STMicroelectronics has released KNX software for the S2-LP ultra-low-power radio transceiver to enable energy-saving standardized wireless connectivity for smart-building controls. Ready to run on an STM32* microcontroller (MCU) or alternatively on a BlueNRG-2 Bluetooth Low Energy System-on-Chip (SoC) that embeds an Arm Cortex-M0 core running at 32MHz and a comprehensive set of I/O peripherals, the software contains a certified KNX-RF stack, RF adaptation […]
Dual camera mezzanine for developing embedded vision applications
Avnet introduced the 96Boards ON Semiconductor Dual Camera Mezzanine development and prototyping platform for the AP1302 imaging processor coupled with dual imaging camera modules. This platform will enable design and system engineers to create cost-effective embedded vision applications utilizing industry-standard technologies. The two Imager Access System (IAS) camera modules that ship standard on this Mezzanine use […]
Unified electronic/photonic design platform speeds photonic IC design tasks
Synopsys, Inc. introduced its OptoCompiler solution for photonic integrated circuit (PIC) design, layout implementation and verification. OptoCompiler is the industry’s first unified electronic and photonic design platform, combining mature and dedicated photonic technology with Synopsys’ industry-proven electronic design tools and methods to enable engineers to produce and verify complex PIC designs quickly and accurately. By providing schematic-driven […]
USB-to-ARM debugger adds support for Raspberry Pi as host
Segger has introduced a version of its J-Link software specifically for Linux Arm. Aimed at industrial automation and other applications utilizing Raspberry Pi and other single board computing platforms, this new package contains all command-line versions of the software. It supports the same target devices and the full feature set encompassed in the already-established Windows, […]
Low-power GNSS IP speeds IoT modem development
Synopsys and Nestwave today announced a collaboration to combine Nestwave’s softcore GPS navigation IP with the Synopsys DesignWare ARC IoT Communications IP Subsystem for a complete low-power global navigation satellite systems (GNSS) solution for integration into IoT modems. The collaboration will provide designers with a power-efficient, high-accuracy GPS solution for battery-operated devices without the additional cost of […]
Spice, IC circuit design software gets 3-nm process certification
Mentor announced that TSMC has certified multiple Mentor product lines and tools for the foundry’s recently announced 3nm (N3) process technology. The Mentor offerings now certified for TSMC’s N3 process include the Analog FastSPICE Platform, which provides leading-edge circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory and custom digital circuits. Mentor has also […]
Linux software dev tools include static code analysis
IAR Systems announces an update of its build tools supporting implementation in Linux-based frameworks for automated application build and test processes. The latest version adds IARBuild for building IAR Embedded Workbench projects directly from the command line, enabling streamlined workflows from the developer environment to continuous integration. In addition, the tools now support the static […]
AI development tool supports MCU IoT algorithms
SensiML Corporation announced that its SensiML Analytics Toolkit now supports AI-based sensor algorithms running on the STEVAL-MKSBOX1V1 SensorTile.Box IoT kit from STMicroelectronics. This announcement builds on SensiML’s previous support of SensorTileV1 announcement in early January that the company had joined the STMicroelectronics Partner Program, enabling the two organizations to work together towards delivering complete AI-based […]
Multi-die IC design software keys on Chip-on-Wafer-on-Substrate efforts
Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler product for both silicon interposer based Chip-on-Wafer-on-Substrate (CoWoS-S) and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today’s complex multi-die systems for applications like high-performance computing (HPC), automotive and […]
Software handles 2D/2.5D/3D package/IC system design
Monozukuri S.p.A unveiled GENIO, the first commercially available IC/Package Co-Design Tool. The company said that it is able to take orders for GENIO now. GENIO is a fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design. Genio from Monozukuri is the first commercially-available integrated IC/Packaging co-design EDA tool. […]
- 1
- 2
- 3
- …
- 13
- Next Page »
