Embedded computing pioneer WINSYSTEMS today introduced a versatile data acquisition option for PCle/104 OneBank and PC/104 Express embedded computing systems. Its new PX1-I440-ADC module, scheduled for release in Q3 2020, extends capabilities for the company’s own single board computers, such as the Intel E3900-powered PX1-C415, as well as CPUs from other PC/104 suppliers. This space-efficient […]
Rugged rackmount chassis available for deeper OpenVPX and RF modules
Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers MIL-rugged rackmount enclosures that support deeper modules than the standard 160mm depth of OpenVPX. Many designers utilize OpenVPX or its general mechanicals for their designs. Combining advanced RF or other device capability into the standard-sized modules for the VITA 46/48 architecture is not […]
High-performance 64-bit ARC processor IP boosts performance by 3X
Synopsys announced the new DesignWare ARC HS5x and HS6x processor IP families for high-performance embedded applications. The 32-bit ARC HS5x and 64-bit HS6x processors, available in single-core and multicore versions, are implementations of a new superscalar ARCv3 Instruction Set Architecture (ISA) and deliver up to 8750 DMIPS per core in 16-nm process technologies under typical conditions, making them […]
Cisco-based mission computing systems optimized for rugged/harsh environments
Elma Electronic Inc. has expanded its line of Cisco-based mission computing systems used in rugged and harsh environments. Based on modular building blocks, the new ComSys-536x family utilizes Elma’s extensive packaging expertise to offer many performance and expansion configurations that meet specific computing-at-the-edge requirements. The Type 6 COM Express-based systems can be configured using a choice […]
PCB measures embedded application energy efficiency
Sundance Multiprocessor Technology Ltd has launched Lynsyn Lite, a low-cost power measurement tool for the development of embedded and customized low-energy computing (CLEC) systems that require a high degree of energy efficiency. Lynsyn Lite provides accurate measurement of a system’s energy consumption based on application behavior, significantly easing the time-consuming process of tracking down the […]
Embedded processor compilers get functional safety certification
Functional safety certifications are required in many industries, but it is often a time-consuming and expensive process. Certifications can also require extensive justification for using specific development tools, unless the tool is already certified for compliance by functional safety experts such as TÜV SÜD, a Munich-based certification organization. To this end, Microchip Technology Inc. announced TÜV […]
Low-power Arduino boards handle industrial temperature ranges
At CES 2020 Arduino announced the low-power new Arduino Portenta Family. Designed for demanding industrial applications, AI edge processing and robotics, it features a new standard for open high-density interconnect to support advanced peripherals. The first member of the family is the Arduino Portenta H7 module – a dual-core Arm Cortex-M7 and Cortex-M4 running at […]
OpenVPX chassis manager plugs into standard 3U VPX backplane slot
Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a chassis management module for OpenVPX that is compliant to the VITA 46.11 specification for system management. The SHM200 chassis manager for OpenVPX comes in 0.8” or 1.0” pitch sizes. The unit can plug into a standard 3U VPX backplane slot, with versions […]
The fundamentals of MCU-based hardware virtualization
Virtualization, a powerful technology concept commonly associated with high-end applications in servers, is coming to the microcontrollers featuring multiple execution domains via multiple CPUs with a lock-step mechanism. The microcontrollers that incorporate hardware-based virtualization-assisted functions mark a new integration milestone in the embedded design world. Moreover, by running multiple software components on a single MCU […]
Automotive Universal Flash Storage chips hold 512 GB
The industry’s first 512-gigabyte (GB) Automotive Universal Flash Storage (UFS) JEDEC Version 2.1 embedded memory solution supports a wide temperature range (-40 to +105°C), meets AEC-Q100 Grade24 requirements, and offers the extended reliability required by various automotive applications. The 512GB device joins the KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) lineup of Automotive UFS, […]
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