Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility. Looking into the booming markets and scenarios ranging from surveillance to gaming, networking, and industrial uses, the growing demand for high-speed […]
Industrial
COMs feature latest high-performance Intel cores
congatec introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C, as well as COM Express Type 6 form factors, offer major performance gains and improvements […]
UWB SoC features ultra-low power use
Mauna Kea Semiconductors announced the closing of Series Pre-A+ funding totaling $12.8 million led by Lightspeed China Partners with participation by marquee investors Qiming Venture and Ivy Capital. Guided by its mission to enable ubiquitous high-precision sensing, MKSemi also launched its new product MK8000 system on a chip (SoC), the world’s lowest power, highest integrated chip solution, currently […]
COMs feature 12th-gen Intel Core processors
ADLINK Technology Inc. introduces the world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Client Type and COM Express Type 6. ADLINK COMs with the Intel 12th Gen Intel Core processor family (Codename: Alder Lake-H) allows for a unique design that can be adapted for single-thread or multithread performance. The […]
10/100/1000 base-T chip LAN transformer qualified for automotive uses
Bourns, Inc. released its automotive-grade Model SM453229A-381N7Y 10/100/1000 Base-T Chip LAN Transformer. Designed for maximum PCB layout flexibility, Bourns’ latest Chip LAN Transformer model is a low-profile discrete solution. It is also AEC-Q200 compliant featuring an expanded temperature range of 40 to +105 °C, is capable of Hi-Pot isolation of 1500 VAC/60 sec., and is able […]
Widescreen sunlight-readable display modules boast vivid colors, high brightness, responsive touch
Cincoze announces the launch of three new 16:9 widescreen sunlight-readable display modules in 15”, 21”, and 24” to extend the CRYSTAL product line of industrial PCs and monitors. The 16:9 widescreen sunlight-readable display modules boast vivid colors, high brightness, responsive touch, and industrial-grade rugged design. The CS-W115FHC modules are ideal for IoT and smart cities, […]
Embedded AI algorithm detects, alerts to cyber security intrusions in real-time
MicroAI announced MicroAI Security to help protect critical assets, IoT devices, and industrial and manufacturing systems from cyber security intrusions. MicroAI Security provides a revolutionary approach to mitigate these attacks, with an embedded AI algorithm that can detect, alert, and visualize cyber security intrusions in real-time, and runs directly on edge and endpoint connected devices. […]
Triple-band GNSS low-profile helical antenna features small form factor
Tallysman Wireless Inc. is announcing the low-profile triple-band HC997EXF to its industry-leading line of embedded helical GNSS antennas. The triple-band GNSS HC997EXF embedded helical antenna is designed for precise positioning, covering the GPS/QZSS-L1/L2/L5, GLONASS-G1/G2/G3, Galileo-E1/E5a/E5b, BeiDou-B1/B2/B2a, and NavIC-L5 frequency bands, including the satellite-based augmentation system (SBAS) available in the region of operation [WAAS (North America), EGNOS (Europe), MSAS […]
Versatile 6.5-in TFT display modules offer high optical performance
Display solutions and Review Display Systems (RDS) announced the availability of a new Tianma 6.5-inch TFT display module. The P0650VGF1MA00 features SFT (Super Fine TFT) technology which ensures exceptional optical performance, a 4:3 classic aspect ratio, and VGA (640 x 480 pixels) resolution. Tianma P-series displays are designed to provide reliable and consistent operation when […]
3D NAND chips offer remote secure firmware update option, extended lifetime for industrial uses
Swissbit has extended its range of miniaturized storage solutions with the launch of its EM-30 series with an e.MMC-5.1 standard interface. The BGA device uses industrial-grade 3D-NAND and is available in capacities from 16 to 256 GB. With the new series, Swissbit has responded to the increasing demands of embedded systems for ultra-small, vibration-resistant designs […]
