ATEK Access Technologies (ATEK) has expanded its Datakey RUGGEDrive™ lineup with the introduction of the Industrial UFX Series. This new series enhances the RUGGEDrive range by offering USB flash drive capabilities designed for industrial applications. It features operation across industrial temperature ranges and the option for pSLC NAND flash for enhanced reliability. The Industrial UFX […]
Applications
Transceivers designed to power software-defined vehicles
Ethernovia, Inc. announced the sampling of a scalable family of automotive PHY transceivers that scale from 10 Gbps to 1 Gbps over 15 meters of automotive cabling at the industry’s lowest power, critical for software-defined vehicles (SDV) and to deliver the highest level of safety for the next generation of intelligent driving systems and data-rich […]
UBM controllers targeted at data canter and storage management applications
Microchip Technology has introduced the EEC1005-UB2 Universal Backplane Management (UBM) controller family, aimed at enhancing system versatility, ensuring standards-based operation, and offering cost savings in data center and storage applications. These generic and easily configurable UBM devices are designed for use on hard drive backplanes, facilitating storage enclosure management and communication with computing host systems […]
Multi-gigabit asymmetrical Ethernet devices target next-gen vehicles
AVIVA Links, Inc. announced the industry’s first family of multi-gigabit asymmetrical Ethernet devices based on the Automotive SerDes Alliance Motion Link Ethernet (ASA-MLE) draft specification. The new products include Ethernet PHYs, Switches, CSI-2 bridge ICs, and Zonal Aggregators, all of which are optimized for ultra-high bandwidth asymmetric video and control links. These devices are designed […]
JTAG probes support Renesas MPUs
The RZ/V2H is a single-chip MPU designed for next-generation robotics applications that require both vision AI and real-time control capabilities. With the integration of four Arm Cortex-A55 CPU cores, two Cortex-R8 cores, and one Cortex-M33 sub-core, the RZ/V2H can effectively manage both vision AI and real-time control tasks. SEGGER’s J-Link family of debug probes is […]
Strategic collaboration formed to bring intelligent rendering technologies to graphics-enabled MCUs
Infineon Technologies AG announces its strategic collaboration with Qt Group. This collaboration brings Qt’s lightweight, high-performance graphics framework to Infineon’s graphics-enabled TRAVEO T2G cluster microcontrollers and represents a paradigm shift in graphical user interface (GUI) development. Microcontrollers nowadays offer extensive graphical capabilities that enable compact designs, cost-efficiency, and lower power consumption. With features such as […]
Automotive SoC offers advanced security and communications for vehicle interfaces
Infineon Technologies AG has launched the new Automotive PSoC 4100S Max family. This microcontroller device family expands Infineon’s portfolio of CAPSENSE-enabled Human Machine Interface (HMI) solutions for automotive body/HVAC and steering wheel applications by delivering higher flash densities, GPIOs, CAN-FD, and HW-Security. The Automotive PSoC 4100S Max with fifth-generation CAPSENSE technology offering 10x higher sensitivity […]
Next-gen wireless chips set to meet upcoming cyber-protection standards
STMicroelectronics has revealed the next generation of its short-range wireless microcontrollers. These innovative, all-in-one components enable wearables and smart objects including smart home devices, health monitors, and smart appliances to become ever more miniaturized, easy to use, secure, and affordable. Short-range wireless technologies like Bluetooth LE, Zigbee and Thread (popular in smart meters and smart […]
What are the challenges when testing chiplets?
Chiplet testing begins with performance simulations during the design process. Compared with monolithic devices, heterogeneous chiplets require more complex testing, including known good die (KGD) testing, final test, and system level test. Success also depends on the implementation of design for test (DfT) based on several IEEE standards. Chiplet designers need high-speed tools that can […]
How can in-package optical interconnects enhance chiplet generative AI performance?
Generative artificial intelligence (AI) requires rapid and continuous movement of large amounts of data. In a growing number of instances, electrical input/output (I/O) connections between the ICs in chiplets are becoming a bottleneck to higher performance. Key electrical I/O performance barriers include power efficiency, bandwidth, and latency. This FAQ looks at the anticipated benefits of […]