiature form factors, PCB or FPC antenna technologies capable of supporting single- and dual-band […]
Telecommunications
Smartphone chipset sports 5G modem, 4K HDR video capture
MediaTek unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera, and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line […]
Atomic clock works from 5 V, outputs CMOS-compatible signals
The new IQRB-4 bridges the gap between the 12 V powered IQRB-1, IQRB-2, and IQRB-3 and the recently released 3.3 V powered ICPT-1. IQD has been active in the frequency products market for over 45 years and in recent years developed its know-how to specialize in the field of atomic clocks. The company has invested […]
Eval kit helps wring out single-pair high-speed digital subscriber line apps
With the SHDSL standard, data can be transmitted over extremely long copper cables. This makes this technology the first choice in applications where Power over Ethernet and DSL technologies like G.FAST, VDSL are not possible. With its SHDSL Evaluation Kit, Würth Elektronik now offers developers the possibility to test applications with the SHDSL transceiver from Intel. […]
Low-power MEMS barometric pressure sensor targets drone, IoT apps
TDK Corporation announces the InvenSense ICP-20100 platform, the latest technology advancement in the SmartPressure product family. The ICP-20100 is a barometric pressure sensor based on MEMS capacitive technology, improving our lead in the development of ultra-low noise at the lowest power and progressing our industry-leading relative accuracy, sensor throughput, and temperature stability. The ICP-20100 achieves […]
ASIL-rate IMU optimized for autonomous vehicle apps
TDK Corporation announces the availability of the InvenSense IAM-20685, the latest release in the SmartAutomotive product family. The IAM-20686 is a new ASIL-B monolithic 6-axis MEMS IMU developed in compliance with ISO 26262. Taking advantage of TDK’s proprietary MEMS fabrication platform and technology, the IAM-20685 features a highly integrated single-chip 6-axis MEMS gyroscope and accelerometer […]
Automotive antenna-on-package mmWave radar sensor features 1-in-cube form factor
D3 Engineering announced their DesignCore RS-6843AOPUA mmWave Radar Sensor. This miniature automotive interior sensor enables the implementation of many different mmWave radar algorithms to measure, detect, and track. The production-intent unit features a 1-inch cube form factor, heat-spreading metal body, and mounting tabs. It may be used with a PC or embedded platform to facilitate […]
J-Link Remote Servers speed embedded system debugging
SEGGER announces that it now operates a worldwide network of J-Link Remote Servers, enabling a user to debug target systems from anywhere in the world at even higher speeds than before. The J-Link Remote Servers are available to every J-Link user at no cost. While using the closest server significantly increases communication speed, customers still […]
Secure FPGAs enable hardware root-of-trust, PFR, end-to-end supply chain security
The appeal of more connected devices is not lost on the bad actors look to exploit firmware vulnerabilities – more connected devices mean more entries of attack. Cyber resilient control functions as a way of protecting firmware must be the first line of defense as traditional cybersecurity measures struggle to keep up with the increasing […]
MCUs feature cap-touch sensing, low power consumption for HMI-based IoT apps
Renesas Electronics Corporation announced the expansion of its 32-bit RA2 Series microcontrollers (MCUs) with 20 new RA2L1 Group MCUs, increasing the RA Family to 66 MCUs. The general-purpose RA2L1 MCUs use the Arm Cortex-M23 core operating up to 48 MHz. The RA2L1 MCUs are supported by the easy-to-use Flexible Software Package (FSP) and Renesas’ partner ecosystem, […]
