Tria Technologies has launched two new Qseven (Q7) Computer-on-Modules (COMs), ensuring Q7 designs remain viable until at least 2034, with an optional extension to 2039. The new modules, TRIA-Q7-ASL and TRIA-Q7-ALN, are based on the popular Q7 entry-level standard and provide both a substantial performance boost and a guaranteed product lifetime extension, making Q7 a […]
Products
Dual-band Wi-Fi 6 MCUs target IoT
Renesas introduced the RA6W1 dual-band Wi-Fi 6 wireless MCU (datasheet) and announced the RA6W2 variant integrating Wi-Fi 6 + Bluetooth LE for always-connected IoT designs in smart home, industrial, medical, and consumer devices. Based on an Arm Cortex-M33 at 160 MHz with 704 KB SRAM, the devices support 2.4/5 GHz operation and low-power modes down to 200 nA–4 […]
DDR5 memory module supports up to 6400 MT/s
Penguin Solutions’SMART Modular DDR5 ECC CSODIMM is a 262-pin, 1.1 V clocked SODIMM (CKD-equipped) memory module specified up to 6400 MT/s (PC5-44800) with capacities of 16 GB, 32 GB, and 64 GB. It’s positioned for space-constrained systems such as industrial control, embedded/edge computing, and networking/telecom equipment where ECC and signal integrity at higher data rates […]
42 V I2C power monitors target portable device telemetry
Microchip Technology has introduced the PAC1711 and PAC1811 digital power monitors for battery-operated and energy-constrained systems that need continuous power measurement with minimal measurement overhead. Microchip states the devices consume about half the power of comparable solutions under typical operating conditions at a 1024 samples-per-second rate, while providing alert functions to reduce how often a […]
SOSA-aligned 3U VPX SBC adds 100GbE for defense systems
Acromag has introduced a 3U OpenVPX single board computer aligned to the Sensor Open Systems Architecture (SOSA) Technical Standard, targeting I/O-intensive embedded compute for defense, aerospace, and other deployed platforms. The board is available in air-cooled and conduction-cooled variants, supporting integration into VPX chassis with different thermal management requirements. Compute is provided by an Intel […]
Low-voltage BLE SoC targets glucose monitors and biosensor wearables
Nordic Semiconductor has introduced the nRF54LV10A, a Bluetooth LE system-on-chip designed for low-voltage, space-constrained healthcare wearables such as biosensors and continuous glucose monitors. The device operates from a 1.2 V to 1.7 V supply range and can be powered directly from a single silver-oxide coin cell, supporting compact power architectures for body-worn designs. The nRF54LV10A […]
Chip antennas let you add three Wi-Fi bands to IoT devices
Taoglas announced the expansion of its embedded antenna portfolio with a new range of Low Temperature Co-fired Ceramic (LTCC) chip antennas optimized for Wi-Fi 6/7, Ultra-Wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 deliver exceptional performance in ultra-compact packages – with minimal keep out area – designed for next-generation IoT, consumer, industrial, and wearable applications […]
Board offers 10 mm – 11 m ranging with configurable depth maps
MIKROE has introduced LightRanger 14 Click, an optical sensor add-on board that provides distance and depth measurement using direct time-of-flight technology. The board is intended for embedded systems that require 3D sensing, real-time ranging, or spatial awareness functions, such as people-counting equipment, autofocus mechanisms, robotics, and gesture-recognition systems. The design is based on the ams […]
Matter-compatible NFC tag supports cryptographic operations via energy harvesting
STMicroelectronics has introduced the ST25DA-C, a secure NFC chip designed for smart-home devices using the Matter 1.5 specification. The device supports NFC-based onboarding so that users can add lighting, access control products, cameras, or other IoT equipment to a home network by tapping a smartphone. The chip is the first commercial component aligned with recent […]
Compact module targets edge systems requiring on-device AI processing
congatec has introduced its first COM-HPC Mini computer-on-module based on Qualcomm Dragonwing IQ-X Series processors. The conga-HPC/mIQ-X uses the Qualcomm Oryon CPU and an integrated Hexagon NPU to support local AI workloads, including machine learning inference and large language model execution. The module delivers up to 45 TOPS of AI performance and is intended for […]
