Infineon Technologies AG launched CIRRENT Cloud ID, a service that automates cloud certificate provisioning and IoT device-to-cloud authentication. The easy-to-use service extends the chain of trust and makes tasks easier and more secure from chip-to-cloud while lowering companies’ total cost of ownership. Cloud ID is ideal for cloud-connected product companies in the industrial, consumer, healthcare, […]
Software
Tool suite works with open-source automation servers
LDRA announced a plug-in that brings the capabilities of the LDRA tool suite into the Jenkins automation server for continuous integration (CI) for agile software development. Jenkins automates and manages the build process and connects build and version control systems with quality management and automated testing processes for large-scale system-level software projects. LDRA has long […]
SSDs add cybersecurity software
DIGISTOR announced its Series C secure SSDs, the first DIGISTOR SSDs to add Cigent D3E cybersecurity software. The new SSDs broaden the company’s comprehensive solutions and virtually eliminate the barrier to securing DAR with military-grade encryption for hardware and software. The company is debuting the C Series in the Trenton Systems booth (#2065) at the […]
SDK supports NXP MCUs
MikroElektronika has announced that its multi-architectural software development kit, mikroSDK 2.0, now supports 147 MCUs from NXP. mikroSDK is a collection of open-source software libraries with unified API and software development tools that makes application code portable and reusable on many different platforms and architectures, with virtually no code changes. The addition of NXP’s Kinetis family […]
IC place-and-route software boasts speedy runtime
Siemens Digital Industries Software announced that the latest release of its Aprisa physical design solution is now available. Aprisa 21.R1 has achieved major performance and technology advancements, including dramatic improvements in both runtime and memory footprint reductions. For customers, these enhancements can translate to lower design costs and faster time-to-market. The technology advancements available in […]
PCIe carrier card provides bus signals, cooling air to XMC mezzanine module
Acromag’s APCe8775 carrier card offers a simple and cost-effective solution that allows a PC to communicate with an XMC mezzanine module over a PCI Express (PCIe) bus. System developers can insert an Acromag FPGA module or other XMC module on the carrier card to perform a variety of signal processing functions. The APCe8775 3/4-length PCIe card is […]
IC platform integrates 3D design
The comprehensive, high-capacity 3D-IC platform from Cadence Design System integrates 3D design planning, implementation, and system analysis in a single, unified cockpit. The Integrity 3D-IC platform underpins Cadence’s third-generation 3D-IC solution, providing customers with system-driven power, performance, and area (PPA) for individual chiplets through integrated thermal, power, and static timing analysis capabilities. Chip designers creating […]
Software runs power integrity analysis for analog, digital, mixed-signal IC designs of any size
The new mPower power integrity software for analog, digital and mixed signal IC designs is the industry’s first and only IC power integrity verification solution to provide virtually unlimited scalability for analog, digital, and mixed signal ICs, enabling comprehensive power, electromigration (EM) and voltage drop (IR) analysis for even the largest IC designs. mPower software […]
Updated MIPI I3C basic simplifies designs, boosts speed
The MIPI Alliance announced the first update to its publicly available, royalty-free, MIPI I3C Basic specification. Version 1.1.1 dramatically enhances the speed and flexibility of I3C Basic, simplifying the development of innovative designs for products such as smartphones, wearables, and systems in automobiles and server environments. As the successor to the legacy I2C interface, MIPI I3C/I3C Basic provides a […]
Protocol analyzer test UniPro and UFS3.0 flash memory designs
Prodigy Technovations Pvt. Ltd introduces its PGY-UFS4.0-PA M-PHYSM, UniPro, UFS4.0 Protocol Analyzer for development and validation of next-generation flash memory UFS 4.0 at 23.2 Gbps per lane interface for 5G, Mobile, Automotive, IoT, AR/VR applications. PGY-UFS4.0-PA is the leading instrument that enables the design and test engineers to test the UniPro and UFS3.0 designs for […]
